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1. 发明专利

JP2003324901A Motor 有权
标题翻译：发动机
公开(公告)号：JP2003324901A
公开(公告)日：2003-11-14
申请号：JP2002126285
申请日：2002-04-26
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： MATSUI HIROHITO , HIRASAWA NAOKI , ONIMARU SADAHISA , HOSHI JUN , YAMADA ITSUSAKU
IPC分类号： H02K1/20 , H02K1/32 , H02K9/19
CPC分类号： Y02T10/641
摘要： PROBLEM TO BE SOLVED: To provide a motor which cools its inner parts such as a coil end, a rotor iron core, a stator iron core, etc. SOLUTION: This motor is provided with an oil pump 34 at its side 33. The oil pump 34 pumps up cooling oil collected at the bottom of a case 30, and jets the cooling oil from a jet nozzle 42 provided in an outlet via a passage 38. The cooling oil splashes on a coil end 17, thereby cooling the coil end 17. These outlets and jet nozzles 42 are provide in plural numbers. A part of the jetted cooling oil scatters upward, and penetrates into a gap 44 between the inner flank of the case 30 and the stator iron core by capillary phenomena, thereby reducing the heat resistance between the stator iron core 14 and the case 30. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供冷却其内部部件的电动机，例如线圈端，转子铁芯，定子铁芯等。解决方案：该电动机设有油泵34，其侧面33.油泵34泵送收集在壳体30底部的冷却油，并且通过通道38从设置在出口中的喷嘴42喷射冷却油。冷却油飞溅在线圈端17上，从而冷却线圈端部17.这些出口和喷嘴42被提供多个。喷射冷却油的一部分向上飞散，并通过毛细管现象穿透壳体30的内侧面和定子铁芯之间的间隙44，从而降低定子铁芯14与壳体30之间的耐热性。 P>版权所有（C）2004，JPO

