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1. 发明授权

US07112463B2 Method for making devices using ink jet printing 有权
标题翻译：使用喷墨印刷制造装置的方法
公开(公告)号：US07112463B2
公开(公告)日：2006-09-26
申请号：US10713329
申请日：2003-11-13
申请人： Robert Horning , Thomas Ohnstein , Daniel Youngner
发明人： Robert Horning , Thomas Ohnstein , Daniel Youngner
IPC分类号： H01L21/00
CPC分类号： H01L21/00 , B41M3/006 , G02B5/201
摘要： Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
摘要翻译：提供了使用喷墨印刷来沉积各种微结构器件层的方法。可以使用这些技术形成各种微结构，包括例如许多形式的MEM结构以及其它结构。

2. 发明申请

US20070018532A1 METHOD FOR MAKING DEVICES USING INK JET PRINTING 审中-公开
标题翻译：使用喷墨印刷制造装置的方法
公开(公告)号：US20070018532A1
公开(公告)日：2007-01-25
申请号：US11534531
申请日：2006-09-22
申请人： Robert Horning , Thomas Ohnstein , Daniel Youngner
发明人： Robert Horning , Thomas Ohnstein , Daniel Youngner
IPC分类号： H02N1/00
CPC分类号： H01L21/00 , B41M3/006 , G02B5/201
摘要： Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
摘要翻译：提供了使用喷墨印刷来沉积各种微结构器件层的方法。可以使用这些技术形成各种微结构，包括例如许多形式的MEM结构以及其它结构。

3. 发明申请

US20050104911A1 Method for making devices using ink jet printing 有权
标题翻译：使用喷墨印刷制造装置的方法
公开(公告)号：US20050104911A1
公开(公告)日：2005-05-19
申请号：US10713329
申请日：2003-11-13
申请人： Robert Horning , Thomas Ohnstein , Daniel Youngner
发明人： Robert Horning , Thomas Ohnstein , Daniel Youngner
IPC分类号： B41M3/00 , G01S17/74 , G02B5/124 , G02B5/20 , B41J29/38
CPC分类号： H01L21/00 , B41M3/006 , G02B5/201
摘要： Methods for using ink-jet printing to deposit various layers of micro-structure devices are provided. A wide variety of micro-structures may be formed using these techniques including, for example, many forms of MEMs structures as well as other structures.
摘要翻译：提供了使用喷墨印刷来沉积各种微结构器件层的方法。可以使用这些技术形成各种微结构，包括例如许多形式的MEM结构以及其它结构。

4. 发明申请

US20050099254A1 Robotic member 失效
标题翻译：机器人会员
公开(公告)号：US20050099254A1
公开(公告)日：2005-05-12
申请号：US10712840
申请日：2003-11-12
申请人： Thomas Ohnstein , Daniel Youngner , Robert Horning
发明人： Thomas Ohnstein , Daniel Youngner , Robert Horning
IPC分类号： B25J9/06 , B25J18/06 , H02N1/00 , H01F7/08
CPC分类号： B08B9/045 , B25J9/06 , B25J9/065 , B25J18/06 , H02N1/006
摘要： An elongated robotic member that is simple in design and structure, relatively inexpensive and consumes little power. In one illustrative embodiment, one or more linear actuators are used in conjunction with two or more plates that are fixed at spaced locations along a spine member. Fixed between each pair of plates is one or more actuators, which when activated, pull or push corresponding portions of the plates towards or away from each other. This changes the relative orientation of the plate pairs, thus providing a bending movement. The spine preferably is flexible at least in the lateral direction, and bends in response to the relative movement of the plates. A number of plate pairs may be provided to create an arbitrarily long robotic member.
摘要翻译：一种细长的机器人构件，其设计和结构简单，相对便宜并且消耗很少的动力。在一个说明性实施例中，一个或多个线性致动器与两个或更多个板一起使用，两个或更多个板沿着脊柱构件固定在间隔开的位置。在每对板之间固定有一个或多个致动器，当致动器被致动时，拉动或推动板的相应部分朝向或远离彼此。这样会改变板对的相对方位，从而提供弯曲运动。脊柱优选至少在横向上是柔性的，并且响应于板的相对运动而弯曲。可以提供多个板对以产生任意长的机器人构件。

5. 发明授权

US06646364B1 MEMS actuator with lower power consumption and lower cost simplified fabrication 失效
公开(公告)号：US06646364B1
公开(公告)日：2003-11-11
申请号：US09613489
申请日：2000-07-11
申请人： Robert Horning , Burgess Johnson
发明人： Robert Horning , Burgess Johnson
IPC分类号： H02N100
CPC分类号： B81B3/0021 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C2201/019 , H02N1/006 , Y10T29/42 , Y10T29/49005 , Y10T29/49128 , Y10T29/49146 , Y10T29/49155 , Y10T156/1025
摘要： A microactuator device is disclosed that includes a plurality of generally parallel thin flexible sheets bonded together in a predetermined pattern to form an array of unit cells. Preferably, each of the sheets has only a single electrode layer located on one side of the sheet. Pairs of such sheets are then bonded together at spaced bonding locations with the electrode layers facing one another. Several sets of such sheet pairs can then be bonded together to form a microactuator device.

