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    • 1. 发明专利
    • Nonvolatile semiconductor memory device and rewriting method therefor
    • 非易失性半导体存储器件及其优化方法
    • JP2008123690A
    • 2008-05-29
    • JP2008024514
    • 2008-02-04
    • National Institute Of Advanced Industrial & TechnologySharp Corpシャープ株式会社独立行政法人産業技術総合研究所
    • HOSOI YASUNARIAWAYA NOBUYOSHIINOUE AKIRA
    • G11C13/00H01L27/10
    • PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory device in which stable high speed switching operation for a variable resistance element having resistance property changeable by applying of voltage to the element is performed. SOLUTION: A load circuit for applying voltage to a variable resistance element is provided so as to be connectable electrically in series with the variable resistance element, the load resistance property of the load circuit can be switched between two different properties, two load resistance properties of the load circuit are switched selectively when the resistance property of the variable resistance element transitions from a low resistance state to a high resistance state and when it transits from the high resistance state to the low resistance state, voltage required for transition from one side of two resistance properties to the other is applied to the variable resistance element by voltage for rewriting applied to a series circuit of the variable resistance element and the load circuit, after transition of the resistance property of the variable resistance element from one side to the other side, voltage applied to the variable resistance element becomes voltage which cannot be restored to the resistance property of one side from the resistance property of the other side by the selected load resistance property. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种非易失性半导体存储器件,其中对可变电阻元件进行稳定的高速切换操作,该可变电阻元件具有可通过向该元件施加电压而改变的电阻特性。 解决方案:提供一种向可变电阻元件施加电压的负载电路,以便与可变电阻元件串联电连接,负载电路的负载电阻属性可以在两种不同的特性之间切换,两个负载 当可变电阻元件的电阻特性从低电阻状态转变为高电阻状态并且当其从高电阻状态转变到低电阻状态时,负载电路的电阻特性被选择性地切换,从一个 将另一方的两个电阻特性的一侧通过用于重写的电压施加到可变电阻元件,该电压在可变电阻元件和负载电路的串联电路从一侧转换到可变电阻元件的电阻特性之后 另一方面,施加到可变电阻元件的电压变成无法施加的电压 通过选择的负载电阻特性,可以将一侧的电阻特性从另一侧的电阻特性恢复。 版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • JP2007188603A
    • 2007-07-26
    • JP2006006738
    • 2006-01-13
    • National Institute Of Advanced Industrial & TechnologySharp Corpシャープ株式会社独立行政法人産業技術総合研究所
    • HOSOI YASUNARIAWAYA NOBUYOSHIINOUE AKIRA
    • G11C13/00H01L27/10
    • G11C13/0069G11C13/0007G11C13/003G11C2013/009G11C2213/31G11C2213/32G11C2213/72G11C2213/76G11C2213/79
    • PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory device in which stable high speed switching operation can be performed for a variable resistance element in which a resistance property is varied by applying voltage. SOLUTION: A load circuit for applying voltage to the variable resistance element is provided so as to be connected in series to the variable resistance element electrically, a load resistance property of the load circuit is constituted so as to be switchable between two different properties, two load resistance properties of the load circuit are switched selectively depending on whether the resistance property of the variable resistance element is shifted from a low resistance state to a high resistance state or it is shifted from the high resistance state to the low resistance state, voltage required for shifting from one state to the other in two resistance properties is applied to the variable resistance element by voltage for rewriting applied to the series circuit of the variable resistance element and the load circuit, after the resistance property of the variable resistance element is shifted from one state to the other, voltage applied to the variable resistance element can be restored from the other resistance property to one resistance property by the selected load resistance property. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种非易失性半导体存储器件,其中可以对通过施加电压来改变电阻特性的可变电阻元件执行稳定的高速切换操作。 解决方案:提供用于向可变电阻元件施加电压的负载电路,以与电可变电阻元件串联连接,负载电路的负载电阻特性被构造成可在两个不同的可变电阻元件之间切换 选择性地切换负载电路的两个负载电阻特性,这取决于可变电阻元件的电阻特性是从低电阻状态转移到高电阻状态还是从高电阻状态转移到低电阻状态 在可变电阻元件的电阻特性之后,通过施加到可变电阻元件和负载电路的串联电路的重写电压,将可变电阻元件施加到两个电阻特性中从一个状态向另一个状态移动所需的电压 从一个状态转移到另一个状态,施加到可变电阻元件的电压可以 通过选择的负载电阻特性从另一个电阻特性恢复到一个电阻特性。 版权所有(C)2007,JPO&INPIT
