会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Rotating electric machine
    • 旋转电机
    • US08138653B2
    • 2012-03-20
    • US12530531
    • 2007-04-18
    • Yoshihiro TaniyamaYasuo KabataMasafumi FujitaTadashi TokumasuNorio TakahashiMasanori ArataKen Nagakura
    • Yoshihiro TaniyamaYasuo KabataMasafumi FujitaTadashi TokumasuNorio TakahashiMasanori ArataKen Nagakura
    • H02K3/34
    • H02K1/265H02K1/32H02K3/24
    • A rotating electric machine is provided, where a generator has an increased capacity and a reduced size achieved by electromagnetically effectively utilizing that parts of a rotor core which are outside the narrowest parts of magnetic poles of the rotor core to permit large field current and suppress an increase in temperature of rotor coils. The rotating electric machine includes a stator constructed by winding armature coils around a stator core (1), and a hollow circular cylindrical rotor. The rotor has at least one pair of magnetic poles (2), non-polar portions (3) between the magnetic poles, and interpolar portions (6) arranged in the non-polar portions. In the non-polar portions (3), a plurality of rotor slots (4) are arranged at predetermined intervals. Field windings are wound in each rotor slot (4). The cross-sectional areas (S) of the rotor slots (4) other than the rotor slots (4a) nearest to the magnetic poles (2) are gradually increased in the direction from the magnetic poles (2) to the interpolar portions (6).
    • 提供了一种旋转电机,其中发电机具有增加的容量和通过电磁有效地利用在转子芯的磁极的最窄部分外部的转子芯的部分来实现的尺寸减小以允许大的励磁电流并且抑制 转子线圈的温度升高。 旋转电机包括通过将电枢线圈缠绕在定子铁芯(1)上而构成的定子和中空的圆柱形转子。 转子在磁极之间具有至少一对磁极(2),非极性部分(3)以及布置在非极性部分中的极间部分(6)。 在非极性部分(3)中,以预定的间隔布置多个转子槽(4)。 在每个转子槽(4)中缠绕励磁绕组。 除了最靠近磁极(2)的转子槽(4a)以外的转子槽(4)的横截面面积(S)在从磁极(2)到极间部分(6)的方向上逐渐增加 )。
    • 5. 发明授权
    • Image forming apparatus
    • 图像形成装置
    • US07962076B2
    • 2011-06-14
    • US11589144
    • 2006-10-30
    • Rie EndoShuji MoriyaKatsuhiro SakaizawaNorio Takahashi
    • Rie EndoShuji MoriyaKatsuhiro SakaizawaNorio Takahashi
    • G03G15/08
    • G03G15/065G03G2215/0634
    • An image forming apparatus includes an image bearing member; a developer carrying member, contactable to the image bearing member, for carrying a developer to a developing position to develop an electrostatic image formed on the image bearing member with the developer; a supplying member for supplying the developer to the developer carrying member, wherein a peripheral speed of the developer carrying member is not less than 1.05 times and not more than 1.20 times a peripheral speed of the image bearing member, and an arithmetic average roughness Ra is not less than 0.20 times and not more than 0.33 times a volume average particle size of the developer, wherein a potential applied to the supplying member is different from a potential applied to the developer carrying member toward a larger potential of a regular charge polarity of the developer.
    • 图像形成装置包括:图像承载部件; 显影剂承载构件,可接触图像承载构件,用于将显影剂携带到显影位置以使显影剂形成在图像承载构件上形成静电图像; 用于将显影剂供应到显影剂承载构件的供应构件,其中显影剂承载构件的圆周速度不小于图像承载构件的圆周速度的1.05倍且不大于1.20倍,并且算术平均粗糙度Ra为 不小于显影剂的体积平均粒径的0.20倍且不大于0.33倍,其中施加到供给构件的电位不同于施加到显影剂承载构件的电位朝向较大的电荷极性的电位 开发者
    • 6. 发明授权
    • Fluid temperature control device
    • 流体温度控制装置
    • US07938577B2
    • 2011-05-10
    • US12011296
    • 2008-01-25
    • Norio Takahashi
    • Norio Takahashi
    • G01K17/00G01F1/00
    • G05D23/1919H01L21/67109
    • A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.
    • 一种流体温度控制装置,包括:具有形成在其表面中的通道的主体块; 导热板,设置在主体块的表面上,并且覆盖通道以形成用于使待温度控制的流体通过的通道; 温度控制装置,其通过导热板进行热交换(加热/冷却),流体通过通道,其中与导热板相邻的通道连接流体入口和形成的流体出口 在主体块中,并且是具有在其整个长度上具有近似恒定的通道横截面面积的单个通道。
    • 7. 发明申请
    • APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE OF SEMICONDUCTOR WAFERS
    • 用于控制半导体波导温度的装置和方法
    • US20110066294A1
    • 2011-03-17
    • US12992971
    • 2009-11-09
    • Hiroaki TakechiNorio TakahashiWataru KiyosawaShigenao MaruyamaAtsuki Komiya
    • Hiroaki TakechiNorio TakahashiWataru KiyosawaShigenao MaruyamaAtsuki Komiya
    • G05D23/00G05D7/00
    • H01L21/67248H01L21/67005H01L21/67109
    • A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured. When the temperature of the semiconductor wafer is controlled to be the target temperature by raising the temperature of the semiconductor wafer, control means performs switching so as to supply a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank to a channel in a stage, and controls the thermoelectric element in plural zones so that the temperature of the semiconductor wafer coincides with the target temperature and the in-plane temperature distribution of the semiconductor wafer becomes the desired temperature distribution.
    • 半导体器件的制造时间通过将诸如硅晶片的半导体晶片的基底温度高速地提高到目标温度而缩短,通过使半导体器件的面内温度分布 半导体晶片具有高精度的期望的温度分布(通过均匀化面内温度并改变各区域的面内温度分布),此外,可以简单地构造具有优异的能量效率的装置。 当通过提高半导体晶片的温度将半导体晶片的温度控制为目标温度时,控制装置执行切换,以便在高温下提供高于目标温度的高温循环液体 并且控制多个区域中的热电元件,使得半导体晶片的温度与目标温度一致,并且半导体晶片的面内温度分布变为期望的温度分布。