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1. 发明授权

US5346518A Vapor drain system 失效
标题翻译：蒸气排放系统
公开(公告)号：US5346518A
公开(公告)日：1994-09-13
申请号：US35999
申请日：1993-03-23
申请人： Robert J. Baseman , Charles A. Brown , Benjamin N. Eldridge , Laura B. Rothman , Herman R. Wendt , James T. Yeh , Arthur R. Zingher
发明人： Robert J. Baseman , Charles A. Brown , Benjamin N. Eldridge , Laura B. Rothman , Herman R. Wendt , James T. Yeh , Arthur R. Zingher
IPC分类号： B65D85/86 , B65G1/00 , H01L21/673 , H01L21/677 , B65B5/00 , B65D81/26 , B65D85/62 , F17C11/00
CPC分类号： H01L21/67366 , B65G1/00 , H01L21/67393
摘要： During wafer fabrication, a transportable enclosure, such as a Standard Manufacturing InterFace (SMIF) pod encloses a nascent product, such as a semiconductor wafer, to protect the wafer against contamination during manufacture, storage or transportation. However chemical vapors emitted inside the pod can accumulate in the air and degrade wafers during subsequent fabrication. In order to absorb the vapors inside a closed pod, a vapor removal element typically including an activated carbon absorber, covered by a particulate-filtering vapor-permeable barrier, and covered by a guard plate with holes is disposed within the enclosure. A vapor removal element is disposed closely adjacent to each respective wafer. Alternatively, a single vapor removal element is located inside the enclosure. In certain instances, a fan or thermo-buoyant circulation causes any vapors located inside the enclosure to a vapor removal element for removal. Alternatively a porous vapor removal element may be disposed for removing vapors from air entering the enclosure. In another embodiment a vapor removal element is integrated with the back face of each wafer.
摘要翻译：在晶片制造期间，诸如标准制造界面（SMIF）的可移动外壳包围新生产品，例如半导体晶片，以在制造，存储或运输期间保护晶片免受污染。然而，发射在荚内的化学气体可能积聚在空气中，并在随后的制造过程中降解晶片。为了吸收封闭的容器内的蒸气，通常包括活性炭吸收器的蒸气去除元件被覆盖有颗粒过滤蒸气可透过的屏障并被具有孔的保护板覆盖。蒸汽去除元件被设置为紧邻每个相应的晶片。或者，单个蒸气去除元件位于外壳内。在某些情况下，风扇或热浮动循环使得位于外壳内部的任何蒸气成为除去蒸气的元件。或者，可以设置多孔蒸气去除元件以从进入外壳的空气中除去蒸汽。在另一个实施例中，蒸气去除元件与每个晶片的背面一体化。

2. 发明申请

US20130080125A1 CONTINUOUS PREDICTION OF EXPECTED CHIP PERFORMANCE THROUHOUT THE PRODUCTION LIFECYCLE 有权
标题翻译：连续预测未来生产生活的预期芯片性能
公开(公告)号：US20130080125A1
公开(公告)日：2013-03-28
申请号：US13242692
申请日：2011-09-23
申请人： Robert J. Baseman , Amit Dhurandhar , Sholom M. Weiss , Brian F. White
发明人： Robert J. Baseman , Amit Dhurandhar , Sholom M. Weiss , Brian F. White
IPC分类号： G06F7/60
CPC分类号： G05B17/02 , G05B19/41875 , G05B2219/32075 , G05B2219/32194 , G05B2219/45031 , H01L22/20 , H01L2924/0002 , Y02P90/22 , H01L2924/00
摘要： A system, method and computer program product for predicting at least one feature of at least one product being manufactured. The system receives, from at least one sensor installed in equipment performing one or more manufacturing process steps, at least one measurement of the feature of the product being manufactured. The system selects one or more of the received measurement of the feature of the product. The system estimates additional measurements of the feature of the product at a current manufacturing process step. The system creates a computational model for predicting future measurements of the feature of the product, based on the selected measurement and the estimated additional measurements. The system predicts the future measurements of the feature of the product based on the created computational model. The system outputs the predicted future measurements of the feature of the product.
摘要翻译：一种用于预测正在制造的至少一种产品的至少一个特征的系统，方法和计算机程序产品。该系统从安装在执行一个或多个制造工艺步骤的设备中的至少一个传感器接收正在制造的产品的特征的至少一个测量。系统选择所接收到的产品特征的测量中的一个或多个。该系统估计在当前制造工艺步骤中产品的特征的附加测量。该系统基于所选择的测量和估计的附加测量，创建用于预测产品特征的未来测量的计算模型。该系统基于创建的计算模型预测未来产品特征的测量。系统输出产品特征的预测未来测量值。

