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1. 发明专利

JP2005085998A Cooling device for electronic component 有权
标题翻译：电子元件冷却装置
公开(公告)号：JP2005085998A
公开(公告)日：2005-03-31
申请号：JP2003316868
申请日：2003-09-09
申请人： Nippon Soken Inc , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社日本自動車部品総合研究所
发明人： HIRASAWA NAOKI , MATSUI HIROHITO , ARAI YOSHIHIDE
IPC分类号： F25D9/00 , H01L23/473 , H05K7/20
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1301 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide the cooling device of electronic components which is superior in heat radiating efficiency in a simple device configuration. SOLUTION: This electronic component cooling system is provided with a distributing tube 100 for distributing cooling water to a flat fin tube 110, a plurality of flat fin tubes 110 arranged so as to be lined with preliminarily decided first intervals and second interval, a manifold 120 for collecting the cooling water from the flat fin tubes 110, a semiconductor module 200 for double-side cooling which are the objects to be cooled arranged in the first intervals and corrugate fins 400 arranged in the second intervals. The flat fin tubes 110 and the corrugate fins 400 are configured, to develop elastic forces to make the flat fin tubes 110 adhere to the semiconductor modules 200 for double-side cooling and elastic forces to adhere the flat fin tubes 110 to the corrugate fins 400. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供在简单的装置结构中散热效率优异的电子部件的冷却装置。解决方案：该电子部件冷却系统设置有用于将冷却水分配到扁平翅片管110的分配管100，布置成预先确定的第一间隔和第二间隔的多个扁平翅片管110，用于从扁平翅片管110收集冷却水的歧管120，用于双侧冷却的半导体模块200，其是以第一间隔布置的待冷却对象，并且以第二间隔布置的波纹翅片400。扁平翅片管110和波纹翅片400被构造成产生弹性力以使扁平翅片管110粘附到用于双侧冷却的半导体模块200并且将扁平翅片管110粘附到波纹翅片400上的弹性力（C）2005，JPO＆NCIPI

2. 发明专利

JP2004363337A Cooling structure for semiconductor device 有权
公开(公告)号：JP2004363337A
公开(公告)日：2004-12-24
申请号：JP2003160175
申请日：2003-06-05
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： IMAI MAKOTO , ARAI YOSHIHIDE
IPC分类号： H01L23/34 , H01L23/36 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a cooling structure for semiconductor device which can ensure insulation properties.
SOLUTION: A semiconductor package 12 which contains a semiconductor device 10 and electrically conductive heat radiating plates 18, 20 which clamps the semiconductor device 10 from both sides thereof, is dipped in a cooling liquid 16 in a cooler 14. The semiconductor package 12 further includes portions 18-1, 20-1 of the heat sinks 18, 20, respectively, which are dipped in the cooling liquid 16, and an insulating member 22 which covers the semiconductor device 10.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2003009507A Switch circuit 有权
标题翻译：开关电路
公开(公告)号：JP2003009507A
公开(公告)日：2003-01-10
申请号：JP2001181345
申请日：2001-06-15
申请人： Denso Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 株式会社デンソー
发明人： ARAI YOSHIHIDE , HIRANO NAOHIKO
IPC分类号： H02G3/16 , H02M1/00 , H02M7/00 , H02M7/48 , H02P1/00
CPC分类号： H02M7/003 , H01L2224/49111 , H01L2224/49175 , H01L2924/19107 , H05K7/1432
摘要： PROBLEM TO BE SOLVED: To attain further miniaturization and weight reduction of a switch circuit with a bus bar which acts as a conductor for connecting a switching element to a power source or a load, while ensuring flexural rigidity of the switch circuit and insulation between a plurality of bus bars. SOLUTION: A plurality of different bus bars 14P, 14N are fixed onto a base 12 so as to be fastened through an insulating material 18. The insulating material 18 ensures the insulation of the bus bars 14P, 14N, and integration of the bus bars 14P, 14N and the insulating material 18 increases the flexural rigidity and the strength of the switch circuit 10. By reversing the current direction of the bus bars 14P, 14N, inductance of the bus bars 14P, 14N, and induced voltage during switching (flyback voltage) can be reduced.
摘要翻译：要解决的问题：为了进一步小型化和开关电路的重量减轻，该母线用作用于将开关元件连接到电源或负载的导体，同时确保开关电路的抗弯刚度和多个母线。解决方案：多个不同的母线14P，14N固定在基座12上，以便通过绝缘材料18紧固。绝缘材料18确保母线14P，14N的绝缘，以及母线14P的整合 14N，并且绝缘材料18增加了开关电路10的抗弯刚度和强度。通过反转母线14P，14N的电流方向，母线14P，14N的电感和开关期间的感应电压（回扫电压）可以减少。

