专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20170004926A1 ALUMINUM ELECTROLYTIC CAPACITOR AND RUBBER SEAL FOR SAME 审中-公开
标题翻译：铝电解电容器和橡胶密封件
公开(公告)号：US20170004926A1
公开(公告)日：2017-01-05
申请号：US15240269
申请日：2016-08-18
申请人： Hiroshi YANAKA , Naoto IWANO , Kaori MATSUMURA , Hikaru SANTSUKA , Naozumi KIMURA , Hidekazu MIZUSHIMA
发明人： Hiroshi YANAKA , Naoto IWANO , Kaori MATSUMURA , Hikaru SANTSUKA , Naozumi KIMURA , Hidekazu MIZUSHIMA
IPC分类号： H01G9/10 , H01G9/00 , H01G9/02 , H01G9/008 , H01G9/045
CPC分类号： H01G9/10 , H01G4/32 , H01G9/0029 , H01G9/008 , H01G9/02 , H01G9/045 , H01G9/145 , H01G11/80
摘要： An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, and a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.
摘要翻译：铝电解电容器包括具有引线端子的电容器元件; 容纳电容器元件的装甲箱; 以及橡胶密封件，其具有用于在其中钻出的引线端子的端子通孔，并安装在装甲壳体的开口部分上。引线通孔的孔径小于外引线的外径，在端子通孔内的圆棒配合孔与引线通孔之间形成逐渐变小的锥形引导面。从引线主体逐渐变小的通道引导部分整体地设置在外部引线的一端，以便具有比引线通孔的孔直径小的直径，形成具有预定的在通道引导部分的外周表面上的角度。

2. 发明授权

US08470936B2 Liquid epoxy resin composition for semiconductor encapsulation 有权
标题翻译：用于半导体封装的液体环氧树脂组合物
公开(公告)号：US08470936B2
公开(公告)日：2013-06-25
申请号：US13193848
申请日：2011-07-29
申请人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
发明人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
IPC分类号： C08K7/18 , C08K3/36 , C08K9/10 , C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29 , H05K1/03
CPC分类号： H01L23/293 , C08G59/4246 , C08K5/0025 , C08K5/3445 , C08L63/00 , C08L79/08 , H01L21/563 , H01L24/29 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83104 , H01L2224/83192 , H01L2224/83862 , H01L2924/00014 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/0401
摘要： A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要翻译：一种用于半导体封装的液体环氧树脂组合物，包括：（A）至少一种环氧树脂，（B）至少一种固化促进剂和（C）至少一种酸酐封端的聚酰胺酸。液体环氧树脂组合物提供了对半导体芯片表面具有优异粘合性并具有优异的耐湿性的固化材料。

3. 发明申请

US20130026660A1 LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于半导体封装的液体环氧树脂组合物和使用其的半导体器件
公开(公告)号：US20130026660A1
公开(公告)日：2013-01-31
申请号：US13193822
申请日：2011-07-29
申请人： Pawel CZUBAROW , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
发明人： Pawel CZUBAROW , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
IPC分类号： H01L23/28 , C08K5/3445 , C08L63/10
CPC分类号： H01L23/293 , C08G59/621 , C08K5/3415 , C08K5/3445 , C08L63/00 , H01L24/29 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/32 , H01L2224/32225 , H01L2224/73 , H01L2224/73204 , H01L2224/83 , H01L2224/83192 , H01L2224/92 , H01L2224/92125 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die.The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要翻译：一种用于半导体封装的液体环氧树脂组合物，包括：（A）环氧树脂，（B）咪唑化合物和（C）马来酰亚胺化合物，由液体环氧树脂组合物包封的半导体器件，以及其中固化液体环氧树脂的材料位于印刷电路基板和半导体管芯之间。液体环氧树脂组合物提供了对半导体芯片表面具有优异粘合性并具有优异的耐湿性的固化材料。

