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1. 发明授权

US5514414A Solvent-less vapor deposition apparatus and process for application of soldering fluxes 失效
标题翻译：无溶剂气相沉积设备及其助焊剂的应用方法
公开(公告)号：US5514414A
公开(公告)日：1996-05-07
申请号：US343072
申请日：1994-11-21
申请人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
发明人： Guilian Gao , Peter J. Sinkunas , Brenda J. Nation , Myron Lemecha , Lawrence Kneisel
IPC分类号： B23K1/015 , B23K35/36 , B23K35/38 , H05K3/34 , C23C14/00
CPC分类号： B23K35/3618 , B23K1/015 , H05K3/3489 , B23K2201/42 , B23K35/386
摘要： Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
摘要翻译：将无焊剂的通量蒸汽冷凝到待焊接的工件表面上的装置和方法，例如电子电路板。通过将液体中的通量加热到大于工作表面的温度的温度来产生通量蒸气。助焊剂施加到工作表面，而不使用任何挥发性有机化学品。

2. 发明授权

US07070229B2 Underhood electronic interior integration 失效
标题翻译：冥想电子内部整合
公开(公告)号：US07070229B2
公开(公告)日：2006-07-04
申请号：US10371465
申请日：2003-02-21
申请人： Andrew Glovatsky , Jay Baker , Myron Lemecha , Lawrence Kneisel
发明人： Andrew Glovatsky , Jay Baker , Myron Lemecha , Lawrence Kneisel
IPC分类号： B62D25/08
CPC分类号： B60R16/0207 , B62D25/081
摘要： An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.
摘要翻译：电子系统通常包括扁平电子站点和将扁线电子站点电连接到发动机室中的电子设备的扁平总线。扁线电子站点具有柔性基板，电子元件附接到基板上用于电子设备的操作。扁线电子站点安装在舱壁的乘客位置进行热冷却，同时防止发动机舱的恶劣环境。隔板具有一个孔口，其尺寸允许扁线总线通过舱壁进入发动机舱室。通过使用扁线总线，该孔径尺寸小，并且提高了隔板的完整性。

3. 发明授权

US07372176B2 Bulkhead flatwire integration units 失效
标题翻译：隔板扁线整合单元
公开(公告)号：US07372176B2
公开(公告)日：2008-05-13
申请号：US10371773
申请日：2003-02-21
申请人： Lawrence Kneisel , Myron Lemecha , Andrew Glovatsky
发明人： Lawrence Kneisel , Myron Lemecha , Andrew Glovatsky
IPC分类号： H02B1/20 , H02B1/04 , H02B1/26 , H05K5/03 , H05K1/09 , H05K1/11 , H05K1/14 , B60L1/00 , H02G3/02
CPC分类号： B60R16/0239
摘要： The electronic system generally includes an electronic panel having circuitry plated on a surface thereof as well as electronic components attached thereto. The circuitry connects the electronic components for operation of the electronic device in the engine compartment. A flatwire bus electronically connects the electronic panel and the electronic device in the engine compartment for transmitting signals there between. The electronic panel is directly connected to the bulkhead.
摘要翻译：电子系统通常包括具有电镀在其表面上的电路的电子面板以及附接到其上的电子部件。电路连接电子元件，用于操作发动机舱中的电子设备。扁线总线电子地连接电子面板和发动机室中的电子设备，用于在其间传输信号。电子面板直接连接到舱壁。

4. 发明授权

US06807060B2 Underhood electronic integration 失效
标题翻译：冥想电子整合
公开(公告)号：US06807060B2
公开(公告)日：2004-10-19
申请号：US10371531
申请日：2003-02-21
申请人： Andrew Glovatsky , Myron Lemecha , Lawrence Kneisel , Brenda Nation
发明人： Andrew Glovatsky , Myron Lemecha , Lawrence Kneisel , Brenda Nation
IPC分类号： H05K720
CPC分类号： B60R16/0239 , H05K1/189 , H05K3/0058 , H05K7/20854
摘要： An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site and an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the engine side of the bulkhead for thermal cooling of the flatwire electronic site. A cover is attached to the bulkhead which encloses a flatwire electronic site for environmental protection.
摘要翻译：电子系统通常包括扁线电子站点和电线连接扁线电子站点和发动机舱中的电子设备的扁线总线。扁线电子站点具有柔性基板，电子元件附接到基板上用于电子设备的操作。扁平电子部件安装在隔板的发动机侧，用于对扁钢电子部件进行热冷却。舱壁上附有一个盖子，其中包围一个用于环境保护的扁线电子站点。

5. 发明申请

US20060186535A1 Semi-conductor die mount assembly 审中-公开
标题翻译：半导体模具安装组件
公开(公告)号：US20060186535A1
公开(公告)日：2006-08-24
申请号：US11063916
申请日：2005-02-23
申请人： Jay Baker , Lawrence Kneisel , Prathap Reddy
发明人： Jay Baker , Lawrence Kneisel , Prathap Reddy
IPC分类号： H01L23/34
CPC分类号： H01L23/49833 , H01L23/3677 , H01L33/641 , H01L33/647 , H01L2924/0002 , H01L2924/00
摘要： A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of pads. A first pad of the first set of pads is connected to a second pad of the second set of pads through a plurality of vias. The vias comprise an electrically and thermally conductive material that connect the first pad to the second pad through a substrate.
摘要翻译：提供了包括半导体管芯和管芯安装件的管芯安装组件。半导体管芯可以是发光二极管管芯，其附接到形成电和热连接的管芯安装件。管芯安装件包括第一组焊盘和第二组焊盘。第一组焊盘的第一焊盘通过多个通孔连接到第二组焊盘的第二焊盘。通孔包括导电和导热材料，其通过基底将第一焊盘连接到第二焊盘。

6. 发明申请

US20050017920A1 Light weight portable phased array antenna 有权
公开(公告)号：US20050017920A1
公开(公告)日：2005-01-27
申请号：US10624040
申请日：2003-07-21
申请人： Lawrence Kneisel , Jay Baker , Bernard Meyer , Andrew Glovatsky
发明人： Lawrence Kneisel , Jay Baker , Bernard Meyer , Andrew Glovatsky
IPC分类号： H01Q1/08 , H01Q1/12 , H01Q1/27 , H01Q1/32 , H01Q3/26 , H01Q15/14 , H01Q21/00 , H01Q21/06 , H04B10/00
CPC分类号： H01Q1/08 , H01Q1/1235 , H01Q1/32 , H01Q3/26 , H01Q3/2676 , H01Q21/062
摘要： An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.

7. 发明授权

US06838623B2 Electrical circuit board and a method for making the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US06838623B2
公开(公告)日：2005-01-04
申请号：US10300049
申请日：2002-11-20
申请人： Lawrence Kneisel , Mohan Paruchuri , Vivek Jairazboy , Vladimir Stoica
发明人： Lawrence Kneisel , Mohan Paruchuri , Vivek Jairazboy , Vladimir Stoica
IPC分类号： H05K3/38 , H05K3/40 , H05K3/44 , H05K3/46 , H05K1/03
CPC分类号： H05K3/4641 , H05K3/386 , H05K3/4038 , H05K3/445 , H05K2201/0195 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438
摘要： A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

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