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1. 发明专利

JP2005165160A Method of generating scalable font and method of displaying scalable font 审中-公开
标题翻译：产生可缩放字体的方法和显示可缩放字体的方法
公开(公告)号：JP2005165160A
公开(公告)日：2005-06-23
申请号：JP2003406725
申请日：2003-12-05
申请人： Yutaka Wada , 豊和田
发明人： WADA YUTAKA
IPC分类号： G09G5/24 , G09G5/26
摘要： PROBLEM TO BE SOLVED: To provide a method of generating scalable font data with so small data volume that it can be mounted on even a small-sized incorporated apparatus having no large-capacity storage devices and to provide a method of displaying scalable font data.
SOLUTION: In the case of generating scalable font data , logical coordinates extracted from strokes of characters are encoded in accordance with stroke shapes. Strokes encoded once can be utilized for encoding other characters. Encoded data is stored as font data having a required minimum data volume and an expansible structure, and scalable font data is generated which has quality hardly degraded regardless expansion and reduction while having a data volume equal to or smaller than that of bit map type font data. Generated font data is expanded to reproduce character strokes, and thus characters are displayed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种生成具有如此小的数据量的可缩放字体数据的方法，即使在没有大容量存储设备的小型并入设备上也可以安装它，并且提供一种可展开的方法字体数据。解决方案：在生成可缩放字体数据的情况下，从字符笔画提取的逻辑坐标根据笔画形状进行编码。一次编码的笔画可用于编码其他字符。编码数据被存储为具有所需最小数据量和可扩展结构的字体数据，并且生成具有等于或小于位图类型字体数据的数据量的数据量大大降低的质量几乎不降低的可缩放字体数据。生成的字体数据被扩展以再现字符笔画，因此显示字符。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005258862A Computer program for preserving network file 审中-公开
标题翻译：用于保存网络文件的计算机程序
公开(公告)号：JP2005258862A
公开(公告)日：2005-09-22
申请号：JP2004070298
申请日：2004-03-12
申请人： Yutaka Wada , 豊和田
发明人： WADA YUTAKA
IPC分类号： G06F12/00
摘要： PROBLEM TO BE SOLVED: To reliably perform a work to preserve a file on a network in terminal equipment without bothering an operator. SOLUTION: When the file on the network is preserved in the storage device of the terminal equipment, it is automatically examined whether the file with a name or content being the same as that of the file on the network pre-exists or not in a preservation destination folder or a folder other than it. The provision of information to determine the sameness of the file and the proposal of an optimum preservation condition are performed to the operator. The operator alternatively determines the performance or stop of a preservation processing without performing any other works. A processing to preserve the optimum condition is automatically performed without the intervention of the operator. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了可靠地执行在终端设备的网络上保存文件的工作，而不打扰操作者。
解决方案：当网络上的文件保存在终端设备的存储设备中时，会自动检查名称或内容与网络上的文件的文件是否相同的文件是否存在在保存目的地文件夹或除此之外的文件夹中。提供信息以确定文件的一致性和最佳保存条件的提案被执行给操作者。操作者可以在不执行任何其他作品的情况下交替地确定保存处理的性能或停止。自动执行保持最佳状态的处理，而无需操作人员的干预。版权所有（C）2005，JPO＆NCIPI

3. 发明授权

US08449964B2 Optical recording medium and manufacturing method thereof 有权
标题翻译：光记录介质及其制造方法
公开(公告)号：US08449964B2
公开(公告)日：2013-05-28
申请号：US13114386
申请日：2011-05-24
申请人： Hiroshi Tabata , Yousuke Fujii , Yutaka Wada
发明人： Hiroshi Tabata , Yousuke Fujii , Yutaka Wada
IPC分类号： G11B7/24
CPC分类号： G11B7/24038 , G11B7/243 , G11B7/2578 , G11B7/263 , G11B7/266 , G11B2007/24304 , G11B2007/24312 , G11B2007/24314 , G11B2007/2432 , G11B2007/24324 , G11B2007/25708 , G11B2007/25715 , Y10T428/21
摘要： An optical recording medium includes: an inorganic recording layer; and a protective layer including a composite oxide containing an indium oxide provided on at least one surface of the inorganic recording layer, wherein the composite oxide is represented by the formula [(In2O3)1-X(A)X], wherein A is cerium oxide or gallium oxide and X satisfies a range of 0.15≦X≦0.75.
摘要翻译：光记录介质包括：无机记录层; 以及包含设置在无机记录层的至少一个表面上的含有氧化铟的复合氧化物的保护层，其中复合氧化物由式[（In 2 O 3）1-X（A）X]表示，其中A为铈氧化物或氧化镓，X满足0.15 @ X @ 0.75的范围。

