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1. 发明申请

US20080126863A1 Testing DRAM Chips with a PC Motherboard Attached to a Chip Handler by a Solder-Side Adaptor Board with an Advanced-Memory Buffer (AMB) 有权
标题翻译：用具有高级内存缓冲区（AMB）的焊接侧适配器板连接到芯片处理器的PC主板测试DRAM芯片
公开(公告)号：US20080126863A1
公开(公告)日：2008-05-29
申请号：US11309296
申请日：2006-07-24
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： G11C29/04 , G01R31/26 , G06F11/22
CPC分类号： G11C29/56 , G11C29/56016 , G11C2029/5602
摘要： Memory chips are tested by insertion into a chip test socket on a test adapter board that is mounted to the reverse or solder-side of a personal computer motherboard. A memory module socket is removed from the motherboard, and adapter pins are inserted into holes for the removed memory module socket, but from the reverse (solder) side of the motherboard. The adapter pins connect to the test adapter board either directly, through a connector plug, or through an intervening adapter board. The test adapter board has soldered onto it additional memory chips and buffer chips on a memory module, such as an Advanced Memory Buffer (AMB) for a fully-buffered memory module. The built-in-self-test (BIST) feature of the AMB may be used to test the memory chip under test in the chip test socket, or the processor on the motherboard may write and read the memory chip.
摘要翻译：通过插入到安装在个人计算机主板的反面或焊接侧的测试适配器板上的芯片测试插座来测试存储芯片。内存模块插座从主板上拆下，并将适配器插头插入拆卸的内存模块插槽的孔中，但插入主板背面（焊料）侧。适配器引脚直接连接到测试适配器板，通过连接器插头或插入适配器板。测试适配器板已经在内存模块上焊接了额外的存储器芯片和缓冲芯片，例如用于全缓冲存储器模块的高级存储器缓冲器（AMB）。 AMB的内置自检（BIST）功能可用于测试芯片测试插座中的待测内存芯片，或者主板上的处理器可能会写入和读取内存芯片。

2. 发明授权

US07131040B2 Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane 有权
标题翻译：通过背板隔离的热室的内存模块烧录系统中的可拆卸测试板上的歧管分布式气流
公开(公告)号：US07131040B2
公开(公告)日：2006-10-31
申请号：US10906318
申请日：2005-02-14
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： G11C29/00
CPC分类号： G01R31/2855 , G01R31/2863 , G01R31/31905 , G11C29/56 , G11C29/56004 , G11C29/56016 , G11C2029/2602
摘要： Hot air blown past memory modules under test in a heat chamber is improved. Hot air entering the chamber from an inlet pipe is split by a manifold and deflectors. Holes in the manifold allow for a relatively even air distribution within the chamber, minimizing temperature variations. Return air is collected by a heat-chamber bottom cover into a return pipe. A heating unit re-heats the return air and blows it into the inlet pipe. One side of the heat chamber is an insulated backplane. Memory modules are inserted into sockets on module motherboards, which are inserted into motherboard sockets on the backplane. On the other side of the backplane, card sockets receive pattern-generator cards outside the heat chamber but electrically connected to the module motherboards through the backplane. The pattern-generator cards exercise the memory modules. The pattern-generator cards are cooled while memory modules in the heat chamber are heated.
摘要翻译：改进了在热室中被测试的存储器模块的热空气。从入口管进入腔室的热空气被歧管和导流器分开。歧管中的孔允许室内相对均匀的空气分布，使温度变化最小化。返回空气由热室底盖收集回流管。加热单元重新加热回流空气并将其吹入入口管。加热室的一侧是绝缘背板。内存模块插入模块主板上的插座，插入背板主板插槽。在背板的另一侧，卡插座在加热室外部接收图案发生器卡，但通过背板电连接到模块主板。图案发生器卡练习内存模块。图案发生器卡被冷却，而加热室中的存储器模块被加热。

