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1. 发明授权

US08855452B2 Silicon photonic chip optical coupling structures 有权
标题翻译：硅光子芯片光耦合结构
公开(公告)号：US08855452B2
公开(公告)日：2014-10-07
申请号：US13353118
申请日：2012-01-18
申请人： Paul S. Andry , Russell A. Budd , Frank R. Libsch , Robert L. Wisnieff
发明人： Paul S. Andry , Russell A. Budd , Frank R. Libsch , Robert L. Wisnieff
IPC分类号： G02B6/34 , G02B6/12
CPC分类号： G02B6/4204 , G02B6/34
摘要： A silicon photonic chip is provided. An active silicon layer that includes a photonic device is on a front side of the silicon photonic chip. A silicon substrate that includes an etched backside cavity is on a backside of the silicon photonic chip. A microlens is integrated into the etched backside cavity. A buried oxide layer is located between the active silicon layer and the silicon substrate. The buried oxide layer is an etch stop for the etched backside cavity.
摘要翻译：提供硅光子芯片。包括光子器件的有源硅层位于硅光子芯片的前侧。包括蚀刻的背面腔的硅衬底位于硅光子芯片的背面。将微透镜集成到蚀刻的背面腔中。掩埋氧化物层位于有源硅层和硅衬底之间。掩埋氧化物层是用于蚀刻的背面腔的蚀刻停止。

2. 发明申请

US20130182998A1 SILICON PHOTONIC CHIP OPTICAL COUPLING STRUCTURES 有权
标题翻译：硅光电芯片光耦合结构
公开(公告)号：US20130182998A1
公开(公告)日：2013-07-18
申请号：US13353118
申请日：2012-01-18
申请人： Paul S. Andry , Russell A. Budd , Frank R. Libsch , Robert L. Wisnieff
发明人： Paul S. Andry , Russell A. Budd , Frank R. Libsch , Robert L. Wisnieff
IPC分类号： G02B6/42 , G02B6/32
CPC分类号： G02B6/4204 , G02B6/34
摘要： A silicon photonic chip is provided. An active silicon layer that includes a photonic device is on a front side of the silicon photonic chip. A silicon substrate that includes an etched backside cavity is on a backside of the silicon photonic chip. A microlens is integrated into the etched backside cavity. A buried oxide layer is located between the active silicon layer and the silicon substrate. The buried oxide layer is an etch stop for the etched backside cavity.
摘要翻译：提供硅光子芯片。包括光子器件的有源硅层位于硅光子芯片的前侧。包括蚀刻的背面腔的硅衬底位于硅光子芯片的背面。将微透镜集成到蚀刻的背面腔中。掩埋氧化物层位于有源硅层和硅衬底之间。掩埋氧化物层是用于蚀刻的背面腔的蚀刻停止。

3. 发明申请

US20110044369A1 SILICON CARRIER OPTOELECTRONIC PACKAGING 有权
标题翻译：硅载体光电包装
公开(公告)号：US20110044369A1
公开(公告)日：2011-02-24
申请号：US12544696
申请日：2009-08-20
申请人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chirag S. Patel
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chirag S. Patel
IPC分类号： H01S5/18 , H01L31/0232 , H01L23/34 , H01L21/50
CPC分类号： H01L27/1446 , G02B6/4204 , G02B6/4249 , G02B6/4257 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01S5/005 , H01S5/0224 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02407 , H01S5/02476 , H01S5/183 , H01S5/423 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
摘要翻译：公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。硅层具有允许光通过的光通孔。光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。多个OE元件耦合到硅层并与布线电连通。至少一个OE元件被定位成与用于接收光的光通孔光学对准。载体介于电互连元件之间。载体位于硅层的布线和电路板之间，并且载体电连接到连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。

