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    • 1. 发明授权
    • Substrate washing and drying apparatus, substrate washing method, and
substrate washing apparatus
    • 基板洗涤和干燥装置,基板清洗方法和基板清洗装置
    • US5845660A
    • 1998-12-08
    • US761752
    • 1996-12-05
    • Naoki ShindoYuuji KamikawaShori MokuoYoshio Kumagai
    • Naoki ShindoYuuji KamikawaShori MokuoYoshio Kumagai
    • H01L21/00B08B3/10
    • H01L21/67028Y10S134/902
    • A substrate washing and drying apparatus comprising a processing section for holding wafers, to which process solution to wash and vapor for drying the wafers are introduced, a supply/discharge port for introducing solution to the process section, and discharging the solution from the process section, a solution supply mechanism for selecting one from a plurality of kinds of solution, a drying vapor generation section having a heater for generation vapor for drying, a discharging solution mechanism having an opening for rapidly discharging the solution from the processing section, resistivity detecting means for detecting a resistivity value of the process solution, and a controller for controlling the supply of solution to the process section based on the resistivity value detected by the resistivity detecting means.
    • 一种基板清洗和干燥装置,其特征在于,包括用于保持晶片的处理部,向所述处理部引入用于将所述晶片干燥的处理液和用于干燥所述晶片的蒸气,用于将所述溶液导入所述处理部的供给排出口, 用于从多种溶液中选择一种的溶液供给机构,具有用于产生干燥产生蒸气的加热器的干燥蒸汽发生部,具有用于从处理部快速排出溶液的开口的排出溶液机构,电阻率检测装置 用于检测处理溶液的电阻率值;以及控制器,用于基于由电阻率检测装置检测的电阻率值来控制对处理部分的溶液的供应。
    • 2. 发明授权
    • Substrate washing method, substrate washing-drying method, substrate
washing apparatus and substrate washing-drying apparatus
    • 基板清洗方法,基板洗涤干燥方法,基板清洗装置和基板清洗干燥装置
    • US6001191A
    • 1999-12-14
    • US760801
    • 1996-12-05
    • Yuuji KamikawaKinya UenoNaoki ShindoYoshio Kumagai
    • Yuuji KamikawaKinya UenoNaoki ShindoYoshio Kumagai
    • B08B3/04B08B3/08B08B3/10H01L21/00H01L21/306B08B3/00
    • H01L21/02052B08B3/04B08B3/08B08B3/102H01L21/67028Y10S134/902
    • Disclosed is a method of washing substrates, comprising the steps of (a) introducing a washing solution into a processing vessel having a wafer boat movably mounted therein to fill the vessel with the washing solution, (b) allowing a plurality of wafers to be held collectively by chuck such that the wafers held by the chuck are arranged at substantially an equal pitch, (c) dipping the wafers together with the chuck in the washing solution within the processing vessel, (d) transferring the wafers from the chuck onto the wafer boat in an upper region of the processing vessel, (e) moving the wafers together with the wafer boat within the washing solution to allow the substrates to be positioned in a lower region of the processing vessel, (f) discharging the washing solution from the upper region of the processing vessel, (g) supplying a fresh washing solution into the lower region of the processing vessel so as to cause the washing solution within the processing vessel to overflow the processing vessel, (h) taking the washed wafers out of the processing vessel.
    • 公开了一种洗涤基板的方法,包括以下步骤:(a)将洗涤溶液引入到具有可移动地安装在其中的晶片舟皿的处理容器中,以便用清洗溶液填充容器,(b)允许多个晶片被保持 (c)将晶片与卡盘一起浸入处理容器内的洗涤溶液中,(d)将晶片从卡盘转移到晶片上 在处理容器的上部区域中运行,(e)将晶片与晶片舟皿一起移动到洗涤溶液中,以使基底定位在处理容器的下部区域,(f)将洗涤溶液从 处理容器的上部区域,(g)将新鲜的洗涤溶液供应到处理容器的下部区域,以使处理容器内的洗涤液溢出 (h)将洗涤过的晶片从处理容器中取出。
    • 4. 发明授权
    • Substrate cleaning method, substrate cleaning system and program storage medium
    • 基板清洗方法,基板清洗系统和程序存储介质
    • US08449684B2
    • 2013-05-28
    • US11783748
    • 2007-04-11
    • Tsukasa WatanabeNaoki Shindo
    • Tsukasa WatanabeNaoki Shindo
    • B08B7/00B08B7/04B08B3/00
    • H01L21/67057B08B3/048B08B3/12
    • The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate W is subjected to an ultrasonic cleaning process. The step of generating ultrasonic waves includes a step of generating ultrasonic waves in the cleaning tank while the cleaning liquid is being supplied into the cleaning tank. A supply rate at which the cleaning liquid is supplied into the cleaning tank at a certain timing in the step of generating ultrasonic waves differs from a supply rate at which the cleaning liquid is supplied into the cleaning tank at another timing in the step of generating ultrasonic waves.