4. 发明授权

US07507144B2 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US07507144B2
公开(公告)日：2009-03-24
申请号：US11727727
申请日：2007-03-28
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.
摘要翻译：基板抛光装置用于将诸如半导体晶片的基板的表面抛光到平面镜面。基板研磨装置具有安装在研磨台上的用于研磨半导体基板的研磨台和研磨垫。抛光垫在其中形成有通孔。基板研磨装置还具有发光和接收装置，用于通过形成在抛光垫中的通孔将测量光发射到半导体衬底并接收来自半导体衬底的反射光，以测量半导体衬底上的膜。发光和接收装置设置在抛光台中。衬底抛光装置包括用于将流体供应到测量光的路径的供给通道。供给通道具有可拆卸地安装在抛光台上的出口部分。衬底抛光装置还包括安装在抛光台上并当抛光垫附接到抛光台时装配到通孔中的保护盖。

5. 发明申请

US20080121529A1 Flattening Method and Flattening Apparatus 审中-公开
标题翻译：扁平化方法和扁平化装置
公开(公告)号：US20080121529A1
公开(公告)日：2008-05-29
申请号：US11793773
申请日：2005-12-21
申请人： Yasushi Tohma , Takayuki Saitoh , Tsukuru Suzuki , Akira Kodera , Yutaka Wada , Itsuki Kobata
发明人： Yasushi Tohma , Takayuki Saitoh , Tsukuru Suzuki , Akira Kodera , Yutaka Wada , Itsuki Kobata
IPC分类号： C25F3/16 , C25F7/00
CPC分类号： C25F3/02 , C25F7/00 , H01L21/32115 , H01L21/32125 , H01L21/7684
摘要： A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.
摘要翻译：平坦化方法即使当金属膜具有初始表面不规则性时，可以在足够高的处理速率下将整个膜表面上的金属膜的表面作为互连材料平整处理。用于加工和平坦化在工件上形成的具有初始表面凹凸的金属膜的表面的平坦化方法，包括：用固体或糊状涂料仅仅涂覆金属膜初始表面凹凸的凹陷部分; 并且通过不使用研磨剂的电解处理来处理金属膜的表面。

6. 发明申请

US20070099426A1 Polishing method, polishing apparatus, and electrolytic polishing apparatus 审中-公开
标题翻译：抛光方法，抛光装置和电解抛光装置
公开(公告)号：US20070099426A1
公开(公告)日：2007-05-03
申请号：US11316845
申请日：2005-12-27
申请人： Manabu Tsujimura , Akira Fukunaga , Yutaka Wada , Itsuki Kobata
发明人： Manabu Tsujimura , Akira Fukunaga , Yutaka Wada , Itsuki Kobata
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/02074 , C25F7/00 , H01L21/3212 , H01L21/32125
摘要： A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first polishing process of polishing a surface of the substrate After performing the first polishing process, the surface of the substrate is cleaned. After cleaning, a second polishing process is performed for further polishing the surface of the substrate. At least one of performing the first polishing process and performing the second polishing process includes performing electrolytic polishing.
摘要翻译：抛光方法抛光衬底以去除互连金属膜和形成在互连凹槽之外的部分上的阻挡膜。该方法包括进行抛光基板的表面的第一抛光处理。在进行第一抛光处理之后，清洁基板的表面。在清洁之后，执行第二抛光工艺以进一步抛光衬底的表面。执行第一抛光处理并执行第二抛光处理中的至少一个包括进行电解抛光。

7. 发明授权

US07108579B2 Method and device for polishing 失效
标题翻译：抛光方法和装置
公开(公告)号：US07108579B2
公开(公告)日：2006-09-19
申请号：US10485273
申请日：2003-02-20
申请人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
发明人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
IPC分类号： B24B49/00 , B24B1/00
CPC分类号： B24B53/017 , B24B7/228 , B24B37/04 , B24B37/044 , B24B49/12 , B24B53/02 , C09G1/00 , H01L21/31053
摘要： The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
摘要翻译：抛光方法技术领域本发明涉及一种用于通过将待磨削的工件压在固定磨料上并使工件与固定磨料滑动接触来抛光工件的抛光方法。抛光方法包括：在提供含有阴离子表面活性剂并且不含磨料颗粒的抛光液的同时抛光工件的第一步骤;以及第二步骤，在提供包含阳离子表面活性剂的抛光液的同时抛光工件，活性剂，不含磨料颗粒。

