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1. 发明专利

JP2014216543A 半導体モジュール有权
标题翻译：半导体模块
公开(公告)号：JP2014216543A
公开(公告)日：2014-11-17
申请号：JP2013093978
申请日：2013-04-26
申请人：株式会社豊田中央研究所 , Toyota Central R&D Labs Inc , トヨタ自動車株式会社 , Toyota Motor Corp
发明人： SHOJI TOMOYUKI , OSADA YUJI , USUI MASANORI , IMAI MAKOTO , ORIMOTO NORIMUNE
IPC分类号： H01L23/34 , H01L25/07 , H01L25/18
CPC分类号： H01L23/34 , H01L25/04
摘要：【課題】半導体素子と配線層が圧接固定される圧接型の半導体モジュールにおいて、半導体素子が動作したときの温度分布に起因して半導体素子に加わる応力を緩和する技術を提供すること。【解決手段】圧接型の半導体モジュール1は、半導体素子4と配線層6の間に設けられており、圧接方向に直交する面内に配置されている複数の弾性機構10を備えている。弾性機構10は、半導体素子4に接触する導電性の接触体12、及び接触体12を半導体素子4に向けて付勢する弾性体14を有している。半導体素子4と配線層6は、接触体12を介して電気的に接続可能に構成されている。【選択図】図2
摘要翻译：要解决的问题：为了提供一种在半导体元件和半导体元件工作时由于温度分布而施加到半导体元件上的应力的技术，其中半导体元件和布线层是固定的压力压焊型半导体模块1包括设置在半导体元件4和布线层6之间的多个弹性机构10，并且设置在垂直于压接方向的平面中。弹性机构10包括：与半导体元件4接触的导电接触体12; 以及将接触体12朝向半导体元件4偏压的弹性体14.半导体元件4和布线层6通过接触体12形成为彼此电连接。

2. 发明专利

JP2014135410A Cooling type switching element module 有权
标题翻译：冷却式开关元件模块
公开(公告)号：JP2014135410A
公开(公告)日：2014-07-24
申请号：JP2013003121
申请日：2013-01-11
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： OSADA YUJI , USUI MASANORI , SUGIYAMA TAKAHIDE , SHOJI TOMOYUKI , HIROSE SATOSHI , IMAI MAKOTO , ORIMOTO NORIMUNE
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18 , H02M7/48 , H05K7/20
CPC分类号： H05K7/20927 , H01L24/34 , H01L24/37 , H01L24/40 , H01L2224/371 , H01L2224/37599 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve cooling performance and electrical performance and achieve downsizing in a switching element module having a cooling function.SOLUTION: A cooling type switching element module 1 includes: an outer conductor cylinder 24; an inner conductor cylinder 26 which transmits electric power with the outer conductor cylinder 24; first switching elements (32U, 32V, 32W); and second switching elements (36U, 36V, 36W). The inner conductor cylinder 26 has a protruding portion which protrudes from an opening of the outer conductor cylinder 24. The first switching elements are provided on an outer surface of the outer conductor cylinder 24 and the second switching elements are provided on an outer surface of the protruding portion. A refrigerant circulates at the inner side of the inner conductor cylinder 26 and the outer side of the outer conductor cylinder 24. The first switching elements and the second switching elements are cooled from both sides by the refrigerant circulating at the inner side of the inner conductor cylinder 26 and the refrigerant circulating at the outer side of the outer conductor cylinder 24.
摘要翻译：要解决的问题：提高冷却性能和电气性能，并实现具有冷却功能的开关元件模块的小型化。解决方案：冷却型开关元件模块1包括：外导体筒24; 与外部导体筒24发送电力的内部导体筒26; 第一开关元件（32U，32V，32W）; 和第二开关元件（36U，36V，36W）。内导体筒26具有从外导体筒24的开口突出的突出部。第一开关元件设置在外导体筒24的外表面上，第二开关元件设置在外导体筒24的外表面上。突出部分。制冷剂在内导体筒26的内侧和外导体筒24的外侧循环。第一开关元件和第二开关元件由内侧导体的内侧循环的制冷剂从两侧冷却气缸26和在外导体筒24的外侧循环的制冷剂。

