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1. 发明授权

US06753477B1 Flatwire jumper patch 失效
标题翻译：扁线跳线贴片
公开(公告)号：US06753477B1
公开(公告)日：2004-06-22
申请号：US10426304
申请日：2003-04-30
申请人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
发明人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
IPC分类号： H01B708
CPC分类号： H01R12/613 , H05K1/141 , H05K3/222 , H05K3/363 , H05K2201/10363
摘要： A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.
摘要翻译：扁线组件包括一对细长的扁平线段，其与覆盖在段的相对的纵向端部之间的薄的柔性补片相互连接。贴片底面上的导电迹线通过焊料层电连接到片段的相应导电迹线，焊料层在热和压力下回流分别延伸经过贴片的边缘，于是可见地确认焊点贴片和片段的痕迹容易获得。在贴片和每个片段之间设置热激活或压敏粘合剂层，以在焊料回流期间进一步将贴片机械地耦合到每个片段。贴片衬底的纵向延伸部分通过粘合剂层粘合到比段焊接层延伸更远部分的相应部分，而焊料层延伸部提供增强的应变消除。

2. 发明授权

US5752851A Circuit clip connector 失效
标题翻译：电路夹连接器
公开(公告)号：US5752851A
公开(公告)日：1998-05-19
申请号：US596841
申请日：1996-02-05
申请人： Victor V. Zaderej , Michael G. Todd , Andrew Z. Glovatsky , Peter J. Sinkunas
发明人： Victor V. Zaderej , Michael G. Todd , Andrew Z. Glovatsky , Peter J. Sinkunas
IPC分类号： H01R4/48 , H01R12/62 , H05K1/14 , H05K3/32 , H05K3/36 , H01R9/07
CPC分类号： H01R12/62
摘要： A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.
摘要翻译：夹子连接器包括细长主体，从主体延伸的附接臂和用于施加从主体延伸的压力的突起。主体基本上是细长的，连接臂在每一端处一个。中间连接臂是多个突起，用于产生在其间具有空间并且适于与电导体对准的压力点，使得能够对电导体施加压力并且可以进行电连接。

3. 发明授权

US07009142B2 System and method for joining flat flexible cables 失效
标题翻译：用于连接扁平柔性电缆的系统和方法
公开(公告)号：US07009142B2
公开(公告)日：2006-03-07
申请号：US10850223
申请日：2004-05-20
申请人： Zhong-You (Joe) Shi , Peter J. Sinkunas
发明人： Zhong-You (Joe) Shi , Peter J. Sinkunas
IPC分类号： B23K26/00
CPC分类号： H05K3/363 , B23K1/0008 , B23K2101/38 , H05K3/3494 , H05K2201/0108 , H05K2201/0397 , H05K2203/107
摘要： A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.
摘要翻译：公开了一种用于互连扁平电缆的方法。扁平电缆具有连接到绝缘层的多个导体。该方法包括从第一和第二扁平电缆部分去除绝缘层以露出多个导体，将热板施加到暴露的第一扁平电缆部分的多个导体，将焊料施加到第一扁平电缆部分，在第一扁平电缆部分的多个导体上的第二扁平电缆部分的导体具有施加的焊料，在第一和第二扁平电缆部分上施加透明板，扫描通过透明板的激光束以在第一和第二扁平电缆部分之间回流焊料，第二扁平电缆部分。

4. 发明授权

US5794836A Inert gas air horn distribution device 失效
标题翻译：惰性气体喇叭分配装置
公开(公告)号：US5794836A
公开(公告)日：1998-08-18
申请号：US783720
申请日：1997-01-16
申请人： Jeff J. Lin , Peter J. Sinkunas , Myron Lemecha , Stephen H. P. Wong
发明人： Jeff J. Lin , Peter J. Sinkunas , Myron Lemecha , Stephen H. P. Wong
IPC分类号： B23K1/20 , H05K3/34 , B23K3/08
CPC分类号： B23K1/203 , B23K2201/42 , H05K3/3489
摘要： An inert gas air horn distribution device employs a labyrinth with a baffle to clean the nitrogen gas used to deposit flux on circuit boards before wave soldering operations. The baffle diverts the gas flow causing heavier flux particles to collect in the labyrinth while the lighter gas exits for use in depositing flux on the circuit boards. The labyrinth cleans the gas thereby keeping the knife clean which produces more uniform results with less maintenance.
摘要翻译：惰性气体空气喇叭分配装置在波峰焊接操作之前使用具有挡板的迷宫式清洁用于在电路板上沉积焊剂的氮气。挡板转移气流，导致较重的助焊剂颗粒收集在迷宫中，而较轻的气体离开以用于在电路板上沉积焊剂。迷宫清洁气体，从而保持刀具清洁，从而在维护较少的情况下产生更均匀的结果。

