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1. 发明专利

JP2005045027A Cooling device of semiconductor element 有权
标题翻译：半导体元件冷却器件
公开(公告)号：JP2005045027A
公开(公告)日：2005-02-17
申请号：JP2003277672
申请日：2003-07-22
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , IMAI MAKOTO
IPC分类号： F25D9/00 , H01L23/36 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for efficiently cooling a semiconductor element.
SOLUTION: A plurality of spouting pipes 25 are provided under the semiconductor element 12. Cylindrical heat radiating fins 26 surrounding each pipe 25 are provided from a lower surface of an upper plate of a case 41 down below. A coolant spouted out from each pipe 25 is strongly spouted to the lower surface of the upper plate under the semiconductor element 12, and then flowing around a gap between the spouting pipes 25 and the heat radiating fins 26 and falling down the heat radiating fins 26. A flow velocity of the coolant flowing the lower surface of the upper plate and the heat radiating fins 26 is fast to be able to absorb the heat from the semiconductor element with high heat transfer coefficient.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于有效冷却半导体元件的冷却装置。解决方案：多个喷射管25设置在半导体元件12的下方。围绕每个管25的圆柱形散热片26从壳体41的上板的下表面向下设置。从每个管道25喷出的冷却剂在半导体元件12的下方被强烈地喷射到上板的下表面，然后围绕喷射管25和散热片26之间的间隙流动并且将散热片26落下流过上板和散热片26的下表面的冷却剂的流速很快能够以高传热系数从半导体元件吸收热量。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2008016872A Cooling device of semiconductor element 有权
标题翻译：半导体元件冷却器件
公开(公告)号：JP2008016872A
公开(公告)日：2008-01-24
申请号：JP2007257924
申请日：2007-10-01
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , IMAI MAKOTO
IPC分类号： H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for efficiently cooling a semiconductor element. SOLUTION: A plurality of spouting pipes 25 are provided under the semiconductor element 12. Cylindrical heat radiating fins 26 surrounding each of the spouting pipes 25 are provided from a lower surface of an upper plate of a case 41 down below. A coolant spouted out from each of the spouting pipes 25 is strongly spouted to the lower surface of the upper plate under the semiconductor element 12, and then flowing around a gap between the spouting pipes 25 and the heat radiating fins 26 and falling down the heat radiating fins 26. A flow velocity of the coolant flowing the lower surface of the upper plate and the heat radiating fins 26 is fast, thus, enabling the heat from the semiconductor element to be absorbed with a high heat transfer coefficient. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于有效冷却半导体元件的冷却装置。解决方案：多个喷射管25设置在半导体元件12的下方。围绕每个喷射管25的圆柱形散热片26从壳体41的上板的下表面向下设置。从每个喷射管25喷出的冷却剂被强力地喷射到半导体元件12下方的上板的下表面，然后在喷射管25和散热片26之间的间隙周围流动并且下降热量散热翅片26.流过上板和散热片26的下表面的冷却剂的流速是快速的，从而能够以高的传热系数吸收来自半导体元件的热量。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2014216543A 半導体モジュール有权
标题翻译：半导体模块
公开(公告)号：JP2014216543A
公开(公告)日：2014-11-17
申请号：JP2013093978
申请日：2013-04-26
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc , トヨタ自動車株式会社 , Toyota Motor Corp
发明人： SHOJI TOMOYUKI , OSADA YUJI , USUI MASANORI , IMAI MAKOTO , ORIMOTO NORIMUNE
IPC分类号： H01L23/34 , H01L25/07 , H01L25/18
CPC分类号： H01L23/34 , H01L25/04
摘要：【課題】半導体素子と配線層が圧接固定される圧接型の半導体モジュールにおいて、半導体素子が動作したときの温度分布に起因して半導体素子に加わる応力を緩和する技術を提供すること。【解決手段】圧接型の半導体モジュール1は、半導体素子4と配線層6の間に設けられており、圧接方向に直交する面内に配置されている複数の弾性機構10を備えている。弾性機構10は、半導体素子4に接触する導電性の接触体12、及び接触体12を半導体素子4に向けて付勢する弾性体14を有している。半導体素子4と配線層6は、接触体12を介して電気的に接続可能に構成されている。【選択図】図2
摘要翻译：要解决的问题：为了提供一种在半导体元件和半导体元件工作时由于温度分布而施加到半导体元件上的应力的技术，其中半导体元件和布线层是固定的压力压焊型半导体模块1包括设置在半导体元件4和布线层6之间的多个弹性机构10，并且设置在垂直于压接方向的平面中。弹性机构10包括：与半导体元件4接触的导电接触体12; 以及将接触体12朝向半导体元件4偏压的弹性体14.半导体元件4和布线层6通过接触体12形成为彼此电连接。

4. 发明专利

JP2010021188A Semiconductor power conversion module 有权
标题翻译：半导体功率转换模块
公开(公告)号：JP2010021188A
公开(公告)日：2010-01-28
申请号：JP2008177887
申请日：2008-07-08
申请人： Shin Kobe Electric Mach Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 新神戸電機株式会社
发明人： IWATSUKI YASUHITO , YAMANAKA HIROYUKI , IMAI MAKOTO
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/48139 , H01L2224/48247