4. 发明专利

JP2008258199A Heat transfer sheet, and heat dissipation structure 有权
标题翻译：热转印片和散热结构
公开(公告)号：JP2008258199A
公开(公告)日：2008-10-23
申请号：JP2007095528
申请日：2007-03-30
申请人： Sumitomo Bakelite Co Ltd , Toyota Motor Corp , Toyota Tsusho Corp , トヨタ自動車株式会社 , 住友ベークライト株式会社 , 豊田通商株式会社
发明人： MURATA TAKASHI , NAKAMURA KOJI , TAKAHASHI IZUMI , SO HATSUHIRO , SHIMIZU KAZUMOTO , ARAI YOSHIHIDE , ITO SHINICHIRO , KAWAGUCHI HITOSHI , SUGINO MITSUO
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： F28F3/02 , B23P15/26 , C09K5/14 , F28F2013/006 , H01L23/34 , H01L23/3733 , H01L23/3737 , H01L23/433 , H01L2924/0002 , Y10T29/49352 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat transfer sheet which can keep the temperature of a heat dissipation object within a desired range by preventing both supercooling and excessive temperature rise under an environment of wide temperature range from low temperature to high temperature, and to provide a heat dissipation structure employing that heat transfer sheet.
SOLUTION: The heat transfer sheet 1 comprises a heat transfer layer 3 having a first part 31 and a second part 32 provided at a position different from the first part 31 in the plan view and expanding/contracting at a bigger expansion/contraction rate than the first part 31 in the thickness direction depending on the temperature variation. The transfer sheet 1 is arranged to make an air gap 33 between the second part 32 and a partner body 5 when the temperature of the heat transfer layer 3 is below a predetermined level under use state, thus reducing thermal conductivity between a heat dissipation object 4 and the partner body 5, and to eliminate the air gap 33 substantially when the temperature of the heat transfer layer 3 is above a predetermined level, thus enhancing thermal conductivity between a heat dissipation object 4 and the partner body 5.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种传热片，其能够在从低温到高温的宽温度范围的环境中防止过冷和过度的温度升高，从而将散热物体的温度保持在期望的范围内，并提供采用该传热片的散热结构。解决方案：传热片1包括传热层3，其具有在平面图中设置在与第一部分31不同的位置处的第一部分31和第二部分32，并且以更大的伸缩收缩速率比第一部分31在厚度方向上取决于温度变化。当转印层1在使用状态下传热层3的温度低于预定水平时，转印纸1被布置成在第二部分32和对方体5之间形成气隙33，从而降低散热物体4 和配对体5，并且当传热层3的温度高于预定水平时，基本上消除气隙33，从而提高散热物体4和配对体5之间的导热性。版权所有：（C）2009，JPO＆INPIT

