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1. 发明申请

US20110316149A1 METHOD OF MOUNTING ELECTRONIC COMPONENT AND MOUNTING SUBSTRATE 有权
标题翻译：安装电子元件和安装基板的方法
公开(公告)号：US20110316149A1
公开(公告)日：2011-12-29
申请号：US13138582
申请日：2010-02-25
申请人： Osamu Suzuki , Seiichi Ishikawa , Haruyuki Yoshii
发明人： Osamu Suzuki , Seiichi Ishikawa , Haruyuki Yoshii
IPC分类号： H01L23/498 , H01L21/50
CPC分类号： C08G59/42 , C08G59/50 , C08G59/68 , C08K3/36 , C08L63/00 , H01L21/563 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13561 , H01L2224/13565 , H01L2224/1357 , H01L2224/136 , H01L2224/16237 , H01L2224/16238 , H01L2224/73203 , H01L2224/73204 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/81385 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
摘要翻译：在电子部件的倒装芯片连接中，底部填充物填充在部件和基板之间以减轻例如热应力。在使用迄今为止进行的铜柱的电子部件安装中，填充物中包含的填料可能在加热和固化树脂的过程中引起分离。公开了用焊料电镀铜柱的表面。由于异种金属之间的接触而产生的由局部电池产生的电场，充填在底部填充物中的填料的动员被抑制，并且避免了连接部分处的裂纹的发生。因此，连接可靠性提高。

2. 发明授权

US08586467B2 Method of mounting electronic component and mounting substrate 有权
标题翻译：安装电子部件和安装基板的方法
公开(公告)号：US08586467B2
公开(公告)日：2013-11-19
申请号：US13138582
申请日：2010-02-25
申请人： Osamu Suzuki , Seiichi Ishikawa , Haruyuki Yoshii
发明人： Osamu Suzuki , Seiichi Ishikawa , Haruyuki Yoshii
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： C08G59/42 , C08G59/50 , C08G59/68 , C08K3/36 , C08L63/00 , H01L21/563 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13561 , H01L2224/13565 , H01L2224/1357 , H01L2224/136 , H01L2224/16237 , H01L2224/16238 , H01L2224/73203 , H01L2224/73204 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/81385 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
摘要翻译：在电子部件的倒装芯片连接中，底部填充物填充在部件和基板之间以减轻例如热应力。在使用迄今为止进行的铜柱的电子部件安装中，填充物中包含的填料可能在加热和固化树脂的过程中引起分离。公开了用焊料电镀铜柱的表面。由于异种金属之间的接触而产生的由局部电池产生的电场，充填在底部填充物中的填料的动员被抑制，并且避免了连接部分处的裂纹的发生。因此，连接可靠性提高。

3. 发明授权

US06841415B2 Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate 有权
标题翻译：倒装芯片安装方法，避免半导体芯片和基板之间的空隙形成
公开(公告)号：US06841415B2
公开(公告)日：2005-01-11
申请号：US10240806
申请日：2001-04-13
申请人： Osamu Suzuki , Haruyuki Yoshii , Kenichi Suzuki
发明人： Osamu Suzuki , Haruyuki Yoshii , Kenichi Suzuki
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/13109 , H01L2224/16225 , H01L2224/29007 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/09701 , H01L2924/14 , H01L2924/1579 , H01L2924/01049 , H01L2924/01083 , H01L2224/13111 , H01L2924/00014 , H01L2924/00
摘要： The present invention is to provide a flip chip mounting method which does not cause void formation between a semiconductor chip and a substrate, and in the flip chip mounting method, the method comprising the steps of: (A) drying the substrate; and (B) at least one step of: (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and (2) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause convection substantially in the uncured or curing underfill.
摘要翻译：本发明提供一种在半导体芯片和基板之间不会形成空隙的倒装芯片的安装方法，在倒装芯片安装方法中，该方法包括以下步骤：（A）干燥基板; 和（B）至少一个步骤：（1）至少在衬底表面上的凸起按压部分和/或存在微小不规则的衬底的整个部分分配未固化的密封剂; 和（2）在保持温度条件的同时进行底部填充的按压和固化，使得半导体芯片和基板之间的温差基本上不会在未固化或固化的底部填充物中引起对流。