    • 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中,将待处理基板W浸入清洗槽12内的清洗液中。然后,在包含在清洗槽12内的清洗液中产生超声波,使基板 W进行超声波清洗处理。 产生超声波的步骤包括在将清洁液供给到清洗槽中时在清洗槽中产生超声波的步骤。 在产生超声波的步骤中的某个时刻将清洗液供给到清洗槽中的供给速度与在生成超声波的步骤中的另一定时将清洗液供给到清洗槽中的供给速度不同 波浪。
    • 7. 发明授权
    • Audio decoding device
    • 音频解码装置
    • US08090585B2
    • 2012-01-03
    • US11822907
    • 2007-07-11
    • Hideyuki KakunoNaoki Shindo
    • Hideyuki KakunoNaoki Shindo
    • G10L19/00G10L21/00
    • H04S3/008G10L19/008H04N21/439H04S2420/03
    • An audio decoding device comprises an audio decoding section for decoding first stream data and second stream data to generate two pieces of audio data and a data processing parameter, an external setting section in which a parameter corresponding to the data processing parameter is set, and an audio data processing section for processing the two pieces of audio data. When the data processing parameter contained in the second stream data is inappropriate, the audio data processing section performs data processing using the parameter set in the external setting section. When the data processing parameter contained in the second stream data is appropriate, the audio data processing section performs data processing using the data processing parameter generated by the audio decoding section.
    • 音频解码装置包括用于解码第一流数据的音频解码部分和第二数据流数据以产生两条音频数据和数据处理参数,其中设置与数据处理参数对应的参数的外部设置部分,以及 音频数据处理部分,用于处理两个音频数据。 当包含在第二流数据中的数据处理参数不合适时,音频数据处理部分使用在外部设置部分中设置的参数进行数据处理。 当包含在第二流数据中的数据处理参数适当时,音频数据处理部分使用由音频解码部分生成的数据处理参数进行数据处理。
    • 8. 发明申请
    • Substrate cleaning method, substrate cleaning system and program storage medium
    • 基板清洗方法,基板清洗系统和程序存储介质
    • US20070240736A1
    • 2007-10-18
    • US11783748
    • 2007-04-11
    • Tsukasa WatanabeNaoki Shindo
    • Tsukasa WatanabeNaoki Shindo
    • B08B7/04B08B3/00B08B3/12
    • H01L21/67057B08B3/048B08B3/12
    • The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate W is subjected to an ultrasonic cleaning process. The step of generating ultrasonic waves includes a step of generating ultrasonic waves in the cleaning tank while the cleaning liquid is being supplied into the cleaning tank. A supply rate at which the cleaning liquid is supplied into the cleaning tank at a certain timing in the step of generating ultrasonic waves differs from a supply rate at which the cleaning liquid is supplied into the cleaning tank at another timing in the step of generating ultrasonic waves.
    • 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中,将被处理基板W浸渍在清洗槽12内的清洗液中。 然后,在包含在清洗槽12中的清洗液中产生超声波,从而对基板W进行超声波清洗处理。 产生超声波的步骤包括在将清洁液供给到清洗槽中时在清洗槽中产生超声波的步骤。 在产生超声波的步骤中的某个时刻将清洗液供给到清洗槽中的供给速度与在生成超声波的步骤中的另一定时将清洗液供给到清洗槽中的供给速度不同 波浪。
    • 9. 发明授权
    • Liquid treatment method and apparatus
    • 液体处理方法和装置
    • US6109278A
    • 2000-08-29
    • US317116
    • 1999-05-24
    • Naoki ShindoMiyako YamasakaYuji Kamikawa
    • Naoki ShindoMiyako YamasakaYuji Kamikawa
    • B08B3/00B08B9/02C03C23/00G02F1/1333H01L21/00B08B3/04
    • B08B9/027B08B3/00C03C23/0075H01L21/67028H01L21/6708H01L21/67086G02F1/1333Y10S134/902
    • Disclosed is a liquid treatment for an object to be processed, such as a semiconductor wafer or a glass LCD substrate, which is designed to remove any chemicals remaining in chemical supply nozzles and also improve the rinse capability and throughput. To that end, a processing liquid supply means is configured as jet nozzle pipes 40, a bottom surface 40c of each of the jet nozzle pipes 40 is inclined so as to slope downward from a chemical supply side thereof to an end portion, and the end portion is connected to a drain pipe 55 by a waste liquid orifice 40d and a drain valve 54. A chemical is supplied from nozzle orifices 40b of the jet nozzle pipes 40, the chemical is brought into contact with wafers W, and a treatment is performed thereby. Thereafter, a chemical-removing agent such as pure water or N.sub.2 is supplied through the jet nozzle pipes 40 to remove any remaining chemical from the jet nozzle pipes 40, then pure water is brought into contact with the wafers W to wash them.
    • 公开了用于被处理物体的液体处理,例如半导体晶片或玻璃LCD基板,其被设计成去除化学品供应喷嘴中残留的任何化学物质,并且还提高冲洗能力和生产量。 为此,处理液供给单元构成为喷嘴管40,各喷射管40的底面40c倾斜,从化学物质供给侧向端部倾斜, 部分通过废液孔40d和排水阀54连接到排水管55.化学品从喷嘴管40的喷嘴孔40b供应,化学品与晶片W接触,并进行处理 从而。 此后,通过喷嘴喷嘴管40供给诸如纯水或N2的化学除去剂,以从喷嘴管40中除去任何剩余的化学物质,然后使纯水与晶片W接触以进行洗涤。