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    • 6. 发明公开
    • SOLDER JOINT STRUCTURE OF FLEXIBLE PRINTED CIRCUIT BOARD
    • 柔性印刷电路板焊接连接结构
    • EP3313156A1
    • 2018-04-25
    • EP16811249.8
    • 2016-06-17
    • Nippon Telegraph and Telephone Corporation
    • USUI, MitsuoKIKUCHI, KiyofumiTSUZUKI, KenFUKUDA, HiroshiASAKAWA, ShuichiroKAMEI, ShinSOMA, ShunichiSAIDA, Takashi
    • H05K1/14H05K1/11H05K3/36
    • H05K3/363H05K1/0269H05K1/11H05K1/111H05K1/117H05K1/14H05K1/147H05K1/189H05K3/3463H05K3/36H05K3/403H05K2201/09181H05K2201/09409H05K2201/10121
    • In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. Since a conduction inspection on wirings by measuring resistance values, for example, for an electric path including a joint portion needs to be made, quite a long time has been required for the inspection. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards , and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved by providing an electrode pad configuration which allows to form solder joint portions that are sufficiently visible from the side faces of the boards.
    • 在传统的焊接方法中,FPC侧电极焊盘和封装侧电极焊盘通过焊料层紧密接合在一起,并且接合工艺之后的焊接状态不容易在视觉上确认。 由于需要通过测量电阻值来进行布线的导通检查,例如对于包括接头部分的电气路径,所以检查需要相当长的时间。 本发明提供了一种钎焊接合结构,其包括形成在FPC板的端部的每个侧面上的侧面电极和待焊接的封装或PCB板,所述侧面电极相对于构成每个 电路板上的电极焊盘,并引入焊料。 在电路板端部的侧面电极上,从焊接部分连续形成的焊料的一部分是可见的,并且可以确认两个电路板上的电极焊盘之间的焊接状态。 通过提供允许形成从板的侧面足够可见的焊点部分的电极焊盘配置,可以提高焊点测试的效率。
    • 9. 发明公开
    • WAVEGUIDE-TYPE POLARIZATION BEAM SPLITTER
    • 极地食品麻省理工学院
    • EP2669722A1
    • 2013-12-04
    • EP12739739.6
    • 2012-01-25
    • Nippon Telegraph And Telephone Corporation
    • SAIDA, TakashiNASU, YusukeMIZUNO, TakayukiKASAHARA, Ryoichi
    • G02B6/126
    • G02B6/126G02B6/2793G02B6/2813G02B2006/12116G02B2006/1215
    • Provided is a waveguide-type polarization beam splitter in which deterioration of a polarization extinction ratio due to temperature change and wavelength change is suppressed. The waveguide-type polarization beam splitter includes: an input optical waveguides (11); a first optical coupler (12) coupled to the input optical waveguides (11); a pair of optical waveguide arms (13a, 13b) coupled to outputs of the first optical coupler; and a second optical coupler (18) coupled to the pair of optical waveguide arms (13a, 13b). A groove (15) is formed to extend across the pair of optical waveguide arms (13a, 13b) and two quarter wave plates (16a, 16b) are provided in the groove (15) to extend respectively across the arms (13a, 13b). Polarization axes of the quarter wave plates (16a, 16b) are orthogonal to each other. The first optical coupler (12) which gives a phase difference of 0° or 180° between coupled or split light beams and the second optical coupler (18) which gives a phase difference of 90° or -90° between coupled or split light beams are used in combination.
    • 提供了抑制由于温度变化和波长变化引起的偏振消光比的劣化的波导型偏振分束器。 波导型偏振分束器包括:输入光波导(11); 耦合到所述输入光波导(11)的第一光耦合器(12); 耦合到所述第一光耦合器的输出的一对光波导臂(13a,13b); 以及耦合到所述一对光波导臂(13a,13b)的第二光耦合器(18)。 形成一个沟槽(15),跨越一对光波导臂(13a,13b)延伸,并且两个四分之一波片(16a,16b)设置在槽(15)中,分别延伸穿过臂(13a,13b) 。 四分之一波片(16a,16b)的极化轴彼此正交。 第一光耦合器(12)在耦合或分离光束之间给出0°或180°的相位差,并且在耦合或分束光束之间给出90°或-90°的相位差的第二光耦合器(18) 被组合使用。