5. 发明专利

JP2004055926A Electrode mounting structure 有权
公开(公告)号：JP2004055926A
公开(公告)日：2004-02-19
申请号：JP2002213055
申请日：2002-07-22
申请人： Toyoda Iron Works Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田鉄工株式会社
发明人： ARAKI RYUJI , SONE YASUHIRO , UMEMURA SHOJI , ARAI YOSHIHIDE
IPC分类号： H01L25/07 , H01L23/48 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To realize superior insulation characteristics even when the distance W is small for a pair of electrodes connected to a power supply and the like set with the prescribed separated length W and buried in a body with a case.
SOLUTION: A pair of electrodes 12 and 14 are separated by a separation wall 20 of a spacer 18 with a separation length W, and the surface of the spacer 18 is melted and jointed in a body with a case 10 during formation of the case 10. Then, the pair of electrode 12 and 14 are not only isolated by the separation wall 20 of the spacer 18 but isolated by the case 10 with which the spacer 18 are jointed in a body, so a creeping distance is made long and insulation performance becomes high. Since the pair of electrodes 12 and 14 are prevented from coming off by a fastening claws 26, 28 set in electrode storing grooves 22 and 24, there is no fear of coming-off of the electrodes 12 and 14 from the electrode storing grooves 22 and 24 through flow of melting resin during injection molding of the case 10, and prescribed insulation characteristics can be obtained.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2005094847A Resin molded electrode 有权
标题翻译：树脂模具电极
公开(公告)号：JP2005094847A
公开(公告)日：2005-04-07
申请号：JP2003321694
申请日：2003-09-12
申请人： Toyoda Iron Works Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田鉄工株式会社
发明人： ARAKI RYUJI , UMEMURA SHOJI , SONE YASUHIRO , ARAI YOSHIHIDE , IMAI MAKOTO
IPC分类号： B29C45/14 , B29L31/34 , H02G3/16
摘要： PROBLEM TO BE SOLVED: To provide a desired electrode shape by controlling deformation after molding with no separate member required.
SOLUTION: Shapes of electrode metals 14 and 16 are so specified that the voluminal ratio A/B of upper and lower synthetic resin 26 of the electrode metals 14 and 16 is a prescribed value. So, on the basis of the contracting force of synthetic resin 26 and directivity in the rigidity of the electrode metals 14 and 16, the deformation of a resin mold electrode 10 is controlled, easily providing a desired shape without the use of an insulator, at a low cost. A lower end surface 22 is so secured as for a heat radiation surface to tightly fit a heat sink 24, but the voluminal ratio A/B is set to be 0.5-0.8 to allow almost flat or gentle convex shape on the lower end surface 22. Thus, the lower end surface 22 is tightly contacted to the flat contact surface of the heat sink 24 by surface contact, for excellent heat radiation action.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过控制成型后的变形而不需要单独的部件来提供期望的电极形状。解决方案：电极金属14和16的形状被规定为电极金属14和16的上下合成树脂26的体积比A / B是规定值。因此，在合成树脂26的收缩力和电极金属14,16的刚性方向性的基础上，控制树脂模具电极10的变形，容易地提供期望的形状而不使用绝缘体，成本低。下端面22固定在散热面上以紧密地配合散热器24，但体积比A / B被设定为0.5-0.8，以允许在下端表面22上几乎平坦或平缓的凸起形状因此，通过表面接触，下端面22与散热器24的平坦接触面紧密接触，具有出色的散热作用。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005050670A Manufacturing method of terminal device 审中-公开
标题翻译：终端设备的制造方法
公开(公告)号：JP2005050670A
公开(公告)日：2005-02-24
申请号：JP2003281295
申请日：2003-07-28
申请人： Toyoda Iron Works Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田鉄工株式会社
发明人： SONE YASUHIRO , UMEMURA SHOJI , ARAI YOSHIHIDE
IPC分类号： H01R43/16 , H01R43/24
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a terminal device restraining generation of flash and deformation on a tip part of a male terminal due to cutting, enabling to connect a female connector without requiring post-work like coining.
SOLUTION: A conduction part 20, having a plurality of conductive plates 12 of which both end parts are jointed to the conduction part through tie-bars 22, 24, in order to position the base pedestal made of synthetic resin when inserting and forming the base pedestal, is arranged so as to be easily cut off with high precision, by arranging notches 26, 28, 30 at cutting positions C1, C2 where the tie-bars 22, 24 are cut off after insert-forming a base pedestal made of synthetic resin. The notches 26, 28 are formed in directions of width and thickness of the plate respectively at one end part side 12a used as the male terminal, and the tip part of the one end part 12a is formed into a truncated quadrangular pyramid shape.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种终端装置的制造方法，该终端装置抑制由于切割而导致的阳端子的尖端部分产生闪光和变形，能够连接母连接器，而不需要像压印那样的后期工作。解决方案：具有多个导电板12的导电部分20，其中两个端部通过连杆22,24接合到导电部分，以便在插入时定位由合成树脂制成的基座，并且通过在切割位置C1，C2处设置切口26,28,30，在插入形成基座之后切断连杆22,24的方式，形成基座，被布置成可以高精度地容易地切断由合成树脂制成。切口26,28分别在用作阳端子的一个端部部分侧12a处形成在板的宽度和厚度方向上，并且一个端部12a的前端部形成为截头四棱锥形。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004106468A Structure of joint part for resin component 有权