2. 发明专利

JP2007104878A Stator core and rotary electric machine using same 审中-公开
标题翻译：定子芯和旋转电机使用相同
公开(公告)号：JP2007104878A
公开(公告)日：2007-04-19
申请号：JP2005295318
申请日：2005-10-07
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , ONIMARU SADAHISA , MATSUI HIROHITO , KANESHIRO HIROBUMI , HOSHI JUN
IPC分类号： H02K1/20 , H02K9/19
摘要： PROBLEM TO BE SOLVED: To improve cooling (heat radiation) performance of a stator core and further to improve cooling performance of rotary electric machine using a stator including the stator core.
SOLUTION: In the stator core 13 configured to laminate a plurality of pieces of electromagnetic steel plates 14, an insulating material (for example, insulating oil 15) with larger heat conductivity than air is filled in gap portions formed by surface roughness between the laminated electromagnetic steel plates 14.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高定子铁心的冷却（散热）性能，并进一步提高使用包括定子铁芯的定子的旋转电机的冷却性能。解决方案：在构造成层叠多片电磁钢板14的定子铁芯13中，将具有比空气更高的导热性的绝缘材料（例如绝缘油15）填充在由空气中形成的表面粗糙度层叠电磁钢板14.版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005045027A Cooling device of semiconductor element 有权
标题翻译：半导体元件冷却器件
公开(公告)号：JP2005045027A
公开(公告)日：2005-02-17
申请号：JP2003277672
申请日：2003-07-22
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , IMAI MAKOTO
IPC分类号： F25D9/00 , H01L23/36 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for efficiently cooling a semiconductor element.
SOLUTION: A plurality of spouting pipes 25 are provided under the semiconductor element 12. Cylindrical heat radiating fins 26 surrounding each pipe 25 are provided from a lower surface of an upper plate of a case 41 down below. A coolant spouted out from each pipe 25 is strongly spouted to the lower surface of the upper plate under the semiconductor element 12, and then flowing around a gap between the spouting pipes 25 and the heat radiating fins 26 and falling down the heat radiating fins 26. A flow velocity of the coolant flowing the lower surface of the upper plate and the heat radiating fins 26 is fast to be able to absorb the heat from the semiconductor element with high heat transfer coefficient.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于有效冷却半导体元件的冷却装置。解决方案：多个喷射管25设置在半导体元件12的下方。围绕每个管25的圆柱形散热片26从壳体41的上板的下表面向下设置。从每个管道25喷出的冷却剂在半导体元件12的下方被强烈地喷射到上板的下表面，然后围绕喷射管25和散热片26之间的间隙流动并且将散热片26落下流过上板和散热片26的下表面的冷却剂的流速很快能够以高传热系数从半导体元件吸收热量。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2008016872A Cooling device of semiconductor element 有权
标题翻译：半导体元件冷却器件
公开(公告)号：JP2008016872A
公开(公告)日：2008-01-24
申请号：JP2007257924
申请日：2007-10-01
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , IMAI MAKOTO
IPC分类号： H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for efficiently cooling a semiconductor element. SOLUTION: A plurality of spouting pipes 25 are provided under the semiconductor element 12. Cylindrical heat radiating fins 26 surrounding each of the spouting pipes 25 are provided from a lower surface of an upper plate of a case 41 down below. A coolant spouted out from each of the spouting pipes 25 is strongly spouted to the lower surface of the upper plate under the semiconductor element 12, and then flowing around a gap between the spouting pipes 25 and the heat radiating fins 26 and falling down the heat radiating fins 26. A flow velocity of the coolant flowing the lower surface of the upper plate and the heat radiating fins 26 is fast, thus, enabling the heat from the semiconductor element to be absorbed with a high heat transfer coefficient. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于有效冷却半导体元件的冷却装置。解决方案：多个喷射管25设置在半导体元件12的下方。围绕每个喷射管25的圆柱形散热片26从壳体41的上板的下表面向下设置。从每个喷射管25喷出的冷却剂被强力地喷射到半导体元件12下方的上板的下表面，然后在喷射管25和散热片26之间的间隙周围流动并且下降热量散热翅片26.流过上板和散热片26的下表面的冷却剂的流速是快速的，从而能够以高的传热系数吸收来自半导体元件的热量。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2005090862A Cooling system 审中-公开
标题翻译：冷却系统
公开(公告)号：JP2005090862A
公开(公告)日：2005-04-07
申请号：JP2003324725
申请日：2003-09-17
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： MATSUI HIROHITO , ONIMARU SADAHISA , HIRASAWA NAOKI , HOSHI JUN , ANPO KAZUHIRO
IPC分类号： F25B1/00
摘要： PROBLEM TO BE SOLVED: To efficiently cool an HV apparatus by using a vapor compression type refrigerating cycle. SOLUTION: An HV apparatus ECU executes a program including a step S2000 of detecting a current value of an inverter, a step S2010 of calculating a calorific value of the inverter, a step S2020 of measuring a current value of a motor, a step S2030 of measuring a rotational frequency of the motor, a step S2040 of calculating a coil calorific value of the motor, a step S2050 of calculating a core calorific value of the motor, a step S2060 of calculating a motor calorific value, a step S2070 of calculating an HV apparatus calorific value, a step S2080 of calculating a refrigerant flow rate with respect to the HV apparatus calorific value, and a step S2090 of outputting a control signal to a pump rotation control circuit so as to provide a pump rotational frequency wherein a refrigerant flow rate sent into a cooler becomes at least the calculated refrigerant flow rate. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过使用蒸气压缩式制冷循环来有效地冷却HV装置。解决方案：HV装置ECU执行包括检测逆变器的当前值的步骤S2000的程序，计算逆变器的发热量的步骤S2010，测量电动机的电流值的步骤S2020，步骤S2030，计算电动机的线圈发热量的步骤S2040;计算电动机的铁心发热量的步骤S2050;计算电动机发热量的步骤S2060;步骤S2070 计算HV装置发热量的步骤S2080，计算相对于HV装置发热量的制冷剂流量的步骤S2080，以及向泵旋转控制电路输出控制信号以提供泵旋转频率的步骤S2090，其中，送入冷却器的制冷剂流量至少为计算出的制冷剂流量。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005082066A Cooling system 审中-公开
标题翻译：冷却系统
公开(公告)号：JP2005082066A
公开(公告)日：2005-03-31
申请号：JP2003318067
申请日：2003-09-10
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： MATSUI HIROHITO , ONIMARU SADAHISA , HIRASAWA NAOKI , HOSHI JUN , ANPO KAZUHIRO
IPC分类号： B60H1/32 , F25B5/00
摘要： PROBLEM TO BE SOLVED: To solve an asleep phenomenon in a cooling system utilizing a vapor compression type refrigeration cycle.
SOLUTION: An HV apparatus ECU2000 executes a program including a step (S 1000) for determining the asleep of a coolant in an evaporator based on a signal from a coolant asleep state determination sensor for determining whether or not the coolant is remained in the evaporator; a step (S 1010) for operating a compressor when the coolant is asleep (YES at S 1000); a step (S 1030) for stopping the compressor after the compressor is operated for a constant time; a step (S 1040) for starting the HV apparatus of a vehicle to start the operation of a pump after the coolant asleep state in the evaporator is recovered by the operation of the compressor.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：解决利用蒸气压缩式制冷循环的冷却系统中的睡眠现象。解决方案：HV装置ECU2000执行包括步骤（S1000）的程序，用于基于来自用于确定冷却剂是否保持的冷却剂入睡状态确定传感器的信号来确定蒸发器中的冷却剂的睡眠蒸发器; 用于当冷却剂入睡时操作压缩机的步骤（S1010）（在S1000为是）。用于在压缩机运转一定时间后停止压缩机的步骤（S1030）; 通过压缩机的操作来恢复在蒸发器中的冷却剂入睡状态之后启动车辆的HV装置以开始操作的步骤（S1040）。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004180376A Rotating electric machine 有权
标题翻译：旋转电机
公开(公告)号：JP2004180376A
公开(公告)日：2004-06-24
申请号：JP2002341372
申请日：2002-11-25
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： MATSUI HIROHITO , ONIMARU SADAHISA , HIRASAWA NAOKI , HOSHI JUN , YAMADA ITSUSAKU
IPC分类号： H02K9/19
摘要： PROBLEM TO BE SOLVED: To improve cooling efficiency by further surely feeding cooling liquid from a coil end in a rotating electric machine.
SOLUTION: A gutter 28 is arranged so as to extend along the external periphery of the coil end at a position upwardly apart from the external periphery of the coil end in the rotating electric machine. A plurality of cooling-liquid feed ports 36 are formed at the bottom 28b of the gutter 28. Guides 38 are connected to the cooling-liquid feed ports 36. Each guide 38 is constituted as, for example, a cylindrical nozzle upwardly arranged on the back surface of the bottom 28b of the gutter 28. By this constitution, the cooling liquid goes along the guide 38 from the cooling-liquid feed port 36 and is discharged to a desired direction (i.e. the axial direction of the cylinder).
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过在旋转电机中进一步可靠地从线圈端供给冷却液来提高冷却效率。解决方案：沿旋转电机中的线圈端部的外周向上延伸的位置，沿着线圈端部的外周延伸设置沟槽28。多个冷却液供给口36形成在槽28的底部28b处。引导件38连接到冷却液供给口36.每个引导件38例如由向上设置在其上的圆柱形喷嘴构成通过这种结构，冷却液从冷却液供给口36沿导向件38排出，排出到期望的方向（即，气缸的轴向）。版权所有（C）2004，JPO