3. 发明授权

US07478290B2 Testing DRAM chips with a PC motherboard attached to a chip handler by a solder-side adaptor board with an advanced-memory buffer (AMB) 有权
标题翻译：使用带有高级内存缓冲区（AMB）的焊接侧适配器板，将PC主板与芯片处理器连接在一起测试DRAM芯片，
公开(公告)号：US07478290B2
公开(公告)日：2009-01-13
申请号：US11309296
申请日：2006-07-24
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： G11C29/00
CPC分类号： G11C29/56 , G11C29/56016 , G11C2029/5602
摘要： Memory chips are tested by insertion into a chip test socket on a test adapter board that is mounted to the reverse or solder-side of a personal computer motherboard. A memory module socket is removed from the motherboard, and adapter pins are inserted into holes for the removed memory module socket, but from the reverse (solder) side of the motherboard. The adapter pins connect to the test adapter board either directly, through a connector plug, or through an intervening adapter board. The test adapter board has soldered onto it additional memory chips and buffer chips on a memory module, such as an Advanced Memory Buffer (AMB) for a fully-buffered memory module. The built-in-self-test (BIST) feature of the AMB may be used to test the memory chip under test in the chip test socket, or the processor on the motherboard may write and read the memory chip.
摘要翻译：通过插入到安装在个人计算机主板的反面或焊接侧的测试适配器板上的芯片测试插座来测试存储芯片。内存模块插座从主板上拆下，并将适配器插头插入拆卸的内存模块插槽的孔中，但插入主板背面（焊料）侧。适配器引脚直接连接到测试适配器板，通过连接器插头或插入适配器板。测试适配器板已经在内存模块上焊接了额外的存储器芯片和缓冲芯片，例如用于全缓冲存储器模块的高级存储器缓冲器（AMB）。 AMB的内置自检（BIST）功能可用于测试芯片测试插座中的待测内存芯片，或者主板上的处理器可能会写入和读取内存芯片。

4. 发明授权

US07272774B2 Extender card for testing error-correction-code (ECC) storage area on memory modules 有权
标题翻译：扩展卡，用于在内存模块上测试纠错码（ECC）存储区
公开(公告)号：US07272774B2
公开(公告)日：2007-09-18
申请号：US10709156
申请日：2004-04-16
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： G11C29/00 , G06F11/00
CPC分类号： G11C29/24 , G06F11/2215 , G11C5/04 , G11C2029/5602
摘要： Memory modules with an extra dynamic-random-access memory (DRAM) chip for storing error-correction code (ECC) are tested on a personal computer (PC) motherboard tester using a cross-over extender card inserted into a memory module socket on the motherboard. ECC code generated on the motherboard is normally stored in the extra ECC DRAM chip, preventing test patterns such as checkerboards and walking-ones to be written directly to the ECC DRAM chip. During testing, the cross-over extender card routes signals from the motherboard for one of the data DRAM chips to the ECC DRAM chip, while the ECC code is routed to one of the data DRAM chips. The checkerboard or other test pattern is thus written and read from the ECC DRAM chip that normally stores the ECC code. The cross-over extender card can be hardwired, or can have a switch to allow normal operation or testing of the ECC DRAM chip.
摘要翻译：具有用于存储纠错码（ECC）的额外动态随机存取存储器（DRAM）芯片的存储器模块在个人计算机（PC）主板测试器上使用插入到内存模块插槽中的跨越延长卡进行测试母板。在主板上产生的ECC代码通常存储在额外的ECC DRAM芯片中，防止诸如棋盘和步行的测试图案直接写入ECC DRAM芯片。在测试期间，交叉扩展卡将来自主板的信号从数据DRAM芯片中的一个传送到ECC DRAM芯片，而ECC代码被路由到数据DRAM芯片之一。因此，棋盘或其他测试图案由通常存储ECC代码的ECC DRAM芯片写入和读出。交叉扩展卡可以是硬连线的，或者可以有开关来允许ECC DRAM芯片的正常操作或测试。