8. 发明申请

US20060105679A1 Substrate polishing apparatus 有权
公开(公告)号：US20060105679A1
公开(公告)日：2006-05-18
申请号：US11274112
申请日：2005-11-16
申请人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
发明人： Kazuto Hirokawa , Shunsuke Nakai , Shinrou Ohta , Yutaka Wada , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , H01L21/30625
摘要： A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a through hole formed therein. The substrate polishing apparatus also has a light emission and reception device for emitting measurement light through the through hole formed in the polishing pad to the semiconductor substrate and receiving reflected light from the semiconductor substrate so as to measure a film on the semiconductor substrate. The light emission and reception device is disposed in the polishing table. The substrate polishing apparatus includes a supply passage for supplying a fluid to a path of the measurement light. The supply passage has an outlet portion detachably mounted on the polishing table. The substrate polishing apparatus also includes a protection cover mounted on the polishing table and fitted into the through hole when the polishing pad is attached to the polishing table.

9. 发明授权

US06942548B2 Polishing method using an abrading plate 失效
标题翻译：使用研磨板的抛光方法
公开(公告)号：US06942548B2
公开(公告)日：2005-09-13
申请号：US09916305
申请日：2001-07-30
申请人： Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
发明人： Yutaka Wada , Hirokuni Hiyama , Kazuto Hirokawa , Hisanori Matsuo
IPC分类号： B24B1/00 , B24B37/04 , B24B37/24 , B24B53/017 , B24D3/32 , H01L21/304
CPC分类号： B24B37/245 , B24B37/042 , B24B53/017 , B24D3/32 , H01L21/31053 , H01L21/3212
摘要： An abrading plate has a self-stopping capability such that when an object, such as a semiconductor wafer having a device structure that includes raised regions and depressed regions fabricated on the surface, is being polished, the raised regions are removed and polishing stops automatically. The abrading plate, to produce a flat and mirror polished surface on the an object, has abrasive particles having a chemical purity of not less than 90% and a particle size of not more than two micrometers, a binder material, and a given volume of porosity. A ratio of the abrasive particles and the binder material is not less than 1:0.5 by volume, and proportions of abrasive particles, a binder material and porosity are, respectively, not less than 10%, not more than 60% and 10-40% by volume. A surface is polished for a given duration with a liquid not containing abrasive particles so as to eliminate the raised regions and to obtain a flat surface. Additional surface removal is performed by supplying abrasive particles to the polishing interface to remove surface material uniformly from the entire surface.
摘要翻译：研磨板具有自停能力，使得当正在抛光诸如具有包括凸起区域的器件结构和在表面上制造的凹陷区域的半导体晶片的物体时，抛光凸起区域并且抛光自动停止。研磨板在物体上产生平坦且镜面抛光的表面，具有化学纯度不小于90％，粒度不大于2微米的磨料颗粒，粘合剂材料和给定体积的孔隙度。研磨粒子和粘合剂材料的比例为1〜0.5体积％以上，研磨粒子，粘合剂材料和孔隙率的比例分别为10％以上，60％以下，10〜40％按体积计。表面用不含磨料颗粒的液体抛光给定持续时间，以消除凸起区域并获得平坦表面。通过将磨料颗粒提供给抛光界面以从整个表面均匀地去除表面材料来进行附加的表面去除。

10. 发明授权

US06752692B2 Cleaning method and polishing apparatus employing such cleaning method 有权
标题翻译：使用这种清洁方法的清洁方法和抛光装置
公开(公告)号：US06752692B2
公开(公告)日：2004-06-22
申请号：US09932987
申请日：2001-08-21
申请人： Yutaka Wada , Hirokuni Hiyama , Norio Kimura
发明人： Yutaka Wada , Hirokuni Hiyama , Norio Kimura
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B08B3/08 , B24B53/017 , H01L21/67051 , Y10S134/902
摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.
摘要翻译：一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值附着于基板抛光面的液体不会迅速变化。

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