8. 发明专利

JP2005085998A Cooling device for electronic component 有权
标题翻译：电子元件冷却装置
公开(公告)号：JP2005085998A
公开(公告)日：2005-03-31
申请号：JP2003316868
申请日：2003-09-09
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , ARAI YOSHIHIDE
IPC分类号： F25D9/00 , H01L23/473 , H05K7/20
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide the cooling device of electronic components which is superior in heat radiating efficiency in a simple device configuration. SOLUTION: This electronic component cooling system is provided with a distributing tube 100 for distributing cooling water to a flat fin tube 110, a plurality of flat fin tubes 110 arranged so as to be lined with preliminarily decided first intervals and second interval, a manifold 120 for collecting the cooling water from the flat fin tubes 110, a semiconductor module 200 for double-side cooling which are the objects to be cooled arranged in the first intervals and corrugate fins 400 arranged in the second intervals. The flat fin tubes 110 and the corrugate fins 400 are configured, to develop elastic forces to make the flat fin tubes 110 adhere to the semiconductor modules 200 for double-side cooling and elastic forces to adhere the flat fin tubes 110 to the corrugate fins 400. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供在简单的装置结构中散热效率优异的电子部件的冷却装置。解决方案：该电子部件冷却系统设置有用于将冷却水分配到扁平翅片管110的分配管100，布置成预先确定的第一间隔和第二间隔的多个扁平翅片管110，用于从扁平翅片管110收集冷却水的歧管120，用于双侧冷却的半导体模块200，其是以第一间隔布置的待冷却对象，并且以第二间隔布置的波纹翅片400。扁平翅片管110和波纹翅片400被构造成产生弹性力以使扁平翅片管110粘附到用于双侧冷却的半导体模块200并且将扁平翅片管110粘附到波纹翅片400上的弹性力（C）2005，JPO＆NCIPI

