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    • 6. 发明申请
    • METHOD OF FABRICATING AN ELECTROMECHANICAL STRUCTURE INCLUDING AT LEAST ONE MECHANICAL REINFORCING PILLAR
    • 制造一个机械结构的机械结构的方法,包括一个机械增强支柱
    • US20090321887A1
    • 2009-12-31
    • US12488841
    • 2009-06-22
    • Vincent LarreyFrançois PerruchotBernard DiemLaurent ClavelierPhilippe Robert
    • Vincent LarreyFrançois PerruchotBernard DiemLaurent ClavelierPhilippe Robert
    • H01L21/30H01L23/58
    • H01L29/66007B81B2201/0264B81C1/00357B81C1/00682B81C2201/019H01L2924/0002H01L2924/00
    • The invention relates to a method of fabricating an electromechanical structure presenting a first substrate (1) including at least one layer (1′) of monocrystalline material covered in a sacrificial layer (2) that presents a free surface, the structure presenting at least one mechanical reinforcing pillar received in said sacrificial layer, the method being characterized in that it comprises: a) making at least one well region (51, 52) in the sacrificial layer (2) by etching, at least in the entire thickness of the sacrificial layer (2), the well region defining at least one said mechanical pillar; b) depositing a first functionalization layer (4, 31) of a first material, relative to which the sacrificial layer is suitable for being etched selectively, the functionalization layer (4) filling at least one well region (51) at least partially and covering the free surface of the sacrificial layer (2) at least around the well region(s); and b′) depositing a filler layer (6, 32) of a second material different from the first material for terminating the filling of the well region(s) (5′), said filler layer (6) covering the first functionalization layer (4) at least in part around the well region(s) (5′), and planarizing the filler layer (6, 32), the pillar(s) being formed by the superposition of at least the first material and the second material in the well region(s); and releasing the electromechanical structure by removing at least partially the sacrificial layer (2). The invention also relates to an electromechanical structure obtained by the method.
    • 本发明涉及一种制造机电结构的方法,所述机电结构呈现第一衬底(1),所述第一衬底(1)包括覆盖在呈现自由表面的牺牲层(2)中的至少一层单晶材料层(1'),所述结构呈现至少一个 所述方法的特征在于:其包括:a)至少在所述牺牲层的整个厚度中通过蚀刻在所述牺牲层(2)中制造至少一个阱区域(51,52) 层(2),所述阱区限定至少一个所述机械支柱; b)沉积第一材料的第一官能化层(4,31),所述第一材料相对于所述第一材料,所述第一材料相对于所述第一材料,所述牺牲层适于被选择性地蚀刻,所述官能化层(4)至少部分填充至少一个阱区域(51)并且覆盖 所述牺牲层(2)的至少围绕所述阱区域的自由表面; 和b')沉积与所述第一材料不同的第二材料的填充层(6,32),以终止所述阱区域(5')的填充,所述填充层(6)覆盖所述第一官能化层( 4)至少部分地围绕所述阱区域(5')周围,并且平坦化所述填充层(6,32),所述柱通过至少所述第一材料和所述第二材料的叠加形成 井区; 以及通过至少部分去除所述牺牲层(2)来释放所述机电结构。 本发明还涉及通过该方法获得的机电结构。
    • 10. 发明授权
    • MEMS/NEMS structure comprising a partially monocrystalline anchor and method for manufacturing same
    • 包括部分单晶锚的MEMS / NEMS结构及其制造方法
    • US07981715B2
    • 2011-07-19
    • US12498598
    • 2009-07-07
    • Philippe Robert
    • Philippe Robert
    • H01L21/00
    • B81C1/00039B81B2203/0307
    • The invention relates to a method for producing a MEMS/NEMS structure from a substrate made in a monocrystalline semiconductor material, the structure comprising a flexible mechanical element connected to the substrate by at least one anchoring zone, the method comprising the following steps: the formation of a protection layer on one face of the substrate, the protection layer being made in a monocrystalline material different from the material of the substrate, etching of the protection layer and the substrate in order to produce at least one cavity, the etching being done so as to leave an overhang made in the material of the protection layer on the edges of the cavity, filling in of the cavity with an electrically insulating material in order to obtain an insulating anchoring portion, epitaxy of a semiconductor material from the protection layer and the electrically insulating material in order to obtain a layer designed to produce the flexible mechanical element, liberation of the flexible mechanical element while allowing at least a portion of said overhang to remain.
    • 本发明涉及从由单晶半导体材料制成的衬底制造MEMS / NEMS结构的方法,该结构包括通过至少一个锚定区连接到衬底的柔性机械元件,该方法包括以下步骤:形成 在衬底的一个表面上的保护层,保护层制成不同于衬底的材料的单晶材料,蚀刻保护层和衬底以产生至少一个空腔,蚀刻是这样做的 为了在空腔的边缘留下在保护层的材料上产生的悬垂,用电绝缘材料填充空腔,以便获得绝缘锚固部分,从保护层和半导体材料的外延生长 电绝缘材料,以获得设计用于生产柔性机械元件的层,释放 柔性机械元件,同时允许所述突出部的至少一部分保留。