5. 发明授权

US06824410B1 Zero-insertion-force hinged clam-shell socket for testing memory modules 有权
标题翻译：用于测试存储器模块的零插入力铰链蛤壳式插座
公开(公告)号：US06824410B1
公开(公告)日：2004-11-30
申请号：US10709154
申请日：2004-04-16
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： H01R1362
CPC分类号： H01R12/88 , H01R2201/20
摘要： A test socket for testing memory modules requires little or no insertion force. A base holds a funnel-shaped guide that guides the edge of the memory module into a desired position. Two housing halves are connected to the base by one or more hinges. The housing halves pivot around the hinges to open and close the test socket. Linkages, springs, or solenoids move the housing halves. Metal contact pads on flexible membranes are attached to each housing half and clamp onto contact pads on an inserted memory module when the housing halves are closed. Scooped vise clamps can be used to pinch together the ends of the housing halves to close the test socket. More test sockets can be fitted into a smaller pitch using the scooped vise clamps since the solenoids are along the longer axis of the test socket.
摘要翻译：用于测试内存模块的测试插座很少或没有插入力。基座保持将存储器模块的边缘引导到期望位置的漏斗形引导件。两个壳体半部通过一个或多个铰链连接到基座。外壳半部围绕铰链枢转以打开和关闭测试插座。连杆，弹簧或螺线管移动外壳半部。柔性膜上的金属接触垫连接到每个壳体半部，并且当外壳半部封闭时，夹紧在插入的存储器模块上的接触垫上。捣实的虎钳夹具可用于将外壳半部的端部夹在一起以关闭测试插座。由于螺线管沿着测试插座的较长的轴线，所以使用舀起的虎钳夹具可以将更多的测试插座安装到更小的间距中。

6. 发明授权

US07111211B1 Efficient air-flow loop through dual burn-in chambers with removable pattern-generator boards for memory-module environmental testing 有权
标题翻译：通过带有可拆卸图形发生器板的双重老化室进行有效的气流回路，用于记忆模块环境测试
公开(公告)号：US07111211B1
公开(公告)日：2006-09-19
申请号：US11306753
申请日：2006-01-10
申请人： Ramon S. Co , Tat Leung Lai , David Sun
发明人： Ramon S. Co , Tat Leung Lai , David Sun
IPC分类号： G11C29/00 , G01R31/28 , G01R31/02
CPC分类号： G01R31/2855 , G01R31/2863 , G01R31/31905 , G11C29/56 , G11C29/56004 , G11C29/56016 , G11C2029/2602
摘要： Two heat chambers are placed side-by-side. Heated air is blown upward through a first chamber and downward through a second heat chamber. An upper heating unit has a blower and heater that heat air exiting the first chamber and blows the heated air into the top of the second chamber. A lower heating unit has a blower and heater that heat air exiting the second chamber and blows the heated air into the top of the first chamber. Air is circulated in a loop through the two heat chambers by the two heating units. Inefficiencies from return pipes are eliminated by using the second chamber. The heated air is blown past memory modules under test in a heat chamber that has an insulated backplane. Pattern-generator cards outside the heat chamber exercise the memory modules and are cooled while memory modules in the heat chamber are heated.
摘要翻译：两个热室并排放置。加热空气向上穿过第一室并向下通过第二加热室。上加热单元具有鼓风机和加热器，其加热从第一室排出的空气并将加热的空气吹入第二室的顶部。下加热单元具有鼓风机和加热器，其加热从第二室排出的空气并将加热的空气吹入第一室的顶部。空气通过两个加热单元通过两个加热室循环循环。通过使用第二室来消除回流管的低效率。被加热的空气在具有绝缘背板的加热室中被吹过被测试的存储器模块。加热室外的图案发生器卡锻炼存储器模块，并在加热室中的存储器模块被加热时被冷却。