9. 发明专利

JP2004357458A Dynamo electric motor cooling system for vehicle 有权
公开(公告)号：JP2004357458A
公开(公告)日：2004-12-16
申请号：JP2003154500
申请日：2003-05-30
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： MATSUI HIROHITO , HIRASAWA NAOKI , ONIMARU SADAHISA , HOSHI JUN , ANPO KAZUHIRO
IPC分类号： H02K9/19 , H02K9/18
摘要： PROBLEM TO BE SOLVED: To efficiently cool oil for cooling a vehicle motor.
SOLUTION: This motor cooling system for a vehicle 10 has the motor for vehicle 20, an oil circulation passage 40 for circulating oil for cooling, a power transmission device for vehicle 60, and a water-cooled jacket 70 for cooling the oil and provided at a part of an outer periphery of the power transmission device for the vehicle 60. A rotating portion 64, such as a gear, is provided at an inner portion of a case 62 of the power transmission device for the vehicle 60, and the oil 50 to be used for lubrication for the rotating portion flows at a higher speed by stirring up with the rotating portion 64. The water-cooled jacket 70 is attached at a position corresponding to the stirring-up portion. A part of the oil circulation passage can be passed in the water-cooled jacket for the motor case for cooling the oil. A part of the oil circulation passage may be passed through an oil-cooled device, in which high pressure side liquified refrigerant of a vehicle air conditioner passes.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005150419A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2005150419A
公开(公告)日：2005-06-09
申请号：JP2003386248
申请日：2003-11-17
申请人： Denso Corp , Nippon Soken Inc , 株式会社デンソー , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , ONIMARU SADAHISA , MATSUI HIROHITO , HIRANO NAOHIKO
IPC分类号： H01L23/29
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To specify an optimum interval of semiconductor elements to obtain proper heat sink characteristics in response to the sizes of a pair of heat sinks and the semiconductor elements in a semiconductor device formed by sandwiching the two semiconductor elements between the pair of the heat sinks. SOLUTION: A semiconductor device includes the two semiconductor elements 10, 20 which are interposed between the pair of heatsinks 30, 40 of the same size. Relations 2t≤x≤W-(w1+w2+2t) and W>w1+w2+4t are satisfied for the respective sizes w1, w2, x, W and t, where w1, w2 are the width of the first semiconductor element 10 along the arraying direction, in which the first semiconductor element 10 and the second semiconductor element 20 are arranged; x is the interval of both the semiconductor elements 10, 20, W is the width of both the heatsinks 30, 40 along the arraying direction; and t is the thickness. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了指定半导体元件的最佳间隔以响应于一对散热器和半导体器件中的半导体元件的尺寸而获得适当的散热器特性，该半导体器件通过将两个半导体元件夹在一对散热片。解决方案：半导体器件包括插入在相同尺寸的一对散热器30,40之间的两个半导体元件10,20。对于各个尺寸w1，w2，x，W和t，满足关系2t≤x≤W-（w1 + w2 + 2t），W> w1 + w2 + 4t，其中w1，w2是第一半导体元件的宽度沿排列方向排列第一半导体元件10和第二半导体元件20， x是半导体元件20,20的间隔，W是排列方向上的两个散热器30,40的宽度; t是厚度。版权所有（C）2005，JPO＆NCIPI

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