5. 发明授权

US06833526B2 Flex to flex soldering by diode laser 失效
标题翻译：通过二极管激光器弯曲焊接
公开(公告)号：US06833526B2
公开(公告)日：2004-12-21
申请号：US09820092
申请日：2001-03-28
申请人： Peter J. Sinkunas , Zhong-You Shi , Lawrence L. Bullock
发明人： Peter J. Sinkunas , Zhong-You Shi , Lawrence L. Bullock
IPC分类号： B23K2600
CPC分类号： H01R12/61 , B23K1/0056 , B23K2101/42 , H01R43/0221 , H05K3/3484 , H05K3/363 , H05K2203/0545 , H05K2203/107
摘要： A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.
摘要翻译：一种通过二极管激光焊接柔性电路的方法。提供由聚合物柔性基板构成的第一和第二柔性电路。每个柔性电路具有顶部和底部侧面以及嵌入其表面中的至少一个接触迹线。在至少一个柔性电路的接触迹线上提供焊料区域，并且柔性电路被定位成使得每个柔性电路的接触迹线基本对齐。定位激光束以加热接触迹线以熔化焊料并熔合接触。

6. 发明授权

US4942997A Solder flow well for reflowing solder of multipin components 失效
标题翻译：焊锡流动良好，用于回流多层组件焊料
公开(公告)号：US4942997A
公开(公告)日：1990-07-24
申请号：US92799
申请日：1987-09-03
申请人： Peter J. Sinkunas , Rodney L. Ritter , James E. Altpeter
发明人： Peter J. Sinkunas , Rodney L. Ritter , James E. Altpeter
IPC分类号： B23K3/06 , H05K3/34 , H05K13/04
CPC分类号： H05K13/0486 , B23K3/0646 , H05K3/3468 , H05K2201/10689 , H05K2203/0763 , H05K3/3447
摘要： A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed within or adjacent the through hole pattern.
摘要翻译：一种焊料阱，其构造成邻接并围绕印刷电路板上的通孔图案，以允许焊料的回流和去除多分子电子部件，而不影响设置在通孔图案内或附近的部件的相邻焊点的完整性。

7. 发明授权

US07026582B2 Vector transient reflow of lead free solder for controlling substrate warpage 失效
标题翻译：用于控制基板翘曲的无铅焊料的矢量瞬态回流
公开(公告)号：US07026582B2
公开(公告)日：2006-04-11
申请号：US10431258
申请日：2003-05-07
申请人： Lakhi N. Goenka , Peter J. Sinkunas , Larry N. Schmidt , Sherwin T. Moss
发明人： Lakhi N. Goenka , Peter J. Sinkunas , Larry N. Schmidt , Sherwin T. Moss
IPC分类号： F27D11/00 , F27B9/06 , B23K31/02
CPC分类号： H05K3/3494 , B23K1/008 , B23K3/0478 , H05K2203/0557 , H05K2203/081 , H05K2203/111
摘要： A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.
摘要翻译：公开了一种用于回流无铅焊料以将多个电子部件互连到基板的系统和方法。该系统包括用于预热基底和设置在其上的多个电子部件的烘箱和设置在烘箱中的补充热源，用于提供额外的热能以回流焊料。

8. 发明授权

US5514414A Solvent-less vapor deposition apparatus and process for application of soldering fluxes 失效
标题翻译：无溶剂气相沉积设备及其助焊剂的应用方法
公开(公告)号：US5514414A
公开(公告)日：1996-05-07
申请号：US343072
申请日：1994-11-21
申请人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
发明人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
IPC分类号： B23K1/015 , B23K35/36 , B23K35/38 , H05K3/34 , C23C14/00
CPC分类号： B23K35/3618 , B23K1/015 , H05K3/3489 , B23K2201/42 , B23K35/386
摘要： Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
摘要翻译：将无焊剂的通量蒸汽冷凝到待焊接的工件表面上的装置和方法，例如电子电路板。通过将液体中的通量加热到大于工作表面的温度的温度来产生通量蒸气。助焊剂施加到工作表面，而不使用任何挥发性有机化学品。

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