3. 发明专利

JP2013179743A Component for inverter 有权
标题翻译：逆变器组件
公开(公告)号：JP2013179743A
公开(公告)日：2013-09-09
申请号：JP2012041425
申请日：2012-02-28
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： USUI MASANORI , OSADA YUJI , SHOJI TOMOYUKI , IMAI MAKOTO , TANIDA ATSUSHI
IPC分类号： H02M7/48 , H01L25/07 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a component in which a load is applied to a switching element and a bus bar to tightly adhere both with each other, and that configures a circuit for a single-phase of an inverter.SOLUTION: An inverter component comprises a tube 4, an upper stage module 20a, a lower stage module 20b, a positive electrode bus bar 12a, a negative electrode bus bar 26b, intermediate bus bars 26a and 12b, and a pressure member 6. A through-hole through which the positive electrode bus bar passes, a through-hole through which the negative electrode bus bar passes, and through-holes through which the intermediate bus bars pass, are formed on a side wall of the tube. The upper stage module and the lower stage module are inserted into the tube. The pressure member is fixed to the tube at a position where the pressure member is inserted into the tube from a shaft center direction of the tube. By means of the pressure member, a positive electrode and the positive electrode bus bar are tightly adhered with each other, an upper stage side intermediate electrode and the intermediate bus bar are tightly adhered with each other, a lower stage side intermediate electrode and the intermediate bus bar are tightly adhered with each other, and a negative electrode and the negative electrode bus bar are tightly adhered with each other. When the pressure member is removed, the upper stage module, the lower stage module, the positive electrode bus bar, the negative electrode bus bar, and the intermediate bus bar are separated.
摘要翻译：要解决的问题：提供一种对开关元件和母线施加负载以紧密地彼此粘附的部件，并且构成用于逆变器的单相的电路。解决方案：逆变器部件包括管4，上段模块20a，下段模块20b，正极母线12a，负极母线26b，中间母线26a和12b以及压力构件6。正极母线通过，负极母线通过的通孔和中间母线通过的通孔形成在管的侧壁上。上级模块和下级模块插入管中。压力构件在从管的轴心方向将压力构件插入管的位置处固定在管上。通过压力部件，正极和正极母线彼此紧密地粘合，上侧侧中间电极和中间母线彼此紧密地粘合，下侧侧中间电极和中间电极母线母线彼此紧密粘合，并且负极和负极母线彼此紧密地粘合。当去除压力构件时，分离上级模块，下级模块，正极母线，负极汇流条和中间母线。

4. 发明专利

JP2012227358A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2012227358A
公开(公告)日：2012-11-15
申请号：JP2011093721
申请日：2011-04-20
申请人： Toyota Central R&D Labs Inc , Toyota Motor Corp , Denso Corp , トヨタ自動車株式会社 , 株式会社デンソー , 株式会社豊田中央研究所
发明人： YAMADA YASUSHI , USUI MASANORI , IMAI MAKOTO , HARADA NAOICHI , KAWAHARA HIDEKI
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L24/32 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module which eases stress applied to an area between members, located in a heat transmission path of heat generated in a semiconductor element, when the members are exposed to heat change.SOLUTION: A semiconductor module 1 includes: an insulation substrate 20; a cooler 10; and a contact member 34. The contact member 34 is provided between the insulation substrate 20 and the cooler 10 so as to make a point contact or a line contact with at least one of the insulation substrate 20 and the cooler 10.
摘要翻译：要解决的问题：提供一种半导体模块，其在构件暴露于热变化时，使施加到位于半导体元件中产生的热的传热路径的构件之间的区域施加应力。解决方案：半导体模块1包括：绝缘基板20; 冷却器10; 和接触构件34.接触构件34设置在绝缘基板20和冷却器10之间，以便与绝缘基板20和冷却器10中的至少一个进行点接触或线接触。（C）2013，JPO＆INPIT

