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    • 4. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • US20130027877A1
    • 2013-01-31
    • US13553831
    • 2012-07-20
    • Ching-Fu YangHui-Lian ChangMing-Wang LinChun-Wei Chang
    • Ching-Fu YangHui-Lian ChangMing-Wang LinChun-Wei Chang
    • H05K7/20
    • G06F1/203
    • An electronic device including a main body, a rotating base, a motherboard and a driving module is provided. The rotating base has a first vent. The rotating base is pivoted to the main body and suitable for being rotated between an operating position and a retracting position. When the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body. The driving module includes a controlling element and a first locking element. The controlling element is disposed on the main body and suitable for moving between an enable position and a disable position. The first locking element is connected to the controlling element, and the controlling element drives the first locking element to position the rotating base.
    • 提供一种包括主体,旋转底座,母板和驱动模块的电子设备。 旋转底座具有第一通气口。 旋转底座枢转到主体并且适于在操作位置和缩回位置之间旋转。 当旋转底座位于操作位置时,第一排气孔从主体露出,当旋转底座位于缩回位置时,第一排气口缩回主体。 驱动模块包括控制元件和第一锁定元件。 控制元件设置在主体上并且适于在使能位置和禁用位置之间移动。 第一锁定元件连接到控制元件,并且控制元件驱动第一锁定元件以定位旋转底座。
    • 9. 发明授权
    • Method of forming a photoresist layer
    • 形成光致抗蚀剂层的方法
    • US09028915B2
    • 2015-05-12
    • US13602465
    • 2012-09-04
    • Chun-Wei ChangChih-Chien WangWang-Pen MoHung-Chang Hsieh
    • Chun-Wei ChangChih-Chien WangWang-Pen MoHung-Chang Hsieh
    • B05D3/12H01L21/67G03F7/16
    • H01L21/02282B05D1/005G03F7/091G03F7/162H01L21/0271H01L21/0276H01L21/6715
    • A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material.
    • 公开了一种在半导体器件上形成光致抗蚀剂层的方法。 示例性的包括提供晶片。 该方法还包括在第一次循环期间以第一速度旋转晶片,同时将预湿材料分配在晶片上并以第二速度在第一周期期间旋转晶片,同时预湿材料继续被分配 在晶圆上。 该方法还包括在第一速度的第二循环期间旋转晶片,同时预湿材料继续分配在晶片上,并且在第二次循环期间以第二速度旋转晶片,同时预湿材料继续 分配在晶片上。 该方法还包括以三速旋转晶片,同时将光致抗蚀剂材料分配在包括预湿材料的晶片上。