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    • 2. 发明授权
    • Prober and method for cleaning probes provided therein
    • 用于清洁其中提供的探头的探针和方法
    • US6118290A
    • 2000-09-12
    • US66937
    • 1998-04-28
    • Masahiko SugiyamaYoshihiko NakamuraKazumi Yamagata
    • Masahiko SugiyamaYoshihiko NakamuraKazumi Yamagata
    • G01R31/28G01R31/02
    • G01R31/2886
    • A prober including a probe card, a main chuck, a spacer, a conveying mechanism, and a supporting portion. The probe card is provided on an upper surface of a main body of the prober. The main chuck is provided in the main body of the prober, underneath the probe card, to be movable in X, Y, Z and .theta. directions. The spacer has an upper portion on which a cleaner tool for the probe card is held. The conveying mechanism for conveying the spacer between outside of the main body of the prober and a position on the main chuck. The supporting portion is provided on an outer side surface of the main chuck, for supporting the spacer. The main chuck is moved up and down directly underneath the probe card such that probes of the probe card is cleaned with the cleaner tool on the spacer held on the main chuck.
    • 包括探针卡,主卡盘,间隔件,输送机构和支撑部分的探测器。 探针卡设置在探测器的主体的上表面上。 主卡盘设置在探针主体的探针卡下面,可在X,Y,Z和θ方向上移动。 间隔件具有上部,用于探针卡的清洁器工具保持在该上部上。 传送机构,用于在探测器主体的外部和主卡盘上的位置之间传送间隔物。 支撑部设置在主卡盘的外侧面上,用于支撑间隔件。 主卡盘直接在探针卡下方上下移动,使用清洁工具清洁探头卡的探头,保持在主卡盘上的垫片上。
    • 5. 发明申请
    • BONDING APPARATUS AND BONDING METHOD
    • 粘接装置和粘接方法
    • US20110214809A1
    • 2011-09-08
    • US12922288
    • 2009-09-11
    • Masahiko Sugiyama
    • Masahiko Sugiyama
    • B32B37/10B32B37/02B32B37/06B32B37/14B32B37/16
    • H01L21/67092B32B37/003B32B37/10B32B2457/00Y10T156/17
    • A bonding apparatus includes a first holding section which places and holds a first member on an upper surface, and a second holding section which adsorbs and holds a second member on a lower surface. The second holding section is configured such that a center section bends due to a predetermined pressure. The second holding section includes an intake mechanism which sucks atmosphere of a bonding space between the first holding section and the second holding section. A protrusion which protrudes downward along an outer circumferential lower surface of the second holding section is formed on the outer circumferential lower surface. A sealing member which holds an air-tightness of the bonding space and has elasticity is formed in a lower surface of the protrusion. A height adjusting mechanism which abuts on the protrusion and can adjust the vertical distance between the first member and the second member is formed on a side surface of the first holding section.
    • 接合装置包括:第一保持部,其将第一部件放置在上表面上;第二保持部,其将第二部件吸附并保持在下表面。 第二保持部构造成使得中心部由于预定压力而弯曲。 第二保持部包括吸入第一保持部和第二保持部之间的结合空间的气氛的吸入机构。 在外周下表面上形成有沿着第二保持部的外周下表面向下方突出的突起。 在突出部的下表面形成有保持接合空间的气密性且具有弹性的密封构件。 在第一保持部的侧面形成有与突起抵接并能够调整第一部件与第二部件的垂直距离的高度调节机构。
    • 6. 发明授权
    • Microlens array sheet and method of producing the same
    • 微透镜阵列片及其制造方法
    • US07864450B2
    • 2011-01-04
    • US12378962
    • 2009-02-23
    • Masaru SegawaMasahiko SugiyamaYoichiro Nakatani
    • Masaru SegawaMasahiko SugiyamaYoichiro Nakatani
    • G02B9/08
    • B29D11/00278B29D11/00365G02B3/0031G02B3/0056
    • A microlens array sheet includes a light-shielding base having a first surface and a second surface opposite to the first surface and a microlens array attached to the first surface of the light-shielding base, the array having a plurality of microlens. The light-shielding base has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the first surface side is larger than another size of each aperture on the second surface side. Instead of the light-shielding base, the microlens array sheet may include a transparent base having a first surface and a second surface opposite to the first surface and a light-shielding layer, having a third surface and a fourth surface opposite to the third surface, provided on the second surface of the transparent base. The microlens array is attached to the first surface of the transparent base. The light-shielding layer has a plurality of apertures that correspond to the microlenses. Each aperture has a conical trapezoid-like shape in which a size of each aperture on the third surface side is larger than another size of each aperture on the fourth surface side.
    • 微透镜阵列片包括具有第一表面和与第一表面相对的第二表面的遮光基底和附着到遮光基底的第一表面的微透镜阵列,该阵列具有多个微透镜。 遮光底座具有对应于微透镜的多个孔。 每个孔具有锥形梯形形状,其中第一表面侧上的每个孔的尺寸大于第二表面侧上的每个孔的另一尺寸。 微透镜阵列片代替遮光底座,可以包括具有第一表面和与第一表面相对的第二表面的透明基底和遮光层,其具有与第三表面相对的第三表面和第四表面 ,设置在透明基底的第二表面上。 微透镜阵列附着到透明基底的第一表面。 遮光层具有对应于微透镜的多个孔。 每个孔具有锥形梯形形状,其中第三表面侧上的每个孔的尺寸大于第四表面侧上的每个孔的另一尺寸。
    • 9. 发明授权
    • Prober and probe testing method for temperature-controlling object to be tested
    • 用于温度控制对象的探测和探测测试方法
    • US06992500B2
    • 2006-01-31
    • US10869932
    • 2004-06-18
    • Masahiko SugiyamaYoshinori Inoue
    • Masahiko SugiyamaYoshinori Inoue
    • G01R31/26
    • G01R31/2874G01R1/06705G01R31/2865G01R31/2891
    • A prober which tests an object to be tested under temperature control is provided. This prober includes a stage base, Z stage, X-Y stage having a frame structure, substrate fixing mechanism arranged on the X-Y stage, a probe card arranged to oppose the substrate fixing mechanism, and a probing stage fixed on the Z stage and arranged in the frame structure of the X-Y stage such that its axis coincides with an extension line vertically extending from the probe center of the probe card. The probing stage includes a probing elevating mechanism, and a temperature controller to heat and cool the object to be tested. The probing stage supports the substrate of the object to be tested from the bottom surface, and controls the temperature of the object to be tested.
    • 提供了一个在温度控制下测试待测物体的探测器。 该探测器包括台架基座,Z台架,具有框架结构的XY平台,布置在XY平台上的基板固定机构,布置成与基板固定机构相对的探针卡,以及固定在Z台上的探测台,并布置在 XY台的框架结构,使得其轴线与从探针卡的探针中心垂直延伸的延伸线重合。 探测阶段包括探测升降机构和温度控制器,以加热和冷却待测物体。 探测阶段从底面支撑被测物体的基底,并控制待测物体的温度。