5. 发明专利

JP2013089828A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2013089828A
公开(公告)日：2013-05-13
申请号：JP2011230395
申请日：2011-10-20
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： SHOJI TOMOYUKI , OSADA YUJI , USUI MASANORI , NISHIBE YUJI , IMAI MAKOTO , TANIDA ATSUSHI , ATSUMI TAKASHI , FURUTA NORIBUMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module having a simple configuration.SOLUTION: A semiconductor module 10 comprises a first structure 10Ua and a second structure 10Ub. The first structure 10Ua and the second structure 10Ub have common configurations. A first output bus bar Uout1 of the first structure 10Ua and a high-voltage-side bus bar 10P of the second structure 10Ub have common configurations. A low-voltage-side bus bar 10N of the first structure 10Ua and a second output bus bar Uout2 of the second structure 10Ub have common configurations.
摘要翻译：要解决的问题：提供具有简单配置的半导体模块。解决方案：半导体模块10包括第一结构10Ua和第二结构10Ub。第一结构10Ua和第二结构10Ub具有共同的结构。第一结构10Ua的第一输出汇流条Uout1和第二结构10Ub的高压侧汇流条10P具有共同的结构。第一结构10Ua的低压侧母线10N和第二结构10Ub的第二输出母线Uout2具有共同的结构。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013021808A Bus bar and electric power conversion system having the same 有权
标题翻译： BUS BAR和电力转换系统
公开(公告)号：JP2013021808A
公开(公告)日：2013-01-31
申请号：JP2011152803
申请日：2011-07-11
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社 , Denso Corp , 株式会社デンソー
发明人： YAMADA YASUSHI , USUI MASANORI , KOJIMA TAKASHI , IMAI MAKOTO , ISHINO HIROSHI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To take proper measures against heat transmitted from a switching element to an external circuit element through a bus bar.SOLUTION: The bus bars 14P, 14N have a high-voltage bus bar 14P and a low-voltage bus bar 14N, respectively. At least either one of the high-voltage bus bar 14P and the low-voltage bus bar 14N includes reciprocating structure sections 34P, 34N reciprocating through an outside portion and an inside portion. The outside portion and the inside portion of the reciprocating structure sections 34P, 34N face each other at a predetermined interval.
摘要翻译：要解决的问题：对通过母线从开关元件传递到外部电路元件的热量采取适当的措施。汇流条14P，14N分别具有高压汇流条14P和低压母线14N。高压母线14P和低压母线14N中的至少任一个包括通过外部部分和内部部分往复运动的往复式结构部分34P，34N。往复结构部34P，34N的外侧部分和内侧部分以预定的间隔相互面对。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013251472A Heat transfer member and module comprising the same 有权
标题翻译：传热部件和包含其的模块
公开(公告)号：JP2013251472A
公开(公告)日：2013-12-12
申请号：JP2012126705
申请日：2012-06-04
申请人： Toyota Central R&D Labs Inc , 株式会社豊田中央研究所 , Toyota Motor Corp , トヨタ自動車株式会社
发明人： ASADA TAKASHI , USUI MASANORI , SHOJI TOMOYUKI , IMAI MAKOTO , TANIDA ATSUSHI
IPC分类号： H01L23/36 , H01L21/60 , H01L23/34 , H01L23/48
CPC分类号： H01L23/49568 , H01L23/36 , H01L23/3735 , H01L23/473 , H01L23/492 , H01L24/29 , H01L24/33 , H01L2224/29111 , H01L2924/0132 , H01L2924/0133 , H01L2924/10253 , H01L2924/10272 , H01L2924/1301 , H01L2924/13055 , H01L2924/13064 , H01L2924/13091 , H01L2924/00 , H01L2924/01029 , H01L2924/0105 , H01L2924/01047
摘要： PROBLEM TO BE SOLVED: To provide a heat transfer member capable of suppressing a gap in thermal expansion between the heat transfer member and a semiconductor element, and having a high heat radiation effect as well.SOLUTION: A heat transfer member 40 is provided between a semiconductor element 30 and an electrode plate 50. The heat transfer member 40 comprises a metal part 42 extending between a first surface 40A on a side of the semiconductor element 30 and a second surface 40B on a side of the electrode plate 50, and a ceramic part 44 surrounding the metal part 42. In the metal part 42, an area of the first surface 40A is smaller than an area of the second surface 40B.
摘要翻译：要解决的问题：提供能够抑制传热构件和半导体元件之间的热膨胀间隙并且具有高散热效果的传热构件。解决方案：传热构件40设置在半导体元件30和电极板50.传热构件40包括在半导体元件30的一侧的第一表面40A和在电极板50的侧面上的第二表面40B之间延伸的金属部分42，以及陶瓷围绕金属部分42的部分44.在金属部分42中，第一表面40A的区域小于第二表面40B的面积。

