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    • 1. 发明授权
    • Thin-film transistor and method of manufacturing the same
    • 薄膜晶体管及其制造方法
    • US08823005B2
    • 2014-09-02
    • US13167668
    • 2011-06-23
    • O-Sung SeoSeong-Hun KimYang-Ho BaeJean-Ho Song
    • O-Sung SeoSeong-Hun KimYang-Ho BaeJean-Ho Song
    • H01L29/66H01L29/45H01L29/786
    • H01L29/78618H01L29/458H01L29/66765
    • A thin-film transistor (TFT) and a method of manufacturing the same are disclosed herein. The TFT may include a gate electrode disposed on an insulating substrate, an insulating layer disposed on the insulating substrate and the gate electrode, an active layer pattern disposed on the insulating layer to overlap the gate electrode, a source electrode disposed on the insulating layer and at least part of which overlaps the active layer pattern, and a drain electrode which is separated from the source electrode and at least part of which overlaps the active layer pattern. A first ohmic contact layer pattern may be disposed between the active layer pattern and the source electrode and between the active layer pattern and the drain electrode. The first ohmic contact layer may have higher nitrogen content on its surface than in other portions of the first ohmic contact layer.
    • 本文公开了一种薄膜晶体管(TFT)及其制造方法。 TFT可以包括设置在绝缘基板上的栅电极,设置在绝缘基板上的绝缘层和栅电极,设置在绝缘层上的与栅电极重叠的有源层图案,设置在绝缘层上的源电极和 其至少一部分与有源层图案重叠,以及与源电极分离并且其至少一部分与有源层图案重叠的漏电极。 可以在有源层图案和源电极之间以及有源层图案和漏电极之间设置第一欧姆接触层图案。 第一欧姆接触层在其表面上可以具有比在第一欧姆接触层的其它部分更高的氮含量。
    • 7. 发明授权
    • Thin film transistor array panel and method for manufacturing the same
    • 薄膜晶体管阵列面板及其制造方法
    • US07352004B2
    • 2008-04-01
    • US11249500
    • 2005-10-14
    • Je-Hun LeeYang-Ho BaeBeom-Seok ChoChang-Oh Jeong
    • Je-Hun LeeYang-Ho BaeBeom-Seok ChoChang-Oh Jeong
    • H01L29/04H01L29/10H01L31/00
    • H01L27/3279H01L27/124H01L27/1288H01L51/0023H01L51/56
    • The invention provides a thin film transistor (TFT) array panel that includes an insulating substrate; a gate line formed on the insulating substrate and having a first layer of an Al containing metal, a second layer of a Cu containing metal that is thicker than the first layer, and a gate electrode; a gate insulating layer arranged on the gate line; a semiconductor arranged on the gate insulating layer; a data line having a source electrode and arranged on the gate insulating layer and the semiconductor; a drain electrode arranged on the gate insulating layer and the semiconductor and facing the source electrode; a passivation layer having a contact hole and arranged on the data line and the drain electrode; and a pixel electrode arranged on the passivation layer and coupled with the drain electrode through the contact hole.
    • 本发明提供一种薄膜晶体管(TFT)阵列面板,其包括绝缘基板; 形成在所述绝缘基板上并具有含有Al的金属的第一层,比所述第一层更厚的含Cu金属的第二层的栅极线和栅电极; 栅极绝缘层,布置在栅极线上; 布置在栅绝缘层上的半导体; 数据线,其具有源电极并且布置在所述栅极绝缘层和所述半导体上; 布置在所述栅绝缘层和所述半导体上并面对所述源电极的漏电极; 钝化层,其具有接触孔并且布置在所述数据线和所述漏电极上; 以及设置在钝化层上并通过接触孔与漏电极耦合的像素电极。
    • 10. 发明授权
    • Thin film transistor, thin film transistor substrate including the same and method of manufacturing the same
    • 薄膜晶体管,包括其的薄膜晶体管基板及其制造方法
    • US07879662B2
    • 2011-02-01
    • US12573385
    • 2009-10-05
    • Yang-Ho BaeChang-Oh JeongByeong-Beom Kim
    • Yang-Ho BaeChang-Oh JeongByeong-Beom Kim
    • H01L21/00
    • H01L29/458H01L27/124
    • A thin film transistor showing desirable contact characteristics during contact with indium tin oxide (ITO) or indium zinc oxide (IZO), in which a first conductive pattern including a gate electrode and a second conductive pattern including a source electrode and a drain electrode are formed without an etching process, a TFT substrate including the TFTs, and a method of manufacturing the same. The thin film transistor includes a gate electrode formed of a first conductive layer, a gate insulating layer covering the gate electrode, a semiconductor layer forming a channel on the gate insulating layer; an ohmic contact layer formed on the semiconductor layer, and a source electrode and a drain electrode formed of a second conductive layer and of a third conductive layer. The second conductive layer includes an aluminum-nickel alloy and nitrogen and is formed on the semiconductor layer. The third conductive layer includes an aluminum-nickel alloy and is formed on the second conductive layer.
    • 在与铟锡氧化物(ITO)或铟锌氧化物(IZO)接触期间显示出期望的接触特性的薄膜晶体管,其中形成包括栅电极的第一导电图案和包括源电极和漏电极的第二导电图案 没有蚀刻处理,包括TFT的TFT基板及其制造方法。 薄膜晶体管包括由第一导电层形成的栅电极,覆盖栅电极的栅极绝缘层,在栅极绝缘层上形成沟道的半导体层; 形成在半导体层上的欧姆接触层,以及由第二导电层和第三导电层形成的源电极和漏电极。 第二导电层包括铝 - 镍合金和氮,并形成在半导体层上。 第三导电层包括铝镍合金,并形成在第二导电层上。