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    • 5. 发明授权
    • Thin film transistor, display unit, and method of manufacturing thin film transistor
    • 薄膜晶体管,显示单元和制造薄膜晶体管的方法
    • US08309956B2
    • 2012-11-13
    • US12629283
    • 2009-12-02
    • Toshiaki AraiNarihiro MorosawaKazuhiko Tokunaga
    • Toshiaki AraiNarihiro MorosawaKazuhiko Tokunaga
    • H01L29/10H01L29/12H01L29/08H01L35/24H01L51/00H01L31/102
    • H01L29/7869H01L27/1225H01L27/3262
    • A thin film transistor includes: a gate electrode; a gate insulting film formed on the gate electrode; an oxide semiconductor thin film layer forming a channel region corresponding to the gate electrode on the gate insulating film; a channel protective layer that is formed at least in a region corresponding to the channel region on the gate insulating film and the oxide semiconductor thin film layer, and that includes a first channel protective layer on a lower layer side and a second channel protective layer on an upper layer side; and a source/drain electrode that is formed on the channel protective layer and is electrically connected to the oxide semiconductor thin film layer. The first channel protective layer is made of an oxide insulating material, and one or both of the first channel protective layer and the second channel protective layer is made of a low oxygen permeable material.
    • 薄膜晶体管包括:栅电极; 形成在栅电极上的栅极绝缘膜; 形成与栅极绝缘膜上的栅电极对应的沟道区域的氧化物半导体薄膜层; 至少形成在与栅极绝缘膜和氧化物半导体薄膜层上的沟道区域对应的区域中的沟道保护层,其包括下层侧的第一沟道保护层和第二沟道保护层 上层侧 以及源极/漏极,其形成在沟道保护层上并与氧化物半导体薄膜层电连接。 第一沟道保护层由氧化物绝缘材料制成,第一沟道保护层和第二沟道保护层中的一个或两个由低透氧材料制成。
    • 6. 发明申请
    • THIN FILM TRANSISTOR, DISPLAY UNIT, AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR
    • 薄膜晶体管,显示单元及制造薄膜晶体管的方法
    • US20100133525A1
    • 2010-06-03
    • US12629283
    • 2009-12-02
    • Toshiaki AraiNarihiro MorosawaKazuhiko Tokunaga
    • Toshiaki AraiNarihiro MorosawaKazuhiko Tokunaga
    • H01L29/786H01L51/52H01L21/34
    • H01L29/7869H01L27/1225H01L27/3262
    • A thin film transistor includes: a gate electrode; a gate insulting film formed on the gate electrode; an oxide semiconductor thin film layer forming a channel region corresponding to the gate electrode on the gate insulating film; a channel protective layer that is formed at least in a region corresponding to the channel region on the gate insulating film and the oxide semiconductor thin film layer, and that includes a first channel protective layer on a lower layer side and a second channel protective layer on an upper layer side; and a source/drain electrode that is formed on the channel protective layer and is electrically connected to the oxide semiconductor thin film layer. The first channel protective layer is made of an oxide insulating material, and one or both of the first channel protective layer and the second channel protective layer is made of a low oxygen permeable material.
    • 薄膜晶体管包括:栅电极; 形成在栅电极上的栅极绝缘膜; 形成与栅极绝缘膜上的栅电极对应的沟道区域的氧化物半导体薄膜层; 至少形成在与栅极绝缘膜和氧化物半导体薄膜层上的沟道区域对应的区域中的沟道保护层,其包括下层侧的第一沟道保护层和第二沟道保护层 上层侧 以及源极/漏极,其形成在沟道保护层上并与氧化物半导体薄膜层电连接。 第一沟道保护层由氧化物绝缘材料制成,第一沟道保护层和第二沟道保护层中的一个或两个由低透氧材料制成。
    • 10. 发明授权
    • Thin-film transistor and display device
    • 薄膜晶体管和显示器件
    • US08247811B2
    • 2012-08-21
    • US12694354
    • 2010-01-27
    • Narihiro MorosawaTakashige Fujimori
    • Narihiro MorosawaTakashige Fujimori
    • H01L29/10
    • H01L29/7869H01L21/02554H01L21/02565H01L21/02631H01L27/1225H01L27/3244H01L2251/5315
    • A thin-film transistor includes: a gate electrode formed on a substrate; an oxide semiconductor layer forming a channel region corresponding to the gate electrode; a first gate insulating film formed on the substrate and the gate electrode, and including a silicon nitride film; a second gate insulating film selectively formed to contact with the oxide semiconductor layer in a region, on the first gate insulating film, corresponding to the oxide semiconductor layer, and including one of a silicon oxide film and a silicon oxynitride film; a source/drain electrode; and a protecting film. An upper surface and a side surface of the oxide semiconductor layer and a side surface of the second gate insulating film are covered, on the first gate insulating film, by the source/drain electrode and the protecting film.
    • 薄膜晶体管包括:形成在基板上的栅电极; 形成与所述栅电极对应的沟道区域的氧化物半导体层; 形成在所述基板和所述栅极上的第一栅极绝缘膜,并且包括氮化硅膜; 选择性地形成为与所述氧化物半导体层接触的第二栅极绝缘膜,所述第二栅极绝缘膜在与所述氧化物半导体层对应的所述第一栅极绝缘膜上的区域中,并且包括氧化硅膜和氧氮化硅膜之一; 源极/漏极; 和保护膜。 氧化物半导体层的上表面和侧表面以及第二栅极绝缘膜的侧表面在第一栅极绝缘膜上被源/漏电极和保护膜覆盖。