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    • 1. 发明授权
    • Nonvolatile semiconductor memory apparatus
    • 非易失性半导体存储装置
    • US07317630B2
    • 2008-01-08
    • US11182374
    • 2005-07-15
    • Nicola TeleccoVijay P. AdusumilliAnil GuptaEdward HuiSteven J. Schumann
    • Nicola TeleccoVijay P. AdusumilliAnil GuptaEdward HuiSteven J. Schumann
    • G11C5/06
    • G11C7/10H01L2224/05553H01L2224/48137H01L2224/49175
    • A nonvolatile memory apparatus includes a separate controller circuit and memory circuit. The controller circuit is fabricated on a first integrated circuit chip. The controller circuit includes a plurality of charge pump circuits, a system interface logic circuit, a memory control logic circuit, and one or more analog circuits. The memory circuit is fabricated on a second integrated circuit chip and includes a column decoder, a row decoder, a control register, and a data register. A memory-controller interface area includes a first plurality of die bond pads on the first integrated circuit chip and a second plurality of die bond pads on the second integrated circuit chip such that the first and second integrated circuit chips may be die-bonded together. A single controller circuit may interface with a plurality of memory circuits, thus further reducing overall costs as each memory circuit does not require a dedicated controller circuit.
    • 非易失性存储装置包括单独的控制器电路和存储器电路。 控制器电路制造在第一集成电路芯片上。 控制器电路包括多个电荷泵电路,系统接口逻辑电路,存储器控制逻辑电路和一个或多个模拟电路。 存储器电路制造在第二集成电路芯片上,并且包括列解码器,行解码器,控制寄存器和数据寄存器。 存储器控制器接口区域包括第一集成电路芯片上的第一多个管芯接合焊盘和第二集成电路芯片上的第二多个管芯接合焊盘,使得第一和第二集成电路芯片可以芯片结合在一起。 单个控制器电路可以与多个存储器电路接口,从而进一步降低总体成本,因为每个存储器电路不需要专用控制器电路。
    • 2. 发明授权
    • Page mode erase in a flash memory array
    • 页面模式在闪存阵列中擦除
    • US06359810B1
    • 2002-03-19
    • US09542434
    • 2000-04-04
    • Anil GuptaSteven J. Schumann
    • Anil GuptaSteven J. Schumann
    • G11C1604
    • G11C5/147G11C16/16
    • In a sector in a flash memory array PAGE ERASE and MULTIPLE PAGE ERASE modes of operation are provided. In the PAGE ERASE and MULTIPLE PAGE ERASE modes of operation, a preferred tunneling potential of approximately −10 Volts is applied to the gates of the flash memory cells on the row or rows being selected for erasure, and the bitlines connected to the drains of the flash memory cells are driven to a preferred voltage of approximately 6.5 Volts. To reduce the unintended erasure of memory cells in rows other than the selected row or rows, a preferred bias voltage of approximately 1 to 2 Volts is applied to the gates of all the flash memory cells in the rows other than the selected row or rows.
    • 在闪存阵列的扇区中,提供了PAGE ERASE和MULTIPLE PAGE ERASE操作模式。 在PAGE ERASE和MULTIPLE PAGE ERASE操作模式下,将大约-10伏特的优选隧道电位施加到被选择用于擦除的行或行上的闪存单元的栅极,并且连接到 闪存单元被驱动到大约6.5伏的优选电压。 为了减少存储器单元在非所选择的行或行以外的行中的非预期擦除,将大约1至2伏特的优选偏置电压施加到除所选择的行或行之外的行中的所有快闪存储器单元的栅极。
    • 3. 发明授权
    • Dual buffer flash memory architecture with multiple operating modes
    • US5822245A
    • 1998-10-13
    • US824175
    • 1997-03-26
    • Anil GuptaSteven J. Schumann
    • Anil GuptaSteven J. Schumann
    • G11C7/10G11C16/10G11C16/26G11C11/34
    • G11C7/1045G11C16/10G11C16/26G11C16/3431
    • A flash memory array architecture comprising a flash memory array, first and second memory buffer, and I/O interface circuit which has several operating modes which permit data to be read from the flash memory array, several operating modes which permit data to be programmed into the flash memory array, and a mode for rewriting the data in the flash memory array.In the four read modes, one of the pages stored in the flash memory array is read, the data stored in either of first or second memory buffers is read, the data in one of the pages of data stored in the flash memory array is read and then written into either of first or second memory buffers, the data in one of the pages of data stored in the flash memory array is read and then compared to the data read from either of first or second memory buffers. In the four write modes, data from an input stream is written into a selected first or second memory buffer, one of the pages of data stored in the flash memory array is erased, and then in the same cycle, data in either of first or second memory buffers is written into the erased page in the flash memory array, data in either of first or second memory buffers is written into a previously erased page in the flash memory array, and data from an input stream is written into the selected first or second memory buffer, one of the pages of data stored in the flash memory array is erased, and then in the same cycle, data in either of first or second memory buffers is written into the erased page in the flash memory array. In the auto page rewrite mode, the data in one of the pages of data stored in the flash memory array is read and then written into either of first or second memory buffers. The data stored in the page of the flash memory array just read is erased, and then in the same cycle, the page of data stored in the selected first or second memory buffer is written into the erased page in the flash memory array.
