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    • 7. 发明申请
    • Low activation energy photoresists
    • 低活化能光刻胶
    • US20050124774A1
    • 2005-06-09
    • US10729169
    • 2003-12-04
    • Robert AllenGregory BreytaPhillip BrockRichard DipietroRatnam SooriyakumaranHoa TruongGregory Wallraff
    • Robert AllenGregory BreytaPhillip BrockRichard DipietroRatnam SooriyakumaranHoa TruongGregory Wallraff
    • C08F12/20G03F7/004G03F7/039
    • G03F7/0046G03F7/0397
    • Polymers containing an acetal or ketal linkage and their use in lithographic photoresist compositions, particularly in chemical amplification photoresists, are provided. The polymer is prepared from at least one first olefinic monomer containing an acetal or ketal linkage, the acid-catalyzed cleavage of which renders the polymer soluble in aqueous base; and at least one second olefinic monomer selected from (i) an olefinic monomer containing a pendant fluorinated hydroxyalkyl group RH, (ii) an olefinic monomer containing a pendant fluorinated alkylsulfonamide group RS, and (iii) combinations thereof. The acetal or ketal linkage may be contained within an acid-cleavable substituent RCL in the first olefinic monomer. A method for using the photoresist compositions containing these polymers in preparing a patterned substrate is also provided in which the polymer is rendered soluble in aqueous base at a temperature of less than about 100° C. by acid-catalyzed deprotection of pendent acetal- or ketal-protected carboxylic acid groups.
    • 提供了含有缩醛或缩酮键的聚合物及其在平版光刻胶组合物中的用途,特别是在化学放大光致抗蚀剂中。 聚合物由至少一种含有缩醛或缩酮键的第一烯属单体制备,其酸催化裂解使聚合物可溶于碱水溶液; 和至少一种第二烯烃单体,其选自(i)含有侧氟化羟烷基R H的烯烃单体,(ii)含有侧氟化烷基磺酰胺基R S的烯属单体, SUP),和(iii)其组合。 缩醛或缩酮键可以包含在第一烯烃单体中的酸可裂解取代基R CL中。 还提供了一种使用含有这些聚合物的光致抗蚀剂组合物来制备图案化基材的方法,其中聚合物在低于约100℃的温度下可溶于碱水溶液,通过酸催化的侧链缩醛或缩酮脱保护 保护的羧酸基团。
    • 9. 发明申请
    • Photoresists for visible light imaging
    • 用于可见光成像的光致抗蚀剂
    • US20060251989A1
    • 2006-11-09
    • US11125971
    • 2005-05-09
    • Gregory BreytaDaniel DawsonCarl LarsonGregory Wallraff
    • Gregory BreytaDaniel DawsonCarl LarsonGregory Wallraff
    • G03C1/00
    • G03F7/0392G03F7/001G03F7/031G03F7/2004Y10S430/115Y10S430/127
    • A class of lithographic photoresist combinations is disclosed which is suitable for use with visible light and does not require a post-exposure bake step. The disclosed photoresists are preferably chemical amplification photoresists and contain a photosensitizer having the structure of formula (I): where Ar1 and Ar2 are independently selected from monocyclic aryl and monocyclic heteroaryl, R1 and R2 may be the same or different, and have the structure —X—R3 where X is O or S and R3 is C1-C6 hydrocarbyl or heteroatom-containing C1-C6 hydrocarbyl, and R4 and R5 are independently selected from the group consisting of hydrogen and —X—R3, or, if ortho to each other, may be taken together to form a five- or six-membered aromatic ring, with the proviso that any heteroatom contained within Ar1, Ar2, or R3 is O or S. The use of the disclosed photoresists, particularly for the manufacture of holographic diffraction gratings, is also disclosed.
    • 公开了一类光刻抗蚀剂组合物,其适用于可见光并且不需要曝光后烘烤步骤。 所公开的光致抗蚀剂优选是化学放大光致抗蚀剂,并含有具有式(I)结构的光敏剂:其中Ar 1和Ar 2独立地选自单环芳基和单环杂芳基 R 1和R 2可以相同或不同,并且具有结构-XR 3,其中X是O或S,R“ SUP> 3是C 1 -C 6烃基或含杂原子的C 1 -C 6 N >烃基,R 4和R 5独立地选自氢和-XR 3 O 3,或者如果各自的邻位 另一个可以一起形成五元或六元芳环,条件是含有Ar 1,Ar 2或R 0的任何杂原子 > 3 是O或S.还公开了所公开的光致抗蚀剂的使用,特别是用于制造全息衍射光栅。