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    • 3. 发明授权
    • Method for cleaning semiconductor devices
    • 半导体器件清洗方法
    • US5474615A
    • 1995-12-12
    • US993514
    • 1992-12-17
    • Tomoaki IshidaKenji KawaiMoriaki AkazawaTakahiro MaruyamaToshiaki Ogawa
    • Tomoaki IshidaKenji KawaiMoriaki AkazawaTakahiro MaruyamaToshiaki Ogawa
    • H01L21/302H01L21/00H01L21/304H01L21/306H01L21/3065C03C15/00
    • H01L21/02046H01L21/02057H01L21/02071H01L21/67028Y10S438/963
    • A method of cleaning semiconductor devices which removes or transmutes the contaminants sticking on sidewalls of a pattern or a trench is formed is disclosed. A substrate to be treated on which a pattern or a trench is formed is located in a processing container. A reactive gas which reacts with the contaminants sticking on the sidewall of the pattern or the trench to produce reactive ions which remove or transmute the contaminants is introduced into the processing container. Plasma of the reactive gas is produced by electronic cyclotron resonance in order to produce reactive ions from the reactive gas introduced into the processing container. According to the method, the temperature of the reactive ions in the plasma becomes high, with the result that the motion of the reactive ions in the plasma becomes more active. Accordingly, a velocity vector in a horizontal direction of the reactive ions becomes larger, which enables efficient removal or change in quality of the contaminants sticking on the sidewalls of the pattern or the trench.
    • 公开了一种清洁半导体器件的方法,该半导体器件去除或转移粘附在图案或沟槽的侧壁上的污染物。 在其上形成图案或沟槽的被处理基板位于处理容器中。 与粘附在图案或沟槽的侧壁上的污染物反应以产生去除或改变污染物的活性离子的反应气体被引入处理容器中。 反应气体的等离子体通过电子回旋共振产生,以便从引入处理容器的反应气体产生活性离子。 根据该方法,等离子体中的反应离子的温度变高,结果是等离子体中的活性离子的运动变得更加活跃。 因此,反应离子的水平方向的速度矢量变大,能够有效地去除或污染物附着在图案或沟槽的侧壁上的质量的变化。
    • 10. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US5246532A
    • 1993-09-21
    • US990797
    • 1992-12-10
    • Tomoaki Ishida
    • Tomoaki Ishida
    • H01J37/32
    • H01J37/32623H01J37/3266H01J37/32697Y10S156/915
    • In a plasma processing method and a plasma processing apparatus, a substrate is processed in a plasma with a surrounding focus ring levitated by the repulsion between a magnet mounted in the focus ring and an electromagnet. The height of the focus ring relative to the substrate support is adjusted to an optimal height by adjusting the current flowing to the electromagnet. Therefore, it is possible to achieve an optimal height of the focus ring for the etching of each layer in a laminated film to enhance the uniformity of laminated film etching and to achieve precise etching.
    • 在等离子体处理方法和等离子体处理装置中,在等离子体中处理基板,其中通过在安装在聚焦环的磁体和电磁体之间的排斥而悬浮的周围聚焦环。 通过调节流向电磁体的电流将聚焦环相对于基底支架的高度调整到最佳高度。 因此,可以实现层叠膜中各层的蚀刻的聚焦环的最佳高度,以提高层压膜蚀刻的均匀性并实现精确的蚀刻。