4. 发明授权

US08290008B2 Silicon carrier optoelectronic packaging 有权
标题翻译：硅载光子包装
公开(公告)号：US08290008B2
公开(公告)日：2012-10-16
申请号：US12544696
申请日：2009-08-20
申请人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chirag S. Patel
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chirag S. Patel
IPC分类号： H01S5/022 , H01S5/024
CPC分类号： H01L27/1446 , G02B6/4204 , G02B6/4249 , G02B6/4257 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01S5/005 , H01S5/0224 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02407 , H01S5/02476 , H01S5/183 , H01S5/423 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
摘要翻译：公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。硅层具有允许光通过的光通孔。光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。多个OE元件耦合到硅层并与布线电连通。至少一个OE元件被定位成与用于接收光的光通孔光学对准。载体介于电互连元件之间。载体位于硅层的布线和电路板之间，并且载体电连接到连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。

5. 发明申请

US20120326290A1 SILICON CARRIER OPTOELECTRONIC PACKAGING 有权
标题翻译：硅载体光电包装
公开(公告)号：US20120326290A1
公开(公告)日：2012-12-27
申请号：US13604341
申请日：2012-09-05
申请人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chrirag S. Patel
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , David Danovitch , Benjamin V. Fasano , Paul Fortier , Luc Guerin , Frank R. Libsch , Sylvain Ouimet , Chrirag S. Patel
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L27/1446 , G02B6/4204 , G02B6/4249 , G02B6/4257 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/01019 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01S5/005 , H01S5/0224 , H01S5/02248 , H01S5/02276 , H01S5/02284 , H01S5/02407 , H01S5/02476 , H01S5/183 , H01S5/423 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.
摘要翻译：公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。硅层具有允许光通过的光通孔。光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。多个OE元件耦合到硅层并与布线电连通。至少一个OE元件被定位成与用于接收光的光通孔光学对准。载体介于电互连元件之间。载体位于硅层的布线和电路板之间，并且载体电连接到连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。

6. 发明授权

US08596879B2 Method to reorder (shuffle) optical cable waveguide layers 有权
标题翻译：重新排序（洗牌）光缆波导层的方法
公开(公告)号：US08596879B2
公开(公告)日：2013-12-03
申请号：US13277767
申请日：2011-10-20
申请人： Russell A. Budd , Frank R. Libsch
发明人： Russell A. Budd , Frank R. Libsch
IPC分类号： G02B6/38
CPC分类号： G02B6/38 , G02B6/3817 , G02B6/4293 , G02B6/43
摘要： An optical cable including connectors includes a plurality of waveguide layers each including a plurality of optical channels each having a first end and a second end. First and second connectors each include a plurality of electrically conductive pins, and each of the plurality of optical channels of each of the waveguides, at their first and second ends, are connected to a specified pin on each of the first and second connectors, respectively. A first optical channel connection pattern on the first connector, and a second optical channel connection pattern on the second connector. The first optical channel connection pattern on the first connector is a different pattern than the second optical channel connection pattern on the second connector in relation to a connection hole pattern which is the same for both the first and second connectors.
摘要翻译：包括连接器的光缆包括多个波导层，每个波导层包括多个光通道，每个光通道具有第一端和第二端。第一和第二连接器各自包括多个导电引脚，并且每个波导的多个光通道中的每一个在其第一和第二端分别连接到第一和第二连接器中的每一个上的指定引脚。第一连接器上的第一光通道连接图案和第二连接器上的第二光通道连接图案。第一连接器上的第一光通道连接图案是与第二连接器上的第二光通道连接图案相对于第一和第二连接器两者相同的连接孔图案不同的图案。

7. 发明授权

US08483253B2 3D optoelectronic packaging 有权
公开(公告)号：US08483253B2
公开(公告)日：2013-07-09
申请号：US13359100
申请日：2012-01-26
申请人： Russell A. Budd , Paul Fortier , Frank R. Libsch
发明人： Russell A. Budd , Paul Fortier , Frank R. Libsch
IPC分类号： H01S5/00
CPC分类号： H01L27/1446 , G02B6/4201 , G02B6/4206 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4266 , G02B6/4269 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