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor power conversion module whose shape is made compact and which can reduce the number of connection places caused by connection lines. SOLUTION: A first conductor 9 is configured such that tips of extension conductor portions 10C to 12C of second conductors 10 to 12 are exposed beyond a first DC line constitution portion 16. The tips of the extension conductor portions of the second conductors 10 to 12 are respectively connected to input/output electrodes of semiconductor switch elements 1A, 1C, and 1E bonded to an element bonding portion of the first conductor 9 through connection lines L1 to L3. A second DC line constitution portion 22 which constitutes a second DC line N is embedded in a partition portion 26 of a housing 23. The second DC line constitution portion 22 extends along the first DC line constitution portion 16 while electrically insulated from the first DC line constitution portion 16, and also electrically connected to input/output electrodes of semiconductor switch elements 1B, 1D, and 1F through connection lines L4 to L6. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体功率转换模块，其形状紧凑并且可以减少由连接线引起的连接位置的数量。解决方案：第一导体9被配置为使得第二导体10至12的延伸导体部分10C至12C的尖端暴露于第一DC线构造部分16之外。第二导体10的延伸导体部分的尖端分别连接到通过连接线L1至L3接合到第一导体9的元件接合部分的半导体开关元件1A，1C和1E的输入/输出电极。构成第二直流线路N的第二直流线路构成部分22嵌入在壳体23的分隔部分26中。第二直流线构造部分22沿着第一直流配线部分16延伸，同时与第一直流线路构成部分16，并且还通过连接线L4至L6电连接到半导体开关元件1B，1D和1F的输入/输出电极。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008177622A Module structure 有权
标题翻译：模块结构
公开(公告)号：JP2008177622A
公开(公告)日：2008-07-31
申请号：JP2008104283
申请日：2008-04-14
申请人： Denki Kagaku Kogyo Kk , Toyota Motor Corp , トヨタ自動車株式会社 , 電気化学工業株式会社
发明人： SUGIMOTO ISAO , UTO MANABU , IBUKIYAMA MASAHIRO , IMAI MAKOTO
IPC分类号： H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability and low-cost module having high heat dissipation properties. SOLUTION: The module structure has a ceramic substrate 2, having a circuit 1 formed on a first main plane and a heat dissipation metal layer 3 bonded on the opposite of the main plane; the module structure has a plurality of the ceramic substrate 2 on a main plane of a heat sink 5; and the heat dissipation metal layer 3 is formed with a solder material layer on the heat sink 5, and each areas of the portions, where the heat dissipation metal layer 3 and the heat sink 5 are contacted, are not larger than 300 mm 2 , respectively. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有高散热性能的高可靠性和低成本模块。解决方案：模块结构具有陶瓷基板2，其具有形成在第一主平面上的电路1和结合在主平面相对的散热金属层3; 模块结构在散热器5的主平面上具有多个陶瓷基板2; 并且散热金属层3在散热器5上形成有焊料材料层，散热金属层3和散热片5接触的部分的各个区域不大于300mm 2 。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007329330A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2007329330A
公开(公告)日：2007-12-20
申请号：JP2006159950
申请日：2006-06-08
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： IMAI MAKOTO
IPC分类号： H01L23/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of determining a temperature environment of an entire semiconductor power elements by measuring the temperature of a small number of semiconductor power elements. SOLUTION: The semiconductor device having a power module 10 comprising a plurality of semiconductor power elements 11 has the semiconductor power element 11 on the power module 10, a semiconductor power element 20 with a low cooling efficiency existing in an area with a temperature environment worse than that of the semiconductor power element 11, and a temperature sensor for measuring the temperature of the semiconductor power element 20 with the low cooling efficiency. The temperature environment of the entire semiconductor power elements 11 on the power module 10 is determined based on the temperature measured by the temperature sensor. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够通过测量少量半导体功率元件的温度来确定整个半导体功率元件的温度环境的半导体器件。解决方案：具有包括多个半导体功率元件11的功率模块10的半导体器件在功率模块10上具有半导体功率元件11，具有低冷却效率的半导体功率元件20存在于具有温度环境劣于半导体功率元件11的环境，以及用于以低冷却效率测量半导体功率元件20的温度的温度传感器。基于由温度传感器测量的温度来确定功率模块10上的整个半导体功率元件11的温度环境。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2006269780A Power module 有权
标题翻译：电源模块
公开(公告)号：JP2006269780A
公开(公告)日：2006-10-05
申请号：JP2005086223
申请日：2005-03-24