    • 6. 发明专利
    • Nonvolatile semiconductor memory device and method for manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • JP2010251479A
    • 2010-11-04
    • JP2009098368
    • 2009-04-14
    • Sharp Corpシャープ株式会社
    • TABUCHI YOSHIAKIAWAYA NOBUYOSHIHOSOI YASUNARI
    • H01L27/10H01L45/00H01L49/00
    • PROBLEM TO BE SOLVED: To provide a crosspoint type memory cell array of a new structure which can be multilayered, and does not increase the mask step by multilayering. SOLUTION: A plurality of first electrodes 102 extended to a first direction parallel to a substrate face are isolatedly formed on a substrate through an interlayer insulating film 106. A variable resistor 110 is pinched between the first electrodes 102 and second electrodes 112 at each crossing portion between the first electrodes 102 and the plurality of second electrodes 112 extended to a second direction vertical to the substrate face to form a nonvolatile variable resistance element. Thus, a plurality of crosspoint type two-dimensional memory cell arrays are formed on a face vertical to the substrate, and the second electrodes of the plurality of two-dimensional memory cell arrays are electrically connected to each other, thereby forming a three-dimensional memory cell arrays. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供可以被多层化的新结构的交叉点型存储单元阵列,并且不会通过多层化增加掩模步骤。 解决方案:通过层间绝缘膜106将平行于衬底面延伸到第一方向的多个第一电极102隔离地形成在衬底上。可变电阻器110被夹在第一电极102和第二电极112之间 第一电极102和多个第二电极112之间的每个交叉部分延伸到垂直于衬底面的第二方向,以形成非易失性可变电阻元件。 因此,在与基板垂直的面上形成多个交叉点型二维存储单元阵列,并且多个二维存储单元阵列中的第二电极彼此电连接,从而形成三维 存储单元阵列。 版权所有(C)2011,JPO&INPIT
    • 7. 发明专利
    • Method of manufacturing variable resistance element
    • 制造可变电阻元件的方法
    • JP2008263159A
    • 2008-10-30
    • JP2007282261
    • 2007-10-30
    • Sharp Corpシャープ株式会社
    • INOUE YUSHIONISHI TETSUYAISHIHARA KAZUYASHIBUYA TAKAHIROHOSOI YASUNARIYAMAZAKI NOBUONAKANO TAKASHI
    • H01L27/10H01L45/00H01L49/00
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing variable resistance elements which can exactly reproduce a stable switching operation. SOLUTION: A conductive thin film 14 is deposited on a semiconductor substrate 11 and is patterned after a predetermined figure, then a first interlayer insulating film 13 is deposited on the thin film 14. Then, an opening portion 15 is formed on the first interlayer insulating film 13 so that the upper surface of the conductive thin film 14 is exposed, and thinning treatment is carried out onto the conductive thin film 14 formed on the bottom of the opening portion 15, and then oxidation treatment is carried out onto the surrounding portion of the exposed conductive thin film 14. Whereby, a variable resistance film 16 is formed in the surrounding area of the opening portion 15, and the conductive thin film 14 is divided into a first electrode 14a and a second electrode 14b due to the variable resistance film 16. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种制造可精确再现稳定切换操作的可变电阻元件的方法。 解决方案:将导电薄膜14沉积在半导体衬底11上,并在预定图形之后进行图案化,然后在薄膜14上沉积第一层间绝缘膜13.然后,在 第一层间绝缘膜13,使得导电薄膜14的上表面露出,并且对形成在开口部15的底部的导电薄膜14进行稀化处理,然后进行氧化处理 暴露的导电薄膜14的环绕部分。由此,在开口部分15的周围区域中形成可变电阻膜16,并且由于导电薄膜14被分为第一电极14a和第二电极14b 可变电阻膜16.版权所有(C)2009,JPO&INPIT
    • 8. 发明专利
    • Variable-resistance element and its manufacturing method and its driving method
    • 可变电阻元件及其制造方法及其驱动方法
    • JP2008235427A
    • 2008-10-02
    • JP2007070322
    • 2007-03-19
    • Sharp Corpシャープ株式会社
    • ONISHI TETSUYAHOSOI YASUNARI
    • H01L27/10H01L21/822H01L27/04H01L45/00H01L49/00
