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    • 2. 发明授权
    • Acoustic isolator having a high impedance layer of hafnium oxide
    • 具有高阻抗层氧化铪的隔振器
    • US5646583A
    • 1997-07-08
    • US582686
    • 1996-01-04
    • Charles W. SeaburyPaul H. KobrinJeffrey F. DeNatale
    • Charles W. SeaburyPaul H. KobrinJeffrey F. DeNatale
    • H04R17/00H01L41/09H03H9/17H03H9/54H03H9/00
    • H03H9/175
    • A resonant acoustic isolator supports a thin film acoustic resonator comprising a layer of piezoelectric material having top and bottom electrical contacts. The resonant acoustic isolator comprises at least one pair of layers of materials having different acoustic impedances. The isolator materials are deposited in alternating layers of high and low impedance material, with each layer having a thickness of 1/4 acoustic wavelength at resonant frequency. Silicon dioxide (SiO.sub.2) is preferred for the low impedance material because it is ubiquitous in the semiconductor industry, it has relatively low acoustic impedance with very low intrinsic acoustic loss, and it can be deposited using a variety of convenient methods. Hafnium oxide (HfO.sub.2) is preferred for the high acoustic impedance material because it can be deposited by evaporation to form a hard, dense dielectric having a relatively high acoustic impedance. Deposition of an entire stack of alternating SiO.sub.2 and HfO.sub.2 layers can be performed in the same chamber using electron beam deposition techniques for low cost production.
    • 谐振隔声器支撑包括具有顶部和底部电触点的压电材料层的薄膜声谐振器。 谐振隔音器包括具有不同声阻抗的至少一对材料层。 隔离材料沉积在高阻抗材料和低阻抗材料的交替层中,每个层的谐振频率具有+ E,fra 1/4 + EE声波长的厚度。 对于低阻抗材料,二氧化硅(SiO 2)是优选的,因为它在半导体工业中是普遍存在的,它具有相当低的声阻抗,具有非常低的固有声学损失,并且可以使用各种方便的方法进行沉积。 氧化铪(HfO 2)优选用于高声阻抗材料,因为它可以通过蒸发沉积以形成具有相对较高声阻抗的硬致密电介质。 可以使用电子束沉积技术在相同的室中进行交替的SiO 2和HfO 2层的整个堆叠的沉积,用于低成本生产。