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： IMAI MAKOTO , MATSUI SEIJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2924/13055 , H01L2924/19107 , H02M2001/008 , Y10T307/25 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power module having an output terminal structure capable of improving the degree of freedom in arrangement with respect to a positional relation with electric loading and versatility in circuit design. SOLUTION: Inverter circuits 151 and 152 composed of a plurality of semiconductor elements 210 for power are housed in a cabinet 280 of the power module 200. An output terminal 220 provided on one end side 281 of the cabinet 280 is connected with the inverter circuit 151, and an output terminal 220 provided on the other end side 282 is connected with the inverter circuit 152. Each of one-end side 281 and the other end side 282 is provided with an output terminal 230 constituted to be connectable electrically with the output terminal 220 positioned on the opposite side by a bus bar 240. As the result of this, by arranging the bus bar 240 properly, outputs of the inverter circuits 151 and 152 can be taken out from both the one-end sides 281 and the other side ends 282. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有输出端子结构的功率模块，其能够提高相对于电气负载的位置关系和电路设计中的通用性的布置的自由度。解决方案：由多个用于电力的半导体元件210组成的逆变器电路151和152容纳在功率模块200的机柜280中。设置在机壳280的一端侧281上的输出端子220与逆变器电路151和设置在另一端282的输出端子220与逆变器电路152连接。一端侧281和另一端侧282中的每一端设置有输出端子230，该输出端子230可与输出端子220由汇流条240定位在相反侧。结果，通过正确布置汇流条240，可以从一端侧281和第二端子281中取出反相器电路151和152的输出另一侧端282.版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2004140199A Module structure and its manufacturing method 有权
公开(公告)号：JP2004140199A
公开(公告)日：2004-05-13
申请号：JP2002303690
申请日：2002-10-18
申请人： Denki Kagaku Kogyo Kk , Toyota Motor Corp , トヨタ自動車株式会社 , 電気化学工業株式会社
发明人： SUGIMOTO ISAO , UTO MANABU , IBUKIYAMA MASAHIRO , IMAI MAKOTO
IPC分类号： H01L23/40 , H01L23/36
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a module of low cost which has high heat dissipation and is excellent in reliability. SOLUTION: In a ceramic substrate 2, a circuit 1 is formed on one main surface, and a metal layer 3 for heat dissipation is bonded to a reverse main surface. In this module structure, the plurality of ceramic substrates 2 are mounted on one main surface of a heat sink 5, the metal layers 3 are arranged on the heat sink 5 via brazing material layers, and each area of parts wherein the metal layers 3 are in contact with the heat sink 5 is at most 300 mm 2 . COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2014135410A Cooling type switching element module 有权
标题翻译：冷却式开关元件模块
公开(公告)号：JP2014135410A
公开(公告)日：2014-07-24
申请号：JP2013003121
申请日：2013-01-11
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： OSADA YUJI , USUI MASANORI , SUGIYAMA TAKAHIDE , SHOJI TOMOYUKI , HIROSE SATOSHI , IMAI MAKOTO , ORIMOTO NORIMUNE
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18 , H02M7/48 , H05K7/20
CPC分类号： H05K7/20927 , H01L24/34 , H01L24/37 , H01L24/40 , H01L2224/371 , H01L2224/37599 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve cooling performance and electrical performance and achieve downsizing in a switching element module having a cooling function.SOLUTION: A cooling type switching element module 1 includes: an outer conductor cylinder 24; an inner conductor cylinder 26 which transmits electric power with the outer conductor cylinder 24; first switching elements (32U, 32V, 32W); and second switching elements (36U, 36V, 36W). The inner conductor cylinder 26 has a protruding portion which protrudes from an opening of the outer conductor cylinder 24. The first switching elements are provided on an outer surface of the outer conductor cylinder 24 and the second switching elements are provided on an outer surface of the protruding portion. A refrigerant circulates at the inner side of the inner conductor cylinder 26 and the outer side of the outer conductor cylinder 24. The first switching elements and the second switching elements are cooled from both sides by the refrigerant circulating at the inner side of the inner conductor cylinder 26 and the refrigerant circulating at the outer side of the outer conductor cylinder 24.
