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    • 5. 发明授权
    • Systems and methods for inspection of a specimen
    • 检测样品的系统和方法
    • US09068917B1
    • 2015-06-30
    • US11374711
    • 2006-03-14
    • Mehdi Vaez-IravaniEliezer Rosengaus
    • Mehdi Vaez-IravaniEliezer Rosengaus
    • G01N21/00G01N21/88
    • G01N21/00G01N21/88G01N21/9501G01N21/956G01N2021/8825
    • Systems and methods for inspection of a specimen are provided. One system includes an illumination subsystem configured to illuminate the specimen by scanning a spot across the specimen. The system also includes a non-imaging detection subsystem configured to generate output signals responsive to light specularly reflected from the spot scanned across the specimen. In addition, the system includes a processor configured to generate images of the specimen using the output signals and to detect defects on the specimen using the images. In one embodiment, the non-imaging detection subsystem includes an objective and a detector. An NA of the objective does not match a pixel size of the detector. In another embodiment, the non-imaging detection subsystem includes an objective having an NA of greater than about 0.05. The system may be configured for multi-spot illumination and multi-channel detection. Alternatively, the system may be configured for single spot illumination and multi-channel detection.
    • 提供了用于检查样本的系统和方法。 一个系统包括照明子系统,该照明子系统被配置为通过扫描样品上的斑点照射样本。 该系统还包括非成像检测子系统,其被配置为响应于从穿过样本扫描的点镜面反射的光产生输出信号。 另外,该系统包括处理器,该处理器被配置为使用输出信号产生样本的图像,并使用该图像来检测样本上的缺陷。 在一个实施例中,非成像检测子系统包括物镜和检测器。 目标的NA与检测器的像素尺寸不匹配。 在另一个实施例中,非成像检测子系统包括具有大于约0.05的NA的物镜。 该系统可以被配置用于多点照明和多通道检测。 或者,该系统可以被配置用于单点照明和多通道检测。
    • 10. 发明授权
    • Wafer inspection systems and methods for analyzing inspection data
    • 晶圆检查系统和检验数据分析方法
    • US07417724B1
    • 2008-08-26
    • US11746884
    • 2007-05-10
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • Paul SullivanGeorge KrenEliezer RosengausPatrick HuetRobinson PiramuthuMartin PlihalYan Xiong
    • G01N21/88G06K9/00
    • G01N21/9501G01N21/9503H01L21/67005H01L21/67288
    • Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.
    • 提供晶圆检查系统和方法。 一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。 模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。 一种或多种模式包括后侧检查,边缘检查,前侧宏观缺陷检查或其组合。 另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。 传感器被配置为基本上同时检测从晶片返回的光。 用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板,所述支撑装置接触晶片的背面。 该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。