会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Cyclic amine compound
    • 环胺化合物
    • US08158790B2
    • 2012-04-17
    • US12306281
    • 2007-06-22
    • Shojiro MiyazakiYuji NakamuraTakahiro NagayamaTaro TokuiYasuyuki Ogawa
    • Shojiro MiyazakiYuji NakamuraTakahiro NagayamaTaro TokuiYasuyuki Ogawa
    • C07D241/06C07D241/08C07D401/04C07D403/04A61K31/495A61K31/496A61P9/04A61P9/10A61P9/12
    • C07D401/04C07D211/18C07D211/22C07D211/70C07D241/04C07D241/08
    • The present invention provides an excellent antihypertensive medicament. The medicament of the present invention comprises a compound having the general formula (I) and the like: [wherein R1: H, substitutable alkyl, substitutable alkenyl, substitutable cyclic hydrocarbon, substitutable heterocyclyl or the like; R2: H, substitutable alkyl, substitutable alkenyl, substitutable cycloalkyl or the like; R3, R4; H, substitutable alkyl, substitutable alkenyl, substitutable cycloalkyl or the like; R5, R6: H, substitutable alkyl, substitutable cycloalkyl, substitutable alkoxy or the like; R7, R8: H, substitutable alkyl, substitutable cycloalkyl or the like; X: the formula (II) or the like; A: substitutable cyclic hydrocarbon, substitutable heterocyclyl or the like; Y: a single bond, substitutable alkylene, substitutable alkenylene, —(CH2)a—X1—(CH2)b—(X1: the formula —NH—, —O— or the like; a, b: 0-5) or the like; B: substitutable cyclic hydrocarbon, substitutable heterocyclyl or the like].
    • 本发明提供了优异的抗高血压药物。 本发明的药物包含具有通式(I)等的化合物:其中R 1:H,可取代的烷基,可取代的链烯基,可取代的环状烃,可取代的杂环基等; R2:H,可取代的烷基,可取代的烯基,可取代的环烷基等; R3,R4; H,可取代的烷基,可取代的烯基,可取代的环烷基等; R5,R6:H,可取代的烷基,可取代的环烷基,可取代的烷氧基等; R7,R8:H,可取代的烷基,可取代的环烷基等; X:式(II)等; A:可取代的环烃,可取代的杂环基等; Y:单键,可取代亚烷基,可取代亚烯基, - (CH 2)a -X 1 - (CH 2)b - (X 1:式-NH-,-O-等; a,b:0-5)或 类似; B:可取代的环状烃,可取代的杂环基等]。
    • 9. 发明授权
    • Solder attached contact and a method of manufacturing the same
    • 焊接接头及其制造方法
    • US07909666B2
    • 2011-03-22
    • US12446432
    • 2007-10-30
    • Yuji Nakamura
    • Yuji Nakamura
    • H05K1/00
    • G01R1/07342G01R1/06727G01R3/00H05K3/3426H05K2201/1031H05K2201/1084H05K2201/10984H05K2203/0278H05K2203/041Y02P70/611Y02P70/613
    • There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
    • 提供了制备由包括基部(11,21),弹性变形部(12,22)和接触部(13,23)的金属板形成的触点(10,20)的步骤 ),并且其中在所述基部的底表面上形成有凹部(15,25),并且多个通孔(16,26,27)形成为布置在所述凹部上方并且平行于所述底部 基部的表面延伸穿过基部,并且将焊料保持在形成在触点上的通孔上。 通过该制造方法制造所需的焊料附着接触件(10a,20a)。 此外,焊料是焊球(90),保持焊料的步骤包括制备焊球的步骤和将焊球压入通孔的步骤。