4. 发明授权

US06498200B1 Cationically polymerizable resin composition 有权
标题翻译：阳离子聚合性树脂组合物
公开(公告)号：US06498200B1
公开(公告)日：2002-12-24
申请号：US09480424
申请日：2000-01-11
申请人： Osamu Suzuki , Haruyuki Yoshii , Hisao Kondo , Kenichi Suzuki
发明人： Osamu Suzuki , Haruyuki Yoshii , Hisao Kondo , Kenichi Suzuki
IPC分类号： C08K322
CPC分类号： C08L63/00 , C08G59/68 , C08G65/10 , C08G65/18 , H01B3/40
摘要： A cationically polymerizable resin composition which comprises (A) a compound containing at least one ring selected from the group consisting of an oxirane ring and an oxetane ring; (B) an onium salt; (C) an organic peroxide; and (D) an alkaline filler except for a hydroxide.
摘要翻译：一种阳离子可聚合树脂组合物，其包含（A）含有至少一个选自环氧乙烷环和氧杂环丁烷环的环的化合物; （B）鎓盐; （C）有机过氧化物; 和（D）除氢氧化物以外的碱性填料。

5. 发明授权

US08815142B2 Method of manufacturing a resin molded gear by injection molding 有权
标题翻译：通过注射成型制造树脂模制齿轮的方法
公开(公告)号：US08815142B2
公开(公告)日：2014-08-26
申请号：US13493154
申请日：2012-06-11
申请人： Gaku Iijima , Osamu Suzuki
发明人： Gaku Iijima , Osamu Suzuki
IPC分类号： B29C45/73 , B29C45/72 , B29L15/00
CPC分类号： B29C45/7207 , B29L2015/003
摘要： Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要翻译：提供一种通过注射成型一体形成的树脂模制齿轮的制造方法，包括：沿着轮辋的外周面形成的齿部; 沿所述边缘的内周表面延伸的腹板; 以及设置在凸台的浇口部，该凸台与所述腹板的至少一部分接合并形成在位于中心轴线的芯部，所述方法使用熔融温度为Tm℃的合成树脂，所述方法包括：将熔融温度为Tm℃的合成树脂注入和装载到用于形成树脂成形齿轮的模具的空腔中; 并且当所述浇口部分固化时，将所述网的厚度中心温度T1设定为（Tm-20）℃以上至（Tm + 20）℃以下，将所述牙齿部的表面温度T2设定为（T1-50）℃以下。

6. 发明授权

US08470936B2 Liquid epoxy resin composition for semiconductor encapsulation 有权
标题翻译：用于半导体封装的液体环氧树脂组合物
公开(公告)号：US08470936B2
公开(公告)日：2013-06-25
申请号：US13193848
申请日：2011-07-29
申请人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
发明人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
IPC分类号： C08K7/18 , C08K3/36 , C08K9/10 , C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29 , H05K1/03
CPC分类号： H01L23/293 , C08G59/4246 , C08K5/0025 , C08K5/3445 , C08L63/00 , C08L79/08 , H01L21/563 , H01L24/29 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83104 , H01L2224/83192 , H01L2224/83862 , H01L2924/00014 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/0401
摘要： A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要翻译：一种用于半导体封装的液体环氧树脂组合物，包括：（A）至少一种环氧树脂，（B）至少一种固化促进剂和（C）至少一种酸酐封端的聚酰胺酸。液体环氧树脂组合物提供了对半导体芯片表面具有优异粘合性并具有优异的耐湿性的固化材料。

7. 发明申请

US20130009345A1 METHOD OF MANUFACTURING A RESIN MOLDED GEAR BY INJECTION MOLDING 有权
标题翻译：通过注塑成型制造树脂成型齿轮的方法
公开(公告)号：US20130009345A1
公开(公告)日：2013-01-10
申请号：US13493154
申请日：2012-06-11
申请人： Gaku Iijima , Osamu Suzuki
发明人： Gaku Iijima , Osamu Suzuki
IPC分类号： B29C45/73
CPC分类号： B29C45/7207 , B29L2015/003
摘要： Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要翻译：提供一种通过注射成型一体形成的树脂模制齿轮的制造方法，包括：沿着轮辋的外周面形成的齿部; 沿所述边缘的内周表面延伸的腹板; 以及设置在凸台的浇口部，该凸台与所述腹板的至少一部分接合并形成在位于中心轴线的芯部，所述方法使用熔融温度为Tm℃的合成树脂，所述方法包括：将熔融温度为Tm℃的合成树脂注入和装载到用于形成树脂成形齿轮的模具的空腔中; 并且当所述浇口部分固化时，将所述网的厚度中心温度T1设定为（Tm-20）℃以上至（Tm + 20）℃以下，将所述牙齿部的表面温度T2设定为（T1-50）℃以下。