3. 发明申请

US20120316818A1 SYSTEM FOR MONITORING MULTI-ORDERABLE MEASUREMENT DATA 审中-公开
标题翻译：监控多种测量数据的系统
公开(公告)号：US20120316818A1
公开(公告)日：2012-12-13
申请号：US13588534
申请日：2012-08-17
申请人： Robert J. Baseman , William K. Hoffman , Steven Ruegsegger , Emmanuel Yashchin
发明人： Robert J. Baseman , William K. Hoffman , Steven Ruegsegger , Emmanuel Yashchin
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B19/0428 , G05B19/4183 , G05B2219/31437 , G05B2219/31483 , G05B2219/33313 , Y02P90/10 , Y02P90/20
摘要： A computer-based measurement monitoring system and method for monitoring multi-stage processes capable of producing multi-orderable data and identifying, at any stage in the monitored process, unacceptable deviations from an expected value at particular stages of the process, and communicating same detected deviation to facilitate corrective action in the process. The system and method consolidate data obtained at various stages of the process, arrange the measurement data in a multi-orderable data framework, compare the multi-orderable framework data with expected parameter values corresponding to the various stages, and detects-unacceptable deviations from the expected values. The unacceptable deviations are communicated to responsible personnel, and the system and method provides same personnel with supplemental information useful in diagnosing the root cause of the problem leading to the detected deviations.
摘要翻译：一种基于计算机的测量监测系统和方法，用于监测能够产生多重数据的多级过程，并且在所监视的过程的任何阶段识别在该过程的特定阶段与期望值的不可接受的偏差，并且将所检测到的通信偏差以促进过程中的纠正措施。该系统和方法整合在该过程的各个阶段获得的数据，将测量数据排列在多个数据框架中，将多阶段框架数据与对应于各个阶段的预期参数值进行比较，并检测出与预期值。将不可接受的偏差传达给负责人员，系统和方法为相同的人员提供补充信息，这些补充信息有助于诊断导致检测到的偏差的问题的根本原因。

4. 发明授权

US08732627B2 Method and apparatus for hierarchical wafer quality predictive modeling 有权
标题翻译：分层晶圆质量预测模型的方法和装置
公开(公告)号：US08732627B2
公开(公告)日：2014-05-20
申请号：US13526152
申请日：2012-06-18
申请人： Robert J. Baseman , Jingrui He , Yada Zhu
发明人： Robert J. Baseman , Jingrui He , Yada Zhu
IPC分类号： G06F17/50
CPC分类号： G06Q10/04 , G05B19/41875 , Y02P90/22 , Y02P90/26
摘要： A method for performing enhanced wafer quality prediction in a semiconductor manufacturing process includes the steps of: obtaining data including at least one of tensor format wafer processing conditions, historical wafer quality measurements and prior knowledge relating to at least one of the semiconductor manufacturing process and wafer quality; building a hierarchical prediction model including at least the tensor format wafer processing conditions; and predicting wafer quality for a newly fabricated wafer based at least on the hierarchical prediction model and corresponding tensor format wafer processing conditions.
摘要翻译：一种用于在半导体制造过程中执行增强的晶片质量预测的方法包括以下步骤：获得包括张量格式晶片处理条件，历史晶片质量测量和与半导体制造工艺和晶片中的至少一个相关的先前知识中的至少一个的数据质量; 构建包括至少张量格式晶片处理条件的分级预测模型; 并且至少基于分层预测模型和对应的张量格式晶片处理条件来预测新制造的晶片的晶片质量。

5. 发明授权

US08594826B2 Method and system for evaluating a machine tool operating characteristics 失效
标题翻译：用于评估机床操作特性的方法和系统
公开(公告)号：US08594826B2
公开(公告)日：2013-11-26
申请号：US13608032
申请日：2012-09-10
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slonim , Hong Lin , Fateh A. Tipu , Adam D. Ticknor , Timothy M. McCormack
IPC分类号： G06F19/00
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.
摘要翻译：一种适用于制造环境的方法，系统和计算机程序产品，包括多个名义上相同的独立工具。计算设备生成从至少一个独立工具导出的过程跟踪数据的多维阵列，其中，所述阵列包括表示包括制造配方中的步骤列表的第一维度的数据和表示包括列表的第二维度的数据一组传感器从至少一个独立工具产生测量值。为了评估至少一个独立工具的至少一个操作特征，计算设备对多维阵列的至少一个预选子集进行分析。计算设备通过一组分层链接和可浏览的图形呈现分析结果。

