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    • 1. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US06969305B2
    • 2005-11-29
    • US10357473
    • 2003-02-04
    • Norio KimuraTadakazu SoneTomohiko AkatsukaTatsuya Sasaki
    • Norio KimuraTadakazu SoneTomohiko AkatsukaTatsuya Sasaki
    • B24B49/16B24B53/007B24B53/017B24B1/00
    • B24B53/017B24B49/16
    • A polishing apparatus for polishing a substrate comprises a turntable having a polishing surface, a substrate holder for holding a substrate and bringing the substrate into contact under pressure with the polishing surface, a dresser including a dresser tool adapted to be brought into contact under a pressure with the polishing surface to dress or condition the polishing surface and a pressure device connected to the dresser for moving the dresser between a raised position where the dresser is spaced away from the polishing surface and a dressing position where the dresser rests on the polishing surface such that the dresser tool is in contact with the polishing surface under a pressure exerted by the weight of the dresser itself, the dresser comprising a follow-up mechanism allowing each one of dressing element to move up and down relative to a flange portion so as to follow a contour of the polishing surface of the turntable.
    • 用于抛光衬底的抛光装置包括具有抛光表面的转盘,用于保持衬底并使衬底在压力下与抛光表面接触的衬底保持器,包括修整器工具的修整器,其适于在压力下接触 抛光表面用于打磨或调理抛光表面,以及连接到修整器的压力装置,用于在修整器与抛光表面间隔开的升高位置和修整器搁置在抛光表面上的修整位置之间移动修整器, 修整器工具在由修整器本身的重量施加的压力下与抛光表面接触,该修整器包括随动装置,其允许每个修整元件相对于凸缘部分上下移动,以便 遵循转盘抛光表面的轮廓。