    • PROBLEM TO BE SOLVED: To provide a variable-resistance element having an excellent LSI-process consistency, enabling a resistance switching operation without forming a filament path and displaying a stable resistance value and holding characteristics. SOLUTION: In the variable-resistance element, a variable resistor 4 is held between a first electrode 2 and a second electrode 3 and an electric resistance between both electrodes is changed by applying voltage pulses between the first electrode 2 and the second electrode 3. In the variable-resistance element, the variable resistor 4 comprises a transition metal oxide or a transition metal nitride, and configured of the transition metal oxide or the transition metal nitride whose contained oxygen concentration lowers towards a second contact surface brought into contact with the second electrode 3 from a first contact surface brought into contact with the first electrode 2. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了提供具有优异的LSI工艺一致性的可变电阻元件,能够进行电阻切换操作而不形成灯丝路径并显示稳定的电阻值和保持特性。 解决方案:在可变电阻元件中,可变电阻器4保持在第一电极2和第二电极3之间,并且通过在第一电极2和第二电极之间施加电压脉冲来改变两个电极之间的电阻 在可变电阻元件中,可变电阻器4包括过渡金属氧化物或过渡金属氮化物,并且由过渡金属氧化物或过渡金属氮化物构成,所述过渡金属氧化物或过渡金属氮化物的含氧浓度朝向与 第二电极3从第一接触表面与第一电极2接触。版权所有:(C)2009,JPO&INPIT
    • 9. 发明专利
    • Variable resistive element and its manufacturing method
    • 可变电阻元件及其制造方法
    • JP2007294998A
    • 2007-11-08
    • JP2007178478
    • 2007-07-06
    • Sharp Corpシャープ株式会社
    • HOSOI YASUNARIISHIHARA KAZUYASHIBUYA TAKAHIROONISHI TETSUYANAKANO TAKASHI
    • H01L27/10H01L45/00H01L49/00
    • PROBLEM TO BE SOLVED: To provide a variable resistive element having a structure in which an area of an electrically contributing region of a variable resistor is more minute than an area specified by an upper electrode, a lower electrode and the like, and to provide its manufacturing method. SOLUTION: On the upper part of the lower electrode 1 disposed on a base substrate 5, a bump electrode material 2 extending parallelly in the same direction as the lower electrode 1 is formed. The different surface of the bump electrode material 2 from the contacting surface with the lower electrode 1 contacts with the variable resistor 3. The different surface of the variable resistor 3 from the contacting surface with the bump electrode material 2 contacts with the upper electrode 4. Thereby, since the crosspoint of the bump electrode material 2 (variable resistor 3) and the upper electrode 4 becomes the electrically contributing region of the variable resistor, the area of the region is reduced more than areas of the regions of conventional variable resistive elements. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种可变电阻元件,其具有可变电阻器的电气区域的面积比由上电极,下电极等指定的面积更小的结构,以及 提供其制造方法。 解决方案:在设置在基底5上的下电极1的上部形成有与下电极1同向延伸的突起电极材料2。 突起电极材料2与下电极1的接触面的不同表面与可变电阻3接触。可变电阻3与凸起电极材料2的接触面的不同表面与上电极4接触。 因此,由于凸块电极材料2(可变电阻器3)和上部电极4的交叉点成为可变电阻器的电赋能区域,所以该区域的面积比常规可变电阻元件的区域的面积减小。 版权所有(C)2008,JPO&INPIT
    • 10. 发明专利
    • Forming method of nonvolatile variable resistance element
    • 非易失性电阻元件的形成方法
    • JP2011009344A
    • 2011-01-13
    • JP2009149715
    • 2009-06-24
    • Sharp Corpシャープ株式会社
    • ONISHI JUNYAHOSOI YASUNARI
    • H01L27/10G11C13/00H01L45/00H01L49/00
    • PROBLEM TO BE SOLVED: To provide a forming treatment method to be performed at a low process cost by shortening a treatment time concerning the forming treatment of a nonvolatile variable resistance element of a memory cell, and restricting the element variation of a forming voltage to be required in the forming treatment.SOLUTION: A forming voltage pulse, which has the pulse width and voltage amplitude being the same as those of one of rewriting voltage pulses to be used for rewriting information which is stored in the nonvolatile variable resistance element, is applied between the electrodes of the nonvolatile variable resistance element in the state where the nonvolatile variable resistance element is heated at prescribed temperature being ≥50°C and ≤200°C.
    • 要解决的问题:为了通过缩短与存储单元的非易失性可变电阻元件的形成处理有关的处理时间,并且将形成电压的元件变化限制为低成本处理成本来提供成形处理方法 形成处理中需要的一种形成电压脉冲,其具有与用于重写存储在非易失性可变电阻元件中的信息的重写电压脉冲的脉冲宽度和电压幅度相同的形成电压脉冲, 在非易失性可变电阻元件在规定温度下被加热的状态下的非易失性可变电阻元件的电极之间的温度为≥50℃且≤200℃。