8. 发明专利

JP2010021188A Semiconductor power conversion module 有权
标题翻译：半导体功率转换模块
公开(公告)号：JP2010021188A
公开(公告)日：2010-01-28
申请号：JP2008177887
申请日：2008-07-08
申请人： Shin Kobe Electric Mach Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 新神戸電機株式会社
发明人： IWATSUKI YASUHITO , YAMANAKA HIROYUKI , IMAI MAKOTO
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/48139 , H01L2224/48247
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor power conversion module whose shape is made compact and which can reduce the number of connection places caused by connection lines. SOLUTION: A first conductor 9 is configured such that tips of extension conductor portions 10C to 12C of second conductors 10 to 12 are exposed beyond a first DC line constitution portion 16. The tips of the extension conductor portions of the second conductors 10 to 12 are respectively connected to input/output electrodes of semiconductor switch elements 1A, 1C, and 1E bonded to an element bonding portion of the first conductor 9 through connection lines L1 to L3. A second DC line constitution portion 22 which constitutes a second DC line N is embedded in a partition portion 26 of a housing 23. The second DC line constitution portion 22 extends along the first DC line constitution portion 16 while electrically insulated from the first DC line constitution portion 16, and also electrically connected to input/output electrodes of semiconductor switch elements 1B, 1D, and 1F through connection lines L4 to L6. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体功率转换模块，其形状紧凑并且可以减少由连接线引起的连接位置的数量。解决方案：第一导体9被配置为使得第二导体10至12的延伸导体部分10C至12C的尖端暴露于第一DC线构造部分16之外。第二导体10的延伸导体部分的尖端分别连接到通过连接线L1至L3接合到第一导体9的元件接合部分的半导体开关元件1A，1C和1E的输入/输出电极。构成第二直流线路N的第二直流线路构成部分22嵌入在壳体23的分隔部分26中。第二直流线构造部分22沿着第一直流配线部分16延伸，同时与第一直流线路构成部分16，并且还通过连接线L4至L6电连接到半导体开关元件1B，1D和1F的输入/输出电极。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2008177622A Module structure 有权
标题翻译：模块结构
公开(公告)号：JP2008177622A
公开(公告)日：2008-07-31
申请号：JP2008104283
申请日：2008-04-14
申请人： Denki Kagaku Kogyo Kk , Toyota Motor Corp , トヨタ自動車株式会社 , 電気化学工業株式会社
发明人： SUGIMOTO ISAO , UTO MANABU , IBUKIYAMA MASAHIRO , IMAI MAKOTO
IPC分类号： H01L23/34
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high-reliability and low-cost module having high heat dissipation properties. SOLUTION: The module structure has a ceramic substrate 2, having a circuit 1 formed on a first main plane and a heat dissipation metal layer 3 bonded on the opposite of the main plane; the module structure has a plurality of the ceramic substrate 2 on a main plane of a heat sink 5; and the heat dissipation metal layer 3 is formed with a solder material layer on the heat sink 5, and each areas of the portions, where the heat dissipation metal layer 3 and the heat sink 5 are contacted, are not larger than 300 mm 2 , respectively. COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2007329330A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2007329330A
公开(公告)日：2007-12-20
申请号：JP2006159950
申请日：2006-06-08
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： IMAI MAKOTO
IPC分类号： H01L23/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of determining a temperature environment of an entire semiconductor power elements by measuring the temperature of a small number of semiconductor power elements. SOLUTION: The semiconductor device having a power module 10 comprising a plurality of semiconductor power elements 11 has the semiconductor power element 11 on the power module 10, a semiconductor power element 20 with a low cooling efficiency existing in an area with a temperature environment worse than that of the semiconductor power element 11, and a temperature sensor for measuring the temperature of the semiconductor power element 20 with the low cooling efficiency. The temperature environment of the entire semiconductor power elements 11 on the power module 10 is determined based on the temperature measured by the temperature sensor. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够通过测量少量半导体功率元件的温度来确定整个半导体功率元件的温度环境的半导体器件。解决方案：具有包括多个半导体功率元件11的功率模块10的半导体器件在功率模块10上具有半导体功率元件11，具有低冷却效率的半导体功率元件20存在于具有温度环境劣于半导体功率元件11的环境，以及用于以低冷却效率测量半导体功率元件20的温度的温度传感器。基于由温度传感器测量的温度来确定功率模块10上的整个半导体功率元件11的温度环境。版权所有（C）2008，JPO＆INPIT

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