摘要翻译：要解决的问题：提高冷却性能和电气性能，并实现具有冷却功能的开关元件模块的小型化。解决方案：冷却型开关元件模块1包括：外导体筒24; 与外部导体筒24发送电力的内部导体筒26; 第一开关元件（32U，32V，32W）; 和第二开关元件（36U，36V，36W）。内导体筒26具有从外导体筒24的开口突出的突出部。第一开关元件设置在外导体筒24的外表面上，第二开关元件设置在外导体筒24的外表面上。突出部分。制冷剂在内导体筒26的内侧和外导体筒24的外侧循环。第一开关元件和第二开关元件由内侧导体的内侧循环的制冷剂从两侧冷却气缸26和在外导体筒24的外侧循环的制冷剂。

10. 发明专利

JP2013179743A Component for inverter 有权
标题翻译：逆变器组件
公开(公告)号：JP2013179743A
公开(公告)日：2013-09-09
申请号：JP2012041425
申请日：2012-02-28
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： USUI MASANORI , OSADA YUJI , SHOJI TOMOYUKI , IMAI MAKOTO , TANIDA ATSUSHI
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a component in which a load is applied to a switching element and a bus bar to tightly adhere both with each other, and that configures a circuit for a single-phase of an inverter.SOLUTION: An inverter component comprises a tube 4, an upper stage module 20a, a lower stage module 20b, a positive electrode bus bar 12a, a negative electrode bus bar 26b, intermediate bus bars 26a and 12b, and a pressure member 6. A through-hole through which the positive electrode bus bar passes, a through-hole through which the negative electrode bus bar passes, and through-holes through which the intermediate bus bars pass, are formed on a side wall of the tube. The upper stage module and the lower stage module are inserted into the tube. The pressure member is fixed to the tube at a position where the pressure member is inserted into the tube from a shaft center direction of the tube. By means of the pressure member, a positive electrode and the positive electrode bus bar are tightly adhered with each other, an upper stage side intermediate electrode and the intermediate bus bar are tightly adhered with each other, a lower stage side intermediate electrode and the intermediate bus bar are tightly adhered with each other, and a negative electrode and the negative electrode bus bar are tightly adhered with each other. When the pressure member is removed, the upper stage module, the lower stage module, the positive electrode bus bar, the negative electrode bus bar, and the intermediate bus bar are separated.
摘要翻译：要解决的问题：提供一种对开关元件和母线施加负载以紧密地彼此粘附的部件，并且构成用于逆变器的单相的电路。解决方案：逆变器部件包括管4，上段模块20a，下段模块20b，正极母线12a，负极母线26b，中间母线26a和12b以及压力构件6。正极母线通过，负极母线通过的通孔和中间母线通过的通孔形成在管的侧壁上。上级模块和下级模块插入管中。压力构件在从管的轴心方向将压力构件插入管的位置处固定在管上。通过压力部件，正极和正极母线彼此紧密地粘合，上侧侧中间电极和中间母线彼此紧密地粘合，下侧侧中间电极和中间电极母线母线彼此紧密粘合，并且负极和负极母线彼此紧密地粘合。当去除压力构件时，分离上级模块，下级模块，正极母线，负极汇流条和中间母线。

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