7. 发明授权

US08396998B2 Memory-module extender card for visually decoding addresses from diagnostic programs and ignoring operating system accesses 有权
标题翻译：内存模块扩展卡，用于从诊断程序视觉上解码地址，忽略操作系统访问
公开(公告)号：US08396998B2
公开(公告)日：2013-03-12
申请号：US12965699
申请日：2010-12-10
申请人： Jerry N. Le , Ngoc V. Le , Tat Leung Lai , Ramon S. Co
发明人： Jerry N. Le , Ngoc V. Le , Tat Leung Lai , Ramon S. Co
IPC分类号： G06F3/00 , G06F5/00
CPC分类号： G06F11/273 , G11C11/406 , G11C29/56 , G11C2029/5602
摘要： A diagnostic extender card is plugged into a memory module socket on a personal computer (PC) motherboard. The extender card has a test socket that receives a memory module and an intercepting decoder chip that receives the chip-select (CS) from the motherboard that selects the memory module for access. When CS is activated, the intercepting decoder chip illuminates a visual indicator on the extender card, allowing a user to locate a memory module being accessed. The exact translation or mapping from logical addresses of test programs to physical addresses of the memory modules is not needed, since the visual indicator shows which memory module is really being accessed, regardless of proprietary address mapping by north bridge chips. Operating system memory accesses are filtered out by a counter that counts accesses during a period set by a timer. When the number of accesses exceeds a threshold, the visual indicator is lit.
摘要翻译：诊断扩展卡插入个人计算机（PC）主板上的内存模块插槽。扩展卡具有接收存储器模块的测试插座和从主板接收芯片选择（CS）的截取解码器芯片，其选择存储器模块进行访问。当CS被激活时，拦截解码器芯片照亮扩展卡上的视觉指示符，允许用户定位被访问的存储器模块。不需要将测试程序的逻辑地址到存储器模块的物理地址的精确翻译或映射，因为可视指示器显示了正在被访问的存储器模块，而不考虑北桥芯片的专有地址映射。操作系统存储器访问由在定时器设置的周期内对存取进行计数的计数器滤除。当访问次数超过阈值时，视觉指示灯亮起。

8. 发明授权

US07917327B2 Chip handler with a buffer traveling between roaming areas for two non-colliding robotic arms 有权
标题翻译：芯片处理程序与两个非碰撞机器人臂之间的漫游区域之间移动
公开(公告)号：US07917327B2
公开(公告)日：2011-03-29
申请号：US12831777
申请日：2010-07-07
申请人： Ramon S. Co , Tat Leung Lai , Calvin G. Leong
发明人： Ramon S. Co , Tat Leung Lai , Calvin G. Leong
IPC分类号： G06F19/00 , G06F17/40
CPC分类号： B25J9/1666 , B25J9/16 , G05B19/4182 , Y02P90/083
摘要： Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front position, a first robotic arm loads IC chips from an input tray or stacker into buffer cavities in the traveling buffer. The traveling buffer then moves along the x-tracks to the back position, where a second robotic arm moves chips from the traveling buffer to test boards for testing. After testing, the second robotic arm moves chips to a second traveling buffer, which then moves along tracks to a front position for unloading by the first robotic arm. Two traveling buffers may move on the same tracks in a loop. The buffer cavities in the traveling buffer move on internal tracks to expand and contract spacing and pitch between the front and back positions to match test-board pitch.
摘要翻译：两个机器人臂在测试台的分开的，不重叠的区域漫游，避免碰撞。移动缓冲器沿着前方位置和后方位置之间的x轨道移动。在前置位置，第一机器臂将IC芯片从输入托盘或堆叠器装载到行进缓冲器中的缓冲腔中。移动缓冲器然后沿x轨道移动到后部位置，其中第二机器人臂将芯片从行进缓冲器移动到测试板进行测试。在测试之后，第二机器人臂将芯片移动到第二行进缓冲器，然后第二移动缓冲器沿着轨道移动到前部位置，以由第一机器人臂卸载。两个移动缓冲器可以在循环中的相同轨道上移动。移动缓冲器中的缓冲腔在内部轨道上移动以在前后位置之间扩展和收缩间距和间距，以匹配测试板间距。

