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    • 3. 发明申请
    • Method for producing group III Nitride-based compound semiconductor
    • 制备III族氮化物系化合物半导体的方法
    • US20080271665A1
    • 2008-11-06
    • US12081943
    • 2008-04-23
    • Shiro YAMAZAKISeiji NAGAITakayuki SATOKatsuhiro IMAIMakoto IWAITakatomo SASAKIYusuke MORIFumio KAWAMURA
    • Shiro YAMAZAKISeiji NAGAITakayuki SATOKatsuhiro IMAIMakoto IWAITakatomo SASAKIYusuke MORIFumio KAWAMURA
    • C30B15/00
    • C30B29/403C30B9/00C30B9/12C30B29/406
    • In the production of GaN through the flux method, deposition of miscellaneous crystals on the nitrogen-face of a GaN self-standing substrate and waste of raw materials are prevented. Four arrangements of crucibles and a GaN self-standing substrate are exemplified. In FIG. 1A, a nitrogen-face of a self-standing substrate comes into close contact with a sloped flat inner wall of a crucible. In FIG. 1B, a nitrogen-face of a self-standing substrate comes into close contact with a horizontally facing flat inner wall of a crucible, and the substrate is fixed by means of a jig. In FIG. 1C, a jig is provided on a flat bottom of a crucible, and two GaN self-standing substrates are fixed by means of the jig so that the nitrogen-faces of the substrates come into close contact with each other. In FIG. 1D, a jig is provided on a flat bottom of a crucible, and a GaN self-standing substrate is fixed on the jig so that the nitrogen-face of the substrate is covered with the jig. A flux mixture of molten gallium and sodium is charged into each crucible, and a GaN single crystal is grown on a gallium-face under pressurized nitrogen.
    • 在通过助熔剂制造GaN的情况下,可以防止在GaN自立基板的氮面上沉积杂晶,原料的浪费。 例示了四个坩埚和GaN自立衬底的布置。 在图 如图1A所示,自立基板的氮面与坩埚的倾斜的平坦的内壁紧密接触。 在图 如图1B所示,自立式基板的氮面与坩埚的水平面对的平坦的内壁紧密接触,通过夹具固定基板。 在图 如图1C所示,在坩埚的平坦底部设置夹具,并且通过夹具固定两个GaN自立基板,使得基板的氮气面彼此紧密接触。 在图 如图1D所示,在坩埚的平坦底部设置夹具,并且将GaN自立基板固定在夹具上,使得基板的氮面被夹具覆盖。 将熔融的镓和钠的助熔剂混合物装入每个坩埚中,并且在加压氮气下在镓面上生长GaN单晶。