4. 发明授权

US09496091B2 Aluminum electrolytic capacitor and rubber seal for same 有权
标题翻译：铝电解电容器和橡胶密封相同
公开(公告)号：US09496091B2
公开(公告)日：2016-11-15
申请号：US14387619
申请日：2012-04-27
申请人： Hiroshi Yanaka , Naoto Iwano , Kaori Matsumura , Hikaru Santsuka , Naozumi Kimura , Hidekazu Mizushima
发明人： Hiroshi Yanaka , Naoto Iwano , Kaori Matsumura , Hikaru Santsuka , Naozumi Kimura , Hidekazu Mizushima
IPC分类号： H01G9/10 , H01G9/008 , H01G9/145 , H01G11/80 , H01G9/045 , H01G4/32
CPC分类号： H01G9/10 , H01G4/32 , H01G9/0029 , H01G9/008 , H01G9/02 , H01G9/045 , H01G9/145 , H01G11/80
摘要： An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.
摘要翻译：铝电解电容器包括具有引线端子的电容器元件; 容纳电容器元件的装甲箱; 以及橡胶密封件，其具有用于在其中钻出的引线端子的端子通孔，并安装在装甲壳体的开口部分上。引线通孔的孔径小于外引线的外径，在端子通孔内的圆棒配合孔与引线通孔之间形成逐渐变小的锥形引导面。从引线主体逐渐变小的通道引导部分整体地设置在外部引线的端部，以具有比引线通孔的孔直径小的直径，形成具有预定的在通道引导部分的外周表面上的角度。

5. 发明申请

US20150016025A1 ALUMINUM ELECTROLYTIC CAPACITOR AND RUBBER SEAL FOR SAME 有权
标题翻译：铝电解电容器和橡胶密封件
公开(公告)号：US20150016025A1
公开(公告)日：2015-01-15
申请号：US14387619
申请日：2012-04-27
申请人： Hiroshi Yanaka , Naoto Iwano , Kaori Matsumura , Hikaru Santsuka , Naozumi Kimura , Hidekazu Mizushima
发明人： Hiroshi Yanaka , Naoto Iwano , Kaori Matsumura , Hikaru Santsuka , Naozumi Kimura , Hidekazu Mizushima
IPC分类号： H01G9/10 , H01G4/32 , H01G9/145
CPC分类号： H01G9/10 , H01G4/32 , H01G9/0029 , H01G9/008 , H01G9/02 , H01G9/045 , H01G9/145 , H01G11/80
摘要： A lead terminal is passed through a terminal passage hole of a rubber seal, without imposing an excessive burden such that the characteristics of the capacitor element would be degraded, and while maintaining a state of reliable isolation from the outside air. In an aluminum electrolytic capacitor in which the hole diameter f2 of a lead wire passage hole (52) is smaller than the outside diameter f1 of an outside lead wire (22), the outside lead wire (22) being forcibly passed to the outside through lead wire passage hole (52), a conical guide surface (53) of progressively smaller diameter is formed between a round bar mating hole (51) and the lead wire passage hole (52) within a terminal passage hole (5). A passage guide part (222) of progressively smaller diameter from a lead wire body (221) is integrally furnished at an end of the outside lead wire (22) so as to have a smaller diameter f3 than the hole diameter f2 of the lead wire passage hole (52), forming a conical sloped surface (223) having a predetermined angle on the peripheral surface of the passage guide part (222).
摘要翻译：引线端子穿过橡胶密封件的端子通孔，而不会施加过大的负担，使得电容器元件的特性降低，同时保持与外部空气可靠隔离的状态。在导线通孔（52）的孔径f2小于外部引线（22）的外径f1的铝电解电容器中，外部引线（22）被强制地通过外部通过在圆柱形配合孔（51）和端子通孔（5）内的引线通孔（52）之间形成有直径较小的锥形导向面（53）。在外引线（22）的端部一体地设有从导线本体（221）呈直径逐渐变小的通道引导部（222），以具有比导线的孔直径f2小的直径f3 通道孔（52），在通道引导部分（222）的圆周表面上形成具有预定角度的锥形倾斜表面（223）。

6. 发明申请

US20130026661A1 LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME 有权
标题翻译：用于半导体封装的液体环氧树脂组合物和使用其的半导体器件
公开(公告)号：US20130026661A1
公开(公告)日：2013-01-31
申请号：US13193848
申请日：2011-07-29
申请人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
发明人： Pawel Czubarow , Osamu Suzuki , Toshiyuki Sato , Kazuyoshi Yamada , Kaori Matsumura
IPC分类号： C08L79/08 , H01L23/29 , C08L63/00
CPC分类号： H01L23/293 , C08G59/4246 , C08K5/0025 , C08K5/3445 , C08L63/00 , C08L79/08 , H01L21/563 , H01L24/29 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83104 , H01L2224/83192 , H01L2224/83862 , H01L2924/00014 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/0401
摘要： A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and semiconductor die.The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要翻译：一种用于半导体封装的液体环氧树脂组合物，包括：（A）至少一种环氧树脂，（B）至少一种固化促进剂和（C）至少一种酸酐封端的聚酰胺酸，以及组合物，其中固化物液体环氧树脂位于印刷电路基板和半导体管芯之间。液体环氧树脂组合物提供了对半导体芯片表面具有优异粘合性并具有优异的耐湿性的固化材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式