6. 发明申请

US20060110854A1 Methods and systems for providing MEMS devices with a top cap and upper sense plate 有权
公开(公告)号：US20060110854A1
公开(公告)日：2006-05-25
申请号：US11323233
申请日：2005-12-30
申请人： Robert Horning , Jeffrey Ridley
发明人： Robert Horning , Jeffrey Ridley
IPC分类号： H01L21/48 , H01L21/30
CPC分类号： B81B7/007 , B81B2201/0242 , B81C2203/0118
摘要： A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.

7. 发明申请

US20050050971A1 Methods and structure for improving wafer bow control 审中-公开
标题翻译：改善晶圆弓形控制的方法和结构
公开(公告)号：US20050050971A1
公开(公告)日：2005-03-10
申请号：US10894212
申请日：2004-07-19
申请人： Robert Horning
发明人： Robert Horning
IPC分类号： B81B3/00 , B81C1/00 , B32B9/00
CPC分类号： B81C1/00666 , B81C2201/0167 , Y10T74/12
摘要： A method for controlling bow in wafers which utilize doped layers is described. The method includes depositing a silicon-germanium layer onto a substrate, depositing an undoped buffer layer onto the silicon-germanium layer, and depositing a silicon-boron layer onto the undoped layer.
摘要翻译：描述了一种利用掺杂层在晶片中控制弓形的方法。该方法包括将硅 - 锗层沉积到衬底上，将未掺杂的缓冲层沉积到硅 - 锗层上，以及在未掺杂的层上沉积硅 - 硼层。

8. 发明申请

US20060201249A1 MEMS device with thinned comb fingers 有权
标题翻译：具有减薄梳齿的MEMS器件
公开(公告)号：US20060201249A1
公开(公告)日：2006-09-14
申请号：US11076193
申请日：2005-03-09
申请人： Robert Horning , Mark Weber , Burgess Johnson
发明人： Robert Horning , Mark Weber , Burgess Johnson
IPC分类号： G01P15/08
CPC分类号： H02N1/008
摘要： Methods of fabricating thinned comb MEMS devices are disclosed. A comb drive device in accordance with an illustrative embodiment of the present invention can include a number of interdigitated comb fingers some of which have a reduced thickness along at least a portion of their length relative to other comb fingers.
摘要翻译：公开了制造薄化梳状MEMS器件的方法。根据本发明的说明性实施例的梳状驱动装置可以包括多个叉指梳状梳，其中一些梳状指相对于其它梳指沿其长度的至少一部分具有减小的厚度。

9. 发明申请

US20060154443A1 Bonding system having stress control 失效
标题翻译：具有应力控制的接合系统
公开(公告)号：US20060154443A1
公开(公告)日：2006-07-13
申请号：US11031276
申请日：2005-01-07
申请人： Robert Horning
发明人： Robert Horning
IPC分类号： H01L21/477
CPC分类号： B81C3/001 , B81C2203/031
摘要： An approach where items of different temperatures are bonded to each other such that upon cooling down they contract in size resulting in zero residual stress between the bonded items at an ambient temperature. If materials of the bonded items have different thermal expansion coefficients and the items are put together at different bonding temperatures, then they may have insignificant residual stress upon cooling down to the ambient temperature (e.g., room temperature) because the different ranges of the temperature drops compensate for the different contractions.
摘要翻译：一种将不同温度的物品彼此粘合的方法，使得在冷却时，它们的尺寸收缩，导致在环境温度下粘合物品之间的零残余应力。如果粘合物料的材料具有不同的热膨胀系数，并且在不同的接合温度下将物品放在一起，则在冷却到环境温度（例如室温）时它们可能具有不显着的残余应力，因为温度的不同范围下降补偿不同的收缩。

10. 发明申请

US20050084998A1 Methods and systems for providing MEMS devices with a top cap and upper sense plate 有权
标题翻译：用于向MEMS器件提供顶盖和上感测板的方法和系统
公开(公告)号：US20050084998A1
公开(公告)日：2005-04-21
申请号：US10689801
申请日：2003-10-21
申请人： Robert Horning , Jeffrey Ridley
发明人： Robert Horning , Jeffrey Ridley
IPC分类号： B81B7/00 , B81C1/00 , H01L21/00
CPC分类号： B81B7/007 , B81B2201/0242 , B81C2203/0118
摘要： A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
摘要翻译：描述了一种用于制造具有顶盖和上感测板的MEMS器件的方法。该方法包括制造包括蚀刻的衬底，蚀刻的MEMS器件部件和互连金属的器件晶片，互连金属的一部分是接合焊盘，并将金属环绕层添加到前侧的边缘和一部分的器件晶片。该方法还包括制造包括蚀刻衬底和互连金属的上晶片，结合器件晶片和上晶片，以及将结合的上晶片和器件晶片切割成单个MEMS器件。

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