6. 发明申请

US20130006406A1 METHOD AND SYSTEM FOR EVALUATING A MACHINE TOOL OPERATING CHARACTERISTICS 失效
标题翻译：用于评估机床工作特性的方法和系统
公开(公告)号：US20130006406A1
公开(公告)日：2013-01-03
申请号：US13608032
申请日：2012-09-10
申请人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
发明人： Ehud Aharoni , Robert J. Baseman , Ramona Kei , Oded Margalit , Kevin Mackey , Michal Rosen-Zvi , Raminderpal Singh , Noam Slomin , Hong Lin , Fateh Ali Tipu , Adam Daniel Ticknor , Timothy M. McCormack
IPC分类号： G05B19/18
CPC分类号： G05B23/0216 , G05B23/0229 , G05B2219/32191 , G05B2219/32194 , G05B2219/45031 , G05B2219/50065 , Y02P90/22 , Y02P90/86 , Y10T409/309408
摘要： A method, a system and a computer program product suitable for use in a manufacturing environment comprising a multiplicity of nominally identical independent tools. A computing device generates a multi dimensional array of process trace data derived from at least one of the independent tools, wherein, the array includes data representing a first dimension comprising a list of steps in a manufacturing recipe and data representing a second dimension comprising a list of a set of sensors generating measurements from at least one of the independent tools. The computing device conducts an analysis on at least one preselected subset of the multi dimensional array for the purpose of evaluating at least one operating characteristic of at least one of the independent tools. The computing device presents results of the analysis via a set of hierarchically linked and browseable graphics.
摘要翻译：一种适用于制造环境的方法，系统和计算机程序产品，包括多个名义上相同的独立工具。计算设备生成从至少一个独立工具导出的过程跟踪数据的多维阵列，其中，所述阵列包括表示包括制造配方中的步骤列表的第一维度的数据和表示包括列表的第二维度的数据一组传感器从至少一个独立工具产生测量值。为了评估至少一个独立工具的至少一个操作特征，计算设备对多维阵列的至少一个预选子集进行分析。计算设备通过一组分层链接和可浏览的图形呈现分析结果。

7. 发明申请

US20120330450A1 COMPREHENSIVE ANALYSIS OF QUEUE TIMES IN MICROELECTRONIC MANUFACTURING 有权
标题翻译：微电子制造中队列时间的综合分析
公开(公告)号：US20120330450A1
公开(公告)日：2012-12-27
申请号：US13604986
申请日：2012-09-06
申请人： Robert J. Baseman , Tomasz J. Nowicki
发明人： Robert J. Baseman , Tomasz J. Nowicki
IPC分类号： G06F17/50
CPC分类号： G06N99/005 , G06F2217/10
摘要： A system for determining a group of semiconductor manufacturing process steps with a similar influence on individual semiconductor products. The system generates a first table including time stamps for the individual semiconductor products. The system creates a second table including Q-times based on the first table. The Q-times refers to time differences between every pair of the time stamps. The system forms a dependency table by grouping the Q-times with similar dependencies together. The system identifies groups of the similar dependencies. The system extracts semiconductor process steps belonging to the groups.
摘要翻译：一种用于确定对各个半导体产品具有相似影响的一组半导体制造工艺步骤的系统。该系统产生包括各个半导体产品的时间戳的第一表。系统创建第二个表，其中包括基于第一个表的Q次。 Q时间是指每对时间戳之间的时差。系统通过将Q次与相似的依赖关系分组在一起来形成依赖关系表。系统识别类似依赖关系的组。系统提取属于这些组的半导体工艺步骤。

