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    • 3. 发明申请
    • APPROACHES FOR DETECTING LEAKS IN A HARD-DISK DRIVE (HDD) COVER
    • 用于检测硬盘驱动器(HDD)盖中的泄漏的方法
    • US20120137751A1
    • 2012-06-07
    • US12961990
    • 2010-12-07
    • Charles A. BrownRyan Davis
    • Charles A. BrownRyan Davis
    • G01M3/20H01J49/00
    • G01M3/229H01J49/00
    • Approaches for a testing apparatus for evaluating a cover of a hard-disk drive. The testing apparatus may detect whether the cover has a defect that prevents the cover from being sufficiently airtight. The testing apparatus includes a base structure that comprises a concave recess shaped to receive the cover to be tested. When the cover is disposed within the concave recess, the cover forms a first chamber in the concave recess between the cover and the base structure. The testing apparatus also includes a removable lid. When the removable lid covers the concave recess with the cover disposed therein, the removable lid forms a second chamber in the concave recess between the cover, the base structure, and the removable lid. The testing apparatus also includes a means for introducing helium gas to one of the chambers and a means for detecting how much helium gas leaks from that chamber.
    • 用于评估硬盘驱动器的盖的测试装置的方法。 测试装置可以检测盖是否具有防止盖充分气密的缺陷。 测试装置包括基部结构,该基部结构包括成形为接收要测试的盖的凹形凹部。 当盖设置在凹形凹部内时,盖在盖和基部结构之间的凹形凹部中形成第一室。 测试装置还包括可拆卸盖。 当可拆卸的盖子覆盖设置在其中的盖的凹形凹部时,可移除的盖子在盖子,基部结构和可移除盖子之间的凹形凹部中形成第二室。 测试装置还包括用于将氦气引入到一个室中的装置,以及用于检测从该室泄漏多少氦气的装置。
    • 4. 发明授权
    • Cooking device
    • 烹饪设备
    • US5553531A
    • 1996-09-10
    • US361070
    • 1994-12-21
    • Charles A. Brown
    • Charles A. Brown
    • A47J27/04A47J27/14A47J37/10
    • A47J27/04A47J27/14
    • A multi-functional cooking device that combines a steamer, skillet, griddle, fryer, kettle and oven into a single unit. The cooking device has a hollow base and a hollow lid. The base and the lid mate to provide an enclosed space for heating food. Heating means are associated with the base, to heat the interior space. Means are provided for lifting the lid relative to the base, and for maintaining the lid at a set position relative to the base. The base is adapted to receive water, so that when it is heated, steam will be formed in the space enclosed by the lid and base. The lower edge of the lid is recessed, and receives in the recess the upper edge of the base, whereby the mating of the two edges provides a junction to maintain steam within the space formed by the lid and base. A mechanism is provided for tilting the base at a predetermined angle, to facilitate the use of the base for grilling or frying foods.
    • 一种多功能烹饪设备,将蒸笼,煎锅,平底锅,油炸锅,水壶和烤箱组合成一个单元。 烹饪装置具有中空基座和中空盖。 基座和盖子配合提供封闭的空间,用于加热食物。 加热装置与底座相连,以加热内部空间。 提供用于相对于基座提升盖子并且用于将盖子保持在相对于底座的设定位置的装置。 底座适于接收水分,因此当加热时,将在由盖子和底座包围的空间中形成蒸汽。 盖的下边缘凹陷,并且在凹部中容纳基部的上边缘,由此两个边缘的配合提供了连接处以将蒸汽保持在由盖和基部形成的空间内。 提供了用于以预定角度倾斜基座的机构,以便于使用基座进行烧烤或煎炸食物。
    • 9. 发明授权
    • Vapor drain system
    • 蒸气排放系统
    • US5346518A
    • 1994-09-13
    • US35999
    • 1993-03-23
    • Robert J. BasemanCharles A. BrownBenjamin N. EldridgeLaura B. RothmanHerman R. WendtJames T. YehArthur R. Zingher
    • Robert J. BasemanCharles A. BrownBenjamin N. EldridgeLaura B. RothmanHerman R. WendtJames T. YehArthur R. Zingher
    • B65D85/86B65G1/00H01L21/673H01L21/677B65B5/00B65D81/26B65D85/62F17C11/00
    • H01L21/67366B65G1/00H01L21/67393
    • During wafer fabrication, a transportable enclosure, such as a Standard Manufacturing InterFace (SMIF) pod encloses a nascent product, such as a semiconductor wafer, to protect the wafer against contamination during manufacture, storage or transportation. However chemical vapors emitted inside the pod can accumulate in the air and degrade wafers during subsequent fabrication. In order to absorb the vapors inside a closed pod, a vapor removal element typically including an activated carbon absorber, covered by a particulate-filtering vapor-permeable barrier, and covered by a guard plate with holes is disposed within the enclosure. A vapor removal element is disposed closely adjacent to each respective wafer. Alternatively, a single vapor removal element is located inside the enclosure. In certain instances, a fan or thermo-buoyant circulation causes any vapors located inside the enclosure to a vapor removal element for removal. Alternatively a porous vapor removal element may be disposed for removing vapors from air entering the enclosure. In another embodiment a vapor removal element is integrated with the back face of each wafer.
    • 在晶片制造期间,诸如标准制造界面(SMIF)的可移动外壳包围新生产品,例如半导体晶片,以在制造,存储或运输期间保护晶片免受污染。 然而,发射在荚内的化学气体可能积聚在空气中,并在随后的制造过程中降解晶片。 为了吸收封闭的容器内的蒸气,通常包括活性炭吸收器的蒸气去除元件被覆盖有颗粒过滤蒸气可透过的屏障并被具有孔的保护板覆盖。 蒸汽去除元件被设置为紧邻每个相应的晶片。 或者,单个蒸气去除元件位于外壳内。 在某些情况下,风扇或热浮动循环使得位于外壳内部的任何蒸气成为除去蒸气的元件。 或者,可以设置多孔蒸气去除元件以从进入外壳的空气中除去蒸汽。 在另一个实施例中,蒸气去除元件与每个晶片的背面一体化。