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1. 发明授权

US06773507B2 Apparatus and method for fast-cycle atomic layer deposition 有权
标题翻译：用于快速循环原子层沉积的装置和方法
公开(公告)号：US06773507B2
公开(公告)日：2004-08-10
申请号：US10215068
申请日：2002-08-07
申请人： Ravi Jallepally , Shih-Hung Li , Alain Duboust , Jun Zhao , Liang-Yuh Chen , Daniel A. Carl
发明人： Ravi Jallepally , Shih-Hung Li , Alain Duboust , Jun Zhao , Liang-Yuh Chen , Daniel A. Carl
IPC分类号： C30B2504
CPC分类号： C30B25/14 , C23C16/45521 , C23C16/45544 , C23C16/45565 , Y10T117/1008
摘要： Method and apparatus for depositing layers by atomic layer deposition. A virtual shower curtain is established between the substrate support and chamber to minimize the volume in which the reactants are distributed. A showerhead may be used to allow closer placement of the substrate thereto, further reducing the reaction volume. Zero dead space volume valves with close placement to the chamber lid and fast cycle times also improve the cycle times of the process.
摘要翻译：用于通过原子层沉积沉积层的方法和装置。在基板支撑件和室之间建立虚拟浴帘，以使反应物分布的体积最小化。可以使用喷头来使衬底更靠近放置，进一步减小反应体积。零静态空间体积阀具有紧密放置在室盖和快速循环时间，也提高了工艺的循环时间。

2. 发明授权

US06988942B2 Conductive polishing article for electrochemical mechanical polishing 失效
公开(公告)号：US06988942B2
公开(公告)日：2006-01-24
申请号：US10894756
申请日：2004-07-20
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

3. 发明授权

US06811680B2 Planarization of substrates using electrochemical mechanical polishing 失效
标题翻译：使用电化学机械抛光对基板进行平面化
公开(公告)号：US06811680B2
公开(公告)日：2004-11-02
申请号：US10038066
申请日：2002-01-03
申请人： Liang-Yuh Chen , Wei-Yung Hsu , Alain Duboust , Ratson Morad , Daniel A. Carl
发明人： Liang-Yuh Chen , Wei-Yung Hsu , Alain Duboust , Ratson Morad , Daniel A. Carl
IPC分类号： B23H506
CPC分类号： B23H5/08
摘要： A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.
摘要翻译：提供了一种用于平坦化衬底上的材料层的方法和装置。在一个方面，提供一种用于处理衬底的方法，包括在衬底表面上形成钝化层，在电解质溶液中抛光衬底，向衬底表面施加阳极偏压，以及从衬底的至少一部分去除材料表面。在另一方面，提供了一种装置，其包括部分外壳，抛光制品，阴极，电源，可移动地设置在抛光制品上方的基板载体，以及基于计算机的控制器，以将基板定位在电解质溶液中以形成在衬底表面上的钝化层，用抛光制品抛光电解质溶液中的衬底，并将阳极偏压施加到衬底表面或抛光制品上以从衬底表面的至少一部分去除材料。

4. 发明授权

US07311592B2 Conductive polishing article for electrochemical mechanical polishing 有权
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07311592B2
公开(公告)日：2007-12-25
申请号：US11556011
申请日：2006-11-02
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
摘要翻译：提供了一种用于平坦化基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。可以在抛光制品中形成多个穿孔，以使材料流过其中。电极还通过多个穿孔的至少一部分暴露于抛光表面。制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

5. 发明授权

US07066800B2 Conductive polishing article for electrochemical mechanical polishing 失效
公开(公告)号：US07066800B2
公开(公告)日：2006-06-27
申请号：US10033732
申请日：2001-12-27
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

6. 发明授权

US07137879B2 Conductive polishing article for electrochemical mechanical polishing 有权
公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

7. 发明申请

US20080038999A1 RETAINING RING WITH CONDUCTIVE PORTION 审中-公开
标题翻译：带导电部件的保持环
公开(公告)号：US20080038999A1
公开(公告)日：2008-02-14
申请号：US11865303
申请日：2007-10-01
申请人： Antoine Manens , Suresh Shrauti , Alain Duboust , Yan Wang , Liang-Yuh Chen
发明人： Antoine Manens , Suresh Shrauti , Alain Duboust , Yan Wang , Liang-Yuh Chen
IPC分类号： H01L21/302 , B24B5/00
CPC分类号： B23H5/08 , B24B37/32
摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
摘要翻译：描述了一种用于电化学机械加工的保持环。保持环具有形成有导电部分和非导电部分的大致环形体。非导电部分在抛光期间接触基板。导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

8. 发明申请

US20070187258A1 Method for electrochemically polishing a conductive material on a substrate 审中-公开
标题翻译：在基板上电化学研磨导电材料的方法
公开(公告)号：US20070187258A1
公开(公告)日：2007-08-16
申请号：US11355769
申请日：2006-02-15
申请人： Tianbao Du , Feng Liu , Alain Duboust , Wei-Yung Hsu , Liang-Yuh Chen
发明人： Tianbao Du , Feng Liu , Alain Duboust , Wei-Yung Hsu , Liang-Yuh Chen
IPC分类号： B23H5/00
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125
摘要： Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.
摘要翻译：提供了从衬底表面去除导电材料的方法。在一个方面，一种方法包括提供包括在衬底场区域之间形成的介电特征定义的衬底，设置在特征定义中的衬底场区域上的阻挡材料和设置在阻挡材料上的导电材料，以直流偏压去除导电材料的主体部分，并抛光衬底以用脉冲偏压去除导电材料的剩余部分。

9. 发明授权

US07229535B2 Hydrogen bubble reduction on the cathode using double-cell designs 失效
标题翻译：使用双电池设计在阴极上进行氢气还原
公开(公告)号：US07229535B2
公开(公告)日：2007-06-12
申请号：US10455861
申请日：2003-06-06
申请人： Yan Wang , Feng Q. Liu , Alain Duboust , Siew S. Neo , Liang-Yuh Chen , Yongqi Hu
发明人： Yan Wang , Feng Q. Liu , Alain Duboust , Siew S. Neo , Liang-Yuh Chen , Yongqi Hu
IPC分类号： C25F7/00 , B23H5/06 , C25F3/00 , C25F3/12 , C25F3/30 , B23H3/00
CPC分类号： B23H3/08 , B23H5/08 , B24B37/0056 , B24B37/044 , B24B37/046 , C09G1/04 , C25F3/02 , H01L21/32125 , H01L21/32134
摘要： An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of defects found on the substrate surface after polishing. An exemplary electrochemical apparatus includes a physical barrier that prevents any trapped gas or gas generated during processing from residing in areas that can cause defects on the substrate. The process can be aided by the addition of various chemical components to the electrolyte that tend to reduce the gas generation at the cathode surface during the ECMP anodic dissolution process.
摘要翻译：使用通过膜分离成两部分的室来平坦化基板的表面的装置和方法，以及两个单独的电解质。本发明的实施方案通常提供一种电化学机械抛光系统，其减少抛光后在基底表面上发现的缺陷数量。示例性电化学装置包括物理屏障，其防止在处理期间产生的任何捕获的气体或气体驻留在可能导致基板上的缺陷的区域中。该方法可以通过在电解质中添加各种化学成分来辅助，该电解质在ECMP阳极溶解过程期间倾向于减少阴极表面的气体产生。

10. 发明申请

US20070099552A1 CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHANICAL POLISHING 失效
标题翻译：带有离子交换膜的电化学机械电化学机械抛光
公开(公告)号：US20070099552A1
公开(公告)日：2007-05-03
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23F21/03
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

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