公开(公告)号：JP2004106468A
公开(公告)日：2004-04-08
申请号：JP2002275304
申请日：2002-09-20
申请人： Toyoda Iron Works Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田鉄工株式会社
发明人： WATANABE MASAHIRO , SONE YASUHIRO , ARAI YOSHIHIDE , IMAI MAKOTO
IPC分类号： F16B37/04 , B29C33/12 , B29K105/22 , H02B1/20
摘要： PROBLEM TO BE SOLVED: To prevent a resin material from penetrating into a tapped hole from its space without pressing a closed-end nut to an insert member by a mold or the like when the insert member and the closed-end nut are integrally fixed to a resin component by insert molding.
SOLUTION: The resin material is prevented from penetrating into the tapped hole 28 between a cap nut 22 and a connection terminal 16 during the insert molding due to closing the space to the connection terminal 16 extended over all perimeter by providing a fitting protrusion part 26 to the tapped hole opening part of the cap nut 22, and being pressed in a bolt insertion hole 16h and integrally fixing. Since the protrusion dimension t of the fitting protrusion part 26 is within the limits of 80% to 95% of the wall thickness of the connection terminal 16, there is no possibility that the tip of the fitting protrusion part 26 results in abutting on an external electrode 18 due to the elastic deformation of the connection terminal 16 or the like, and on the other hand, the problem that the cap nut 22 is pulled out from the bolt insertion hole 16h and a position is shifted is satisfactorily prevented.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2003273544A Electrode mounting structure and case of electric apparatus 审中-公开
标题翻译：电器安装结构与电气设备案例
公开(公告)号：JP2003273544A
公开(公告)日：2003-09-26
申请号：JP2002074309
申请日：2002-03-18
申请人： Toyoda Iron Works Co Ltd , Toyota Motor Corp , トヨタ自動車株式会社 , 豊田鉄工株式会社
发明人： SONE YASUHIRO , AGATA HIDEKI , ARAI YOSHIHIDE
IPC分类号： H05K7/12 , H01H9/02 , H02M3/00 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To easily arrange an electrode on a case without using insertion molding. SOLUTION: Since an electrode 12 is inserted into a groove between an external wall 26 and a partition plate 28, and an electrode 14 is kept in a state where it is sandwiched between the plate 28 and a holding member 22, there is no possibility that a main body member 20 is not deformed due to a difference in thermal expansion between the electrodes 12, 14 and a synthetic resin in molding and cooling in comparison with a case that the electrodes 12, 14 are integrally fixed by insertion molding, and the dimension accuracy and shape accuracy can be improved. Since there is no risk that the electrodes 12, 14 are not deformed due to an injection pressure and a distance D can be secured with higher accuracy by the portion 28, a desired insulation performance can be obtained. Since the electrodes 12, 14 are each pressurized by the member 20 to be integrally fixed, troubles caused by looseness or bending can be prevented. COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了容易地将电极布置在壳体上而不使用插入成型。解决方案：由于电极12插入到外壁26和隔板28之间的槽中，并且电极14保持在夹在板28和保持构件22之间的状态，因此存在与通过插入成型一体地固定电极12,14的情况相比，由于电极12,14之间的热膨胀差和成型和冷却中的合成树脂的差异，主体部件20不可能发生变形，可以提高尺寸精度和形状精度。由于不会由于注入压力而使电极12,14变形，并且可以通过部分28以更高的精度确保距离D的风险，所以可以获得期望的绝缘性能。由于电极12,14各自被构件20加压以一体地固定，所以可以防止由松动或弯曲引起的麻烦。版权所有（C）2003，JPO

10. 发明专利

JP2002208661A STRUCTURE FOR HOLDING SUBSTRATE LOADED WITH CHIP 失效
公开(公告)号：JP2002208661A
公开(公告)日：2002-07-26
申请号：JP2001002592
申请日：2001-01-10
申请人： TOYOTA MOTOR CORP
发明人： KANEDA TAKASUKE , SAKAMOTO HIDEMITSU , SAITO HIROAKI , ARAI YOSHIHIDE , IMAI MAKOTO
IPC分类号： H01L23/40
摘要： PROBLEM TO BE SOLVED: To suppress distortions and cracks of a substrate loaded with chips, by holding at the time of holding the substrate loaded with electronic device chips on a heat radiating plate. SOLUTION: By using magnetic force acting between the permanent magnet 42 of a holding member 40 and a yoke member 44, the substrate 20 loaded with the electronic device chips 10 and 12 is held on the heat radiation plate 30. By holding it in such a manner, the substrate 20 loaded with the chips is held on the heat radiation plate 30, even without having to apply high pressurize on the substrate 20 loaded with the chips. As a result, distortions and the cracks to be generated on the substrate 20 loaded with the chips are suppressed.

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