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    • 5. 发明授权
    • Method for manufacturing a thin-film transistor comprising a recombination center
    • 用于制造包括复合中心的薄膜晶体管的方法
    • US06727123B2
    • 2004-04-27
    • US09936041
    • 2001-12-18
    • Ichio YudasakaMitsutoshi MiyasakaPiero Migliorato
    • Ichio YudasakaMitsutoshi MiyasakaPiero Migliorato
    • H01L2100
    • H01L29/78696H01L21/2652H01L29/66757H01L29/78612
    • The present invention provides a thin-film transistor (TFT) and its production method which enables an arrangement restraining bipolar transistor type behavior, in order to stabilize saturation current and to provide a TFT that can improve reliability. The TFT includes a channel region facing a gate electrode through a gate insulating film, a source electrode connected to the channel region and a drain region connected to the channel region on the side opposite this source region are formed in a polycrystal semiconductor film that was patterned in island forms. In the channel region, a recombination center is formed for capturing a small number of carriers (holes) by introducing impurities, such as inert gases, metals, Group III elements, Group IV elements and Group V elements after a crystallization process is carried out on a semiconductor film 100.
    • 本发明提供一种薄膜晶体管(TFT)及其制造方法,其能够抑制双极晶体管类型的布置,以便稳定饱和电流并提供可提高可靠性的TFT。 TFT包括通过栅极绝缘膜面向栅电极的沟道区,连接到沟道区的源电极和与该源极相对侧的沟道区连接的漏极区域形成在图案化的多晶半导体膜中 在岛屿形式。 在通道区域中,通过引入杂质,如惰性气体,金属,III族元素,IV族元素和V族元素,形成复合中心,用于捕获少量载流子(空穴),结晶过程在 半导体膜100。
    • 9. 发明授权
    • Semiconductor device with memory function and method of manufacture
    • 具有记忆功能的半导体器件及其制造方法
    • US07221016B2
    • 2007-05-22
    • US10841544
    • 2004-05-10
    • Satoshi InouePiero Migliorato
    • Satoshi InouePiero Migliorato
    • H01L29/788
    • H01L29/66757H01L21/28282H01L29/4908H01L29/66833H01L29/7881
    • A TFT memory 11 is provided with a polysilicon layer 22, wherein each region of the source 22a, the channel 22b and the drain 22c are formed on a substrate 21, and gate oxide films (insulating films) 23 and 25 are formed on the polysilicon layer 22; and a plurality of silicon particles 24 for trapping the charge of injected carriers are placed between the gate oxide films 23 and 25. Specifically, the gate oxide films comprise a first gate oxide film 23 and a second gate oxide film 25 formed on the first gate oxide film 23; the plurality of silicon particles 24 are located between the first gate oxide film 23 and the second gate oxide film 25, and the first gate oxide film 23 is formed in an extremely thin thickness.
    • TFT存储器11设置有多晶硅层22,其中源极21a的每个区域,沟道22b和漏极22c形成在衬底21上,并且形成栅氧化膜(绝缘膜)23和25 在多晶硅层22上; 并且用于捕获注入载流子的电荷的多个硅颗粒24被放置在栅极氧化膜23和25之间。 具体地,栅极氧化膜包括形成在第一栅极氧化膜23上的第一栅极氧化膜23和第二栅极氧化膜25; 多个硅颗粒24位于第一栅极氧化膜23和第二栅极氧化膜25之间,并且第一栅极氧化物膜23形成为非常薄的厚度。