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    • 9. 发明授权
    • Use of a layout-optimization tool to increase the yield and reliability of VLSI designs
    • 使用布局优化工具来提高VLSI设计的产出和可靠性
    • US06941528B2
    • 2005-09-06
    • US10604962
    • 2003-08-28
    • Robert J. AllenJason D. HibbelerGustavo E. Tellez
    • Robert J. AllenJason D. HibbelerGustavo E. Tellez
    • G06F9/45G06F17/50
    • G06F17/5068
    • The invention provides a method and structure for optimizing placement of redundant vias within an integrated circuit design. The invention first locates target vias by determining which vias do not have a redundant via. Then, the invention draws marker shapes on or adjacent to the target vias. The marker shapes are only drawn in a horizontal or vertical direction from each of the target vias. The invention simultaneously expands all of the marker shapes in the first direction to a predetermined length or until the marker shapes reach the limits of a ground rule. During the expanding, different marker shapes will be expanded to different lengths. The invention determines which of the marker shapes were expanded sufficiently to form a valid redundant via to produce a first set of potential redundant vias and the invention eliminates marker shapes that could not be expanded sufficiently to form a valid redundant via.
    • 本发明提供了一种用于优化集成电路设计中的冗余通孔的布置的方法和结构。 本发明首先通过确定哪些通孔没有冗余通孔来定位目标通孔。 然后,本发明在目标通孔上或附近绘制标记物形状。 标记形状仅在每个目标通孔的水平或垂直方向绘制。 本发明同时将第一方向上的所有标记形状扩展到预定长度,或者直到标记形状达到接地规则的极限。 在扩展期间,不同的标记形状将被扩展到不同的长度。 本发明确定哪些标记形状被充分扩展以形成有效的冗余通路以产生第一组潜在的冗余通孔,并且本发明消除了不能充分扩展以形成有效的冗余通路的标记形状。
    • 10. 发明授权
    • Method and apparatus for manufacturing diamond shaped chips
    • 用于制造菱形芯片的方法和装置
    • US07961932B2
    • 2011-06-14
    • US11865728
    • 2007-10-01
    • Robert J. AllenJohn M. CohnScott W. GouldPeter A. HabitzJuergen KoehlGustavo E. TellezIvan L. WemplePaul S. Zuchowski
    • Robert J. AllenJohn M. CohnScott W. GouldPeter A. HabitzJuergen KoehlGustavo E. TellezIvan L. WemplePaul S. Zuchowski
    • G06K9/00
    • H01L27/0207
    • In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.
    • 在第一方面中,用于对晶片上的芯片进行成像的本发明的装置包括具有多个倾斜侧面的组合金刚石芯片图像和切口图像。 组合的金刚石芯片图像和切口图像包括金刚石芯片图像,其包括与金刚石芯片图像的至少一个对角线平行的多个芯片图像行,并且包括与金刚石芯片图像相邻的切痕图像。 切口图像包括平行于金刚石切片图像的至少一个对角线的至少一个切痕图像行。 该装置还包括从组合的金刚石片图像和切痕图像延伸到步进器的曝光场的至少周边的阻挡材料。 在第二方面,成像装置包括n侧多边形组合芯片图像和切口图像。 还提供了制造芯片的创造性方法和根据本发明方法制造的晶片。