    • 8. 发明授权
    • Combined program and data nonvolatile memory with concurrent
program-read/data write capability
    • 组合的程序和数据非易失性存储器,具有并行程序读取/数据写入功能
    • US5732017A
    • 1998-03-24
    • US829378
    • 1997-03-31
    • Steven J. SchumannFai ChingSai K. Tsang
    • Steven J. SchumannFai ChingSai K. Tsang
    • G11C16/02G11C11/00G11C16/04G11C16/10G11C16/26G11C11/34
    • G11C11/005G11C16/10G11C16/26
    • A nonvolatile memory device includes two floating-gate-type memory arrays, e.g. a flash memory intended to be used as a relatively permanent program memory and an E.sup.2 PROM intended to be used as a more frequently updated data memory. A single set of address lines and a single set of data lines are used for both read and write operations for both memory arrays. Address decoding means for accessing an addressed location of a selected memory array includes separate column decoders and data latches for each array, but also includes a shared row decoder common to both arrays. Row address latching circuitry associated with at least the data memory holds a decoded row address for that memory array during a write operation so as to free the shared row decoder for use on one or more concurrent read operations for the other memory array, e.g. the program memory. Data I/O buffer circuitry and sense amplifiers are also shared by both arrays. Control logic, responsive to input control signals selecting one of the memory arrays and selecting a read or write operation, controls the various elements of the device, including address and data latches and select/driver circuitry, to carry out the desired operations.
    • 非易失性存储器件包括两个浮栅型存储器阵列,例如, 旨在用作相对永久的程序存储器的闪存和旨在用作更频繁更新的数据存储器的E2PROM。 一组地址线和一组数据线用于两个存储器阵列的读和写操作。 用于访问所选择的存储器阵列的寻址位置的地址解码装置包括用于每个阵列的单独的列解码器和数据锁存器,但是还包括两个阵列共用的共享行解码器。 与至少数据存储器相关联的行地址锁存电路在写入操作期间保持该存储器阵列的解码行地址,从而释放共享行解码器以用于另一个存储器阵列的一个或多个并行读取操作,例如, 程序存储器 数据I / O缓冲电路和读出放大器也由两个阵列共享。 控制逻辑响应于选择存储器阵列之一并选择读或写操作的输入控制信号,控制设备的各种元件,包括地址和数据锁存器以及选择/驱动器电路,以执行所需的操作。
    • 9. 发明授权
    • Fabricating a narrow width EEPROM with single diffusion electrode
formation
    • 制造具有单扩散电极形成的窄宽度EEPROM
    • US5094968A
    • 1992-03-10
    • US647308
    • 1991-01-28
    • Steven J. SchumannJames C. Hu
    • Steven J. SchumannJames C. Hu
    • H01L29/788
    • H01L29/7883Y10S148/031Y10S148/111
    • An EEPROM design featuring narrow linear electrodes including a source, a drain, a thin oxide, channel and floating gate. A pair of linear, opposed field oxide barrier walls form widthwise boundaries of the active structure which can be very closely spaced. The drain electrode, implanted in the substrate, abuts both opposed field oxide lateral walls, but does not extend under either wall. The source, drain and channel are formed in a single implant followed by diffusion after the field oxide barrier walls are formed, but prior to formation of the floating gate. All but opposed field oxide walls in a stripe design. A control gate is disposed over the floating gate. The combination of opposed field oxide barrier walls, a stripe electrode design, and single step implant for electrode formation results in a very compact cell, utilizing a simplified EEPROM process.
    • 具有窄线性电极的EEPROM设计,包括源极,漏极,薄氧化物,沟道和浮动栅极。 一对线性,相对的场氧化物阻挡壁形成活动结构的横向边界,其可以非常紧密地间隔开。 植入衬底中的漏电极邻接两个相对的场氧化物侧壁,但不延伸到两壁之下。 在形成场氧化物阻挡壁之后但在形成浮栅之前,将源极,漏极和沟道形成为单个注入,随后扩散。 在条纹设计中所有但不是相反的场氧化物墙壁。 控制栅极设置在浮动栅极上。 相对的场氧化物阻挡壁,条状电极设计和用于电极形成的单步注入的组合导致使用简化的EEPROM工艺的非常紧凑的电池。
    • 10. 发明授权
    • Narrow width EEPROM with single diffusion electrode formation
    • 窄宽度EEPROM,单扩散电极形成
    • US5086325A
    • 1992-02-04
    • US616460
    • 1990-11-21
    • Steven J. SchumannJames C. Hu
    • Steven J. SchumannJames C. Hu
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/7883
    • An EEPROM design featuring narrow linear electrodes including a source, a drain, a thin oxide, channel and floating gate. A pair of linear, opposed field oxide barrier walls form widthwise boundaries of the active structure which can be very closely spaced. The drain electrode, implanted in the substrate, abuts both opposed field oxide lateral walls, but does not extend under either wall. The source, drain and channel are formed in a single implant followed by diffusion after the field oxide barrier walls are formed, but prior to formation of the floating gate. All abut opposed field oxide walls in a stripe design. A control gate is disposed over the floating gate. The combination of opposed field oxide barrier walls, a stripe electrode design, and single step implant for electrode formation results in a very compact cell, utilizing a simplified EEPROM process.
    • 具有窄线性电极的EEPROM设计,包括源极,漏极,薄氧化物,沟道和浮动栅极。 一对线性,相对的场氧化物阻挡壁形成活动结构的横向边界,其可以非常紧密地间隔开。 植入衬底中的漏电极邻接两个相对的场氧化物侧壁,但不延伸到两壁之下。 在形成场氧化物阻挡壁之后但在形成浮栅之前,将源极,漏极和沟道形成为单个注入,随后扩散。 在条纹设计中所有邻接的相对的场氧化物壁。 控制栅极设置在浮动栅极上。 相对的场氧化物阻挡壁,条状电极设计和用于电极形成的单步注入的组合导致使用简化的EEPROM工艺的非常紧凑的电池。