8. 发明授权

US08318388B2 Mask blank providing system, mask blank providing method, mask blank transparent substrate manufacturing method, mask blank manufacturing method, and mask manufacturing method 有权
标题翻译：掩模空白提供系统，掩模坯提供方法，掩模空白透明基板制造方法，掩模板制造方法和掩模制造方法
公开(公告)号：US08318388B2
公开(公告)日：2012-11-27
申请号：US13174397
申请日：2011-06-30
申请人： Osamu Suzuki , Hiroyuki Akagawa , Masaru Tanabe , Atsushi Kawaguchi , Naozumi Ishibashi
发明人： Osamu Suzuki , Hiroyuki Akagawa , Masaru Tanabe , Atsushi Kawaguchi , Naozumi Ishibashi
IPC分类号： G03F1/00
CPC分类号： G03F1/60 , G03F1/50 , Y10T428/31616
摘要： A mask blank manufacturing department manufactures a mask blank by forming a thin film to be a mask pattern on a mask blank transparent substrate. When providing the mask blank to a mask manufacturing department, the mask blank manufacturing department provides optical characteristic information (transmittance variation) of the mask blank transparent substrate and optical characteristic information (transmittance variation and/or phase difference variation) of the mask blank to the mask manufacturing department. The optical characteristic information of the mask blank transparent substrate is provided to the mask blank manufacturing department from a materials processing department that manufactures mask blank transparent substrates.
摘要翻译：掩模制造部门通过在掩模板透明基板上形成作为掩模图案的薄膜来制造掩模坯料。当掩模制造部门提供掩模坯料时，掩模制造部门提供掩模毛坯透明基板的光学特性信息（透射率变化）和掩模毛坯的光学特性信息（透射率变化和/或相位差变化）面具制造部门。掩模坯料透明基板的光学特性信息由制造掩模板透明基板的材料加工部门提供给掩模坯料制造部。

9. 发明授权

US08115950B2 Image reading system, information processing apparatus, and scanner, with specification of number of pages to be scanned and created into a file 有权
标题翻译：图像读取系统，信息处理设备和扫描仪，具有要扫描并创建到文件中的页面数量
公开(公告)号：US08115950B2
公开(公告)日：2012-02-14
申请号：US11785388
申请日：2007-04-17
申请人： Xiaojun Du , Osamu Suzuki , Eijiro Inoue , Akira Yokoyama
发明人： Xiaojun Du , Osamu Suzuki , Eijiro Inoue , Akira Yokoyama
IPC分类号： G06F3/12 , H04N1/04
CPC分类号： H04N1/00222 , H04N1/00225 , H04N1/0044 , H04N1/00448 , H04N1/00453 , H04N1/00458 , H04N1/00464 , H04N2201/0065 , H04N2201/0081
摘要： An image reading system includes an information processing apparatus and a scanner connected to the information processing apparatus via a network. Upon receiving input of information that specifies the number of pages to be included in a file through an input unit and a web browser, the information processing apparatus transmits the information through a first communication unit to the scanner. The scanner reads image data through a reading unit, and divides the image data into files based on the information through a data management unit. The scanner transmits the files to the information processing apparatus through a second communication unit. The information processing apparatus displays images of the files on a monitor.
摘要翻译：图像读取系统包括经由网络与信息处理装置连接的信息处理装置和扫描仪。在通过输入单元和网络浏览器接收到指定要包括在文件中的页数的信息的输入时，信息处理设备通过第一通信单元将信息发送到扫描仪。扫描仪通过读取单元读取图像数据，并且通过数据管理单元基于该信息将图像数据分割成文件。扫描仪通过第二通信单元将文件发送到信息处理设备。信息处理装置在监视器上显示文件的图像。

10. 发明授权

US07834955B2 Light reflector 失效
标题翻译：光反射器
公开(公告)号：US07834955B2
公开(公告)日：2010-11-16
申请号：US10585418
申请日：2005-01-07
申请人： Osamu Suzuki , Yoshiyuki Nousou , Nobuyuki Morita , Kazuya Nagashima
发明人： Osamu Suzuki , Yoshiyuki Nousou , Nobuyuki Morita , Kazuya Nagashima
IPC分类号： G02F1/1335
CPC分类号： G02B6/0031
摘要： A technology for effectively preventing deformation of a light reflector plate fabricated by forming a synthetic resin reflector plate into a three-dimensional shape enabling a thinner light reflector plate, and additionally, reducing processing costs is provided. An adhesive tape for shape-retention is adhered onto a reflector plate which is fabricated by forming predetermined areas of a light-reflecting plastic film or sheet into a three-dimensional shape.
摘要翻译：提供一种技术，用于有效地防止通过将合成树脂反射板形成三维形状而制成的光反射板的变形，从而能够实现更薄的光反射板，并且另外降低加工成本。用于保持形状的胶带粘附到通过将光反射塑料膜或片的预定区域形成为三维形状而制造的反射板上。

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