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    • 4. 发明申请
    • Photoresists for visible light imaging
    • 用于可见光成像的光致抗蚀剂
    • US20060251989A1
    • 2006-11-09
    • US11125971
    • 2005-05-09
    • Gregory BreytaDaniel DawsonCarl LarsonGregory Wallraff
    • Gregory BreytaDaniel DawsonCarl LarsonGregory Wallraff
    • G03C1/00
    • G03F7/0392G03F7/001G03F7/031G03F7/2004Y10S430/115Y10S430/127
    • A class of lithographic photoresist combinations is disclosed which is suitable for use with visible light and does not require a post-exposure bake step. The disclosed photoresists are preferably chemical amplification photoresists and contain a photosensitizer having the structure of formula (I): where Ar1 and Ar2 are independently selected from monocyclic aryl and monocyclic heteroaryl, R1 and R2 may be the same or different, and have the structure —X—R3 where X is O or S and R3 is C1-C6 hydrocarbyl or heteroatom-containing C1-C6 hydrocarbyl, and R4 and R5 are independently selected from the group consisting of hydrogen and —X—R3, or, if ortho to each other, may be taken together to form a five- or six-membered aromatic ring, with the proviso that any heteroatom contained within Ar1, Ar2, or R3 is O or S. The use of the disclosed photoresists, particularly for the manufacture of holographic diffraction gratings, is also disclosed.
    • 公开了一类光刻抗蚀剂组合物,其适用于可见光并且不需要曝光后烘烤步骤。 所公开的光致抗蚀剂优选是化学放大光致抗蚀剂,并含有具有式(I)结构的光敏剂:其中Ar 1和Ar 2独立地选自单环芳基和单环杂芳基 R 1和R 2可以相同或不同,并且具有结构-XR 3,其中X是O或S,R“ SUP> 3是C 1 -C 6烃基或含杂原子的C 1 -C 6 N >烃基,R 4和R 5独立地选自氢和-XR 3 O 3,或者如果各自的邻位 另一个可以一起形成五元或六元芳环,条件是含有Ar 1,Ar 2或R 0的任何杂原子 > 3 是O或S.还公开了所公开的光致抗蚀剂的使用,特别是用于制造全息衍射光栅。
    • 10. 发明申请
    • ADVANCED CHEMICALLY AMPLIFIED RESIST FOR SUB 30NM DENSE FEATURE RESOLUTION
    • 先进的化学放大电阻,用于30NM密度特征分辨率
    • US20070248908A1
    • 2007-10-25
    • US11380098
    • 2006-04-25
    • Wu-Song HuangDavid MedeirosGregory Wallraff
    • Wu-Song HuangDavid MedeirosGregory Wallraff
    • G03C1/00
    • G03F7/0392G03F7/38
    • The present invention discloses a chemically amplified (CA) resist composition for printing features having a dimension of about 30 nm or less and a method of forming a material structure having a pattern containing features having a dimension of about 30 nm or less by using the inventive CA resist. The CA resist composition comprises (a) about 1 to about 50 weight % of a copolymer, (b) about 0.02 to about 25 weight % of a photoacid generator, (c) about 47 to about 99 weight % of a solvent, and (d) about 0.004 to about 25 weight % of a base additive. The copolymer comprises at least one hydrophilic monomer unit containing one or more polar functional groups and at least one hydrophobic monomer unit containing one or more aromatic groups. Some, but not all, of the one or more polar functional groups in the copolymer are protected with acid labile moieties having a low activation energy.
    • 本发明公开了一种用于印刷尺寸为约30nm或更小的特征的化学放大(CA)抗蚀剂组合物,以及通过使用本发明形成具有尺寸为约30nm或更小的特征的图案的材料结构的方法 CA抗拒。 CA抗蚀剂组合物包含(a)约1至约50重量%的共聚物,(b)约0.02至约25重量%的光酸产生剂,(c)约47至约99重量%的溶剂和( d)约0.004至约25重量%的基础添加剂。 共聚物包含至少一个含有一个或多个极性官能团的亲水性单体单元和至少一个含有一个或多个芳族基团的疏水性单体单元。 共聚物中一个或多个极性官能团的一些但不是全部由具有低活化能的酸不稳定部分保护。