8. 发明授权

US08111730B2 3D optoelectronic packaging 有权
标题翻译： 3D光电封装
公开(公告)号：US08111730B2
公开(公告)日：2012-02-07
申请号：US12544710
申请日：2009-08-20
申请人： Russell A. Budd , Paul Fortier , Frank R. Libsch
发明人： Russell A. Budd , Paul Fortier , Frank R. Libsch
IPC分类号： H01S5/00
CPC分类号： H01L27/1446 , G02B6/4201 , G02B6/4206 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4266 , G02B6/4269 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.
摘要翻译：公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线层的硅层。硅层具有允许光通过的光通孔。光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。一个或多个第一OE元件耦合到硅层并与布线电连通。位于与用于接收光的光通孔光学对准的第一OE元件中的至少一个。嵌入在布线层内的第二个OE元件。载体可以介于电互连元件之间并且位于布线层和电路板之间。

9. 发明申请

US20110026882A1 LENSED OPTICAL CONNECTOR WITH PASSIVE ALIGNMENT FEATURES 审中-公开
标题翻译：具有被动对准功能的透镜光连接器
公开(公告)号：US20110026882A1
公开(公告)日：2011-02-03
申请号：US12533588
申请日：2009-07-31
申请人： Russell A. Budd , Frank R. Libsch
发明人： Russell A. Budd , Frank R. Libsch
IPC分类号： G02B6/42 , G02B6/36 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/32 , G02B6/4204 , G02B6/4249
摘要： A simply constructed and economical optical connector, wherein a fiber ribbon or waveguide ribbon cable incorporates a plurality of projecting fiber or waveguide ends adapted to engage into a guiding feature in a structure that incorporates an array of microlenses, upon said structure being aligned with and attached to a ferrule housing the ribbon cable. The guiding feature enables apertures in the ferrule within which the projecting fiber or waveguide ends are guides towards engagement with guiding feature in the microlens containing structure, to be formed or dimensioned with relaxed tolerances relative to the fiber or waveguide ends, thereby considerable reducing manufacturing costs for the ferrule.
摘要翻译：一种简单构造和经济的光学连接器，其中光纤带或波导带状电缆包括多个突出的光纤或波导端，其适于在结合有结合有微透镜阵列的结构中接合到引导特征中，所述结构与所述结构对准并连接连接到容纳带状电缆的套圈。引导特征使得套管中的突出的光纤或波导端部的孔能够引导朝向与微透镜容纳结构中的引导特征的接合，以相对于光纤或波导端部具有松弛的公差形成或尺寸，从而大大降低了制造成本用于套圈。

10. 发明申请

US20090283575A1 TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS 有权
标题翻译：安装焊接棒和成型工具的技术
公开(公告)号：US20090283575A1
公开(公告)日：2009-11-19
申请号：US12121236
申请日：2008-05-15
申请人： Russell A. Budd , Frank R. Libsch , Jae-Woong Nah
发明人： Russell A. Budd , Frank R. Libsch , Jae-Woong Nah
IPC分类号： B23K1/20
CPC分类号： B23K1/0016 , B23K3/0623 , B23K3/087 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H05K3/3478 , H05K2203/0113 , H05K2203/0292 , H05K2203/0338 , H05K2203/041 , H05K2203/0557 , H05K2203/105 , H01L2924/00 , H01L2224/05599
摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls ale dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold ale configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.
摘要翻译：提供具有多个通孔的掩模和具有多个空腔的模具，并且通孔和空腔对齐。将导电球分配到对准的通孔和空腔中基本上一个球被分配到每个对齐的通孔和空腔中，并且具有孔和模具中的空腔的掩模被构造和定尺寸使得球基本上与...齐平，或凹下面，掩模的外表面。去除掩模，导电球与半导体器件的焊盘对准，并且通过无甲醛回流在甲酸环境中将导电球转移到焊盘。还公开了振动，静电和直接转印方面。

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