9. 发明申请

US20100274517A1 Chip Handler with a Buffer Traveling between Roaming Areas for Two Non-Colliding Robotic Arms 有权
标题翻译：具有缓冲器的芯片处理器在两个非碰撞机器人臂的漫游区域之间行进
公开(公告)号：US20100274517A1
公开(公告)日：2010-10-28
申请号：US12831777
申请日：2010-07-07
申请人： Ramon S. Co , Tat Leung Lai , Calvin G. Leong
发明人： Ramon S. Co , Tat Leung Lai , Calvin G. Leong
IPC分类号： G06F19/00 , G05B19/418
CPC分类号： B25J9/1666 , B25J9/16 , G05B19/4182 , Y02P90/083
摘要： Two robotic arms roam in separate, non-overlapping areas of a test station, avoiding collisions. A traveling buffer moves along x-tracks between a front position and a back position. In the front position, a first robotic arm loads IC chips from an input tray or stacker into buffer cavities in the traveling buffer. The traveling buffer then moves along the x-tracks to the back position, where a second robotic arm moves chips from the traveling buffer to test boards for testing. After testing, the second robotic arm moves chips to a second traveling buffer, which then moves along tracks to a front position for unloading by the first robotic arm. Two traveling buffers may move on the same tracks in a loop. The buffer cavities in the traveling buffer move on internal tracks to expand and contract spacing and pitch between the front and back positions to match test-board pitch.
摘要翻译：两个机器人臂在测试台的分开的，不重叠的区域漫游，避免碰撞。移动缓冲器沿着前方位置和后方位置之间的x轨道移动。在前置位置，第一机器臂将IC芯片从输入托盘或堆叠器装载到行进缓冲器中的缓冲腔中。移动缓冲器然后沿x轨道移动到后部位置，其中第二机器人臂将芯片从行进缓冲器移动到测试板进行测试。在测试之后，第二机器人臂将芯片移动到第二行进缓冲器，然后第二移动缓冲器沿着轨道移动到前部位置，以由第一机器人臂卸载。两个移动缓冲器可以在循环中的相同轨道上移动。移动缓冲器中的缓冲腔在内部轨道上移动以在前后位置之间扩展和收缩间距和间距，以匹配测试板间距。

10. 发明授权

US07509532B2 Robotic memory-module tester using adapter cards for vertically mounting PC motherboards 有权
标题翻译：机器人内存模块测试仪使用适配卡垂直安装PC主板
公开(公告)号：US07509532B2
公开(公告)日：2009-03-24
申请号：US10249841
申请日：2003-05-12
申请人： Ramon S. Co , Tat Leung Lai , David Da-Wei Sun
发明人： Ramon S. Co , Tat Leung Lai , David Da-Wei Sun
IPC分类号： G06F11/00
CPC分类号： G01R31/01 , G01R31/31713 , G01R31/31905 , G11C5/04 , G11C29/028 , G11C29/56 , G11C29/56016 , G11C2029/5004 , H05K1/141
摘要： A test system for testing memory modules uses vertically-mounted personal computer (PC) motherboards. Many test adaptor boards that contain test sockets for testing memory modules are mounted horizontally across a test bench. Each test adaptor board connects to a motherboard that tests the memory modules in the test sockets. The motherboard is mounted below and perpendicularly to the test adaptor board. The motherboard is modified to extend the memory bus to edge contact pads along an edge of the motherboard. An edge socket on the test adaptor board mates with the edge contact pads to make electrical connection. A robotic arm inserts a memory module into the test socket, allowing the vertically-mounted motherboard to execute programs to test the memory module.
摘要翻译：用于测试存储器模块的测试系统使用垂直安装的个人计算机（PC）主板。包含用于测试内存模块的测试插槽的许多测试适配器板水平安装在测试台上。每个测试适配器板连接到测试插槽中的内存模块的主板。主板安装在测试适配器板的下方并垂直。主板被修改为沿主板边缘将内存总线扩展到边缘接触焊盘。测试适配器板上的边缘插座与边缘接触垫匹配以进行电气连接。机器手臂将内存模块插入测试插座，允许垂直安装的主板执行程序来测试内存模块。

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