8. 发明申请

US20120215335A1 DETECTING COMBINED TOOL INCOMPATIBILITIES AND DEFECTS IN SEMICONDUCTOR MANUFACTURING 失效
标题翻译：检测组合工具不匹配和半导体制造中的缺陷
公开(公告)号：US20120215335A1
公开(公告)日：2012-08-23
申请号：US13030324
申请日：2011-02-18
申请人： Robert J. Baseman , Fateh A. Tipu , Sholom M. Weiss
发明人： Robert J. Baseman , Fateh A. Tipu , Sholom M. Weiss
IPC分类号： G06F17/00
CPC分类号： G05B19/41875 , Y02P90/22
摘要： A system, a method and a computer program product for identifying incompatible manufacturing tools. The system receives measurements of products that were subject to a manufacturing process involving a plurality of manufacturing tools. The measurements pertain to a performance characteristic of each product. The system evaluates whether each manufacturing tool implemented in a sequential manufacturing process individually performs normally based on the received measurements. In response to evaluating each manufacturing tool implemented in said manufacturing process individually performs normally, the system evaluates whether a first combination of the manufacturing tools together in sequential manufacturing process perform normally based on the received measurements. The system further evaluates performance of products generated by all other combinations of tools in the sequential manufacturing process not including the first combination of tools, and, using objective measures, identifies a combination of tools that perform optimally.
摘要翻译：用于识别不兼容的制造工具的系统，方法和计算机程序产品。该系统接收涉及多个制造工具的制造过程的产品的测量。测量值与每个产品的性能特征相关。系统评估在顺序制造过程中实现的每个制造工具是否基于所接收的测量单独地执行。响应于评估在所述制造过程中实现的每个制造工具单独地执行，系统评估在顺序制造过程中一起的制造工具的第一组合是否基于所接收的测量正常执行。该系统进一步评估在不包括工具的第一组合的顺序制造过程中所有其他工具组合产生的产品的性能，并且使用客观测量来确定最佳执行的工具的组合。

9. 发明申请

US20110284029A1 FOREIGN MATERIAL CONTAMINATION DETECTION 有权
标题翻译：外来物质污染检测
公开(公告)号：US20110284029A1
公开(公告)日：2011-11-24
申请号：US12783702
申请日：2010-05-20
申请人： Robert J. Baseman , Tomasz J. Nowicki
发明人： Robert J. Baseman , Tomasz J. Nowicki
IPC分类号： B08B7/04
CPC分类号： B08B13/00 , H01L21/67288 , Y10T436/11
摘要： There are provided a system, method and computer program product for detecting foreign materials in a semiconductor manufacturing process. The manufacturing process uses a plurality of semiconductor manufacturing tools. The system categorizes at least one monitoring wafer according to one or more categories. The system supplies the categorized monitoring wafer to a semiconductor manufacturing tool. The system observes a level of contamination on the categorized monitoring wafer. The system compares the level of contamination to a threshold. The system cleans the tool in a response to determining that the level of contamination is larger than the threshold. The system determines which category of the wafer leaves a highest level of contamination on the tool. The system identifies a root cause of the highest level of contamination on the tool.
摘要翻译：提供了一种用于在半导体制造工艺中检测异物的系统，方法和计算机程序产品。制造工艺使用多个半导体制造工具。该系统根据一个或多个类别对至少一个监视晶片进行分类。该系统将分类的监控晶片提供给半导体制造工具。该系统观察到分类监控晶片的污染程度。系统将污染水平与阈值进行比较。系统在响应中清洁工具以确定污染物的水平大于阈值。该系统确定哪个类别的晶片在工具上留下最高的污染水平。系统识别工具上最高污染水平的根本原因。

10. 发明申请

US20130338808A1 Method and Apparatus for Hierarchical Wafer Quality Predictive Modeling 审中-公开
标题翻译：分层晶片质量预测建模方法与装置
公开(公告)号：US20130338808A1
公开(公告)日：2013-12-19
申请号：US13559500
申请日：2012-07-26
申请人： Robert J. Baseman , Jingrui He , Yada Zhu
发明人： Robert J. Baseman , Jingrui He , Yada Zhu
IPC分类号： G06F19/00
CPC分类号： G06Q10/04 , G05B19/41875 , Y02P90/22 , Y02P90/26
摘要： An apparatus for performing enhanced wafer quality prediction in a semiconductor manufacturing process includes memory, for storing historical data relating to the semiconductor manufacturing process, and at least one processor in operative communication with the memory. The processor is operative: to obtain data including tensor format wafer processing conditions, historical wafer quality measurements and/or prior knowledge relating to at least one of the semiconductor manufacturing process and wafer quality; to build a hierarchical prediction model including at least the tensor format wafer processing conditions; and to predict wafer quality for a newly fabricated wafer based at least on the hierarchical prediction model and corresponding tensor format wafer processing conditions.
摘要翻译：用于在半导体制造工艺中执行增强的晶片质量预测的装置包括用于存储与半导体制造过程有关的历史数据的存储器以及与存储器可操作地通信的至少一个处理器。处理器可操作：获得包括张量格式晶片处理条件，历史晶片质量测量和/或与半导体制造工艺和晶片质量中的至少一个相关的先前知识的数据; 构建至少包括张量格式晶片处理条件的分层预测模型; 并且至少基于分级预测模型和对应的张量格式晶片处理条件来预测新制造的晶片的晶片质量。

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