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    • 1. 发明授权
    • Absorber of absorption system refrigerator
    • 吸收系统冰箱吸收器
    • US06192704B1
    • 2001-02-27
    • US09381700
    • 1999-09-23
    • Naoki HiroYoshio OzawaKenji NasakoHiroyuki Hashimoto
    • Naoki HiroYoshio OzawaKenji NasakoHiroyuki Hashimoto
    • F25B1512
    • B01D53/18F25B37/00F25B2500/01F28D3/00
    • The absorber for use in absorption chillers of the present invention comprises a plurality of cooling water pipes 2 extending horizontally in the interior of the absorber chamber. A plurality of flat heat transfer plates 1 are spaced apart from one another and arranged horizontally in a vertical position, and the plurality of cooling water pipes 2 extend through these heat transfer plates 1 perpendicular thereto. The pitch Pd of the plates 1 is 3 to 15 mm. Each heat transfer plate 1 is integrally formed on its upper end face with an absorbent receptacle 10 V-shaped in cross section and extending longitudinally of the upper end face. The bottom portion of the receptacle 10 is formed with two rows of absorbent holes 11 positioned upwardly of respective surfaces of the plate 1. The holes 11 of each row are spaced apart from one another longitudinally of the plate 1 and each have an outlet adjoining the surface of the plate 1. This enables an absorber to have a higher absorbing capacity than conventional absorbers.
    • 用于本发明的吸收式制冷机的吸收器包括在吸收室的内部水平延伸的多个冷却水管2。 多个扁平传热板1彼此间隔开并且在竖直位置上水平布置,并且多个冷却水管2穿过与其垂直的这些传热板1。 板1的间距Pd为3〜15mm。 每个传热板1在其上端面上一体地形成有横截面为V形的吸收容器,并且在上端面的纵向延伸。 容器10的底部形成有两排位于板1的相应表面向上的吸收孔11.每排的孔11彼此间隔开板1的纵向,并且每个具有出口 这使得吸收体具有比常规吸收体更高的吸收能力。
    • 2. 发明授权
    • Absorption type refrigerating machine
    • 吸收式制冷机
    • US06192694B1
    • 2001-02-27
    • US09381909
    • 1999-09-27
    • Naoki HiroYasuharu KurogiTadato FujiharaYoshio OzawaToshihiro Yamada
    • Naoki HiroYasuharu KurogiTadato FujiharaYoshio OzawaToshihiro Yamada
    • F25B1500
    • F25B49/043F25B15/008F25B15/06F25B2315/001Y02A30/277Y02B30/62
    • In a double-effect absorption chiller wherein the vapor of a refrigerant produced by a high temperature generator is supplied to a low temperature generator 12 for condensation, and the refrigerant liquified by condensation is supplied to a condenser 11, a pipe 7 for supplying the refrigerant liquified in the low temperature generator 12 to the condenser 11 therethrough is provided with an orifice 71 and a control valve 81 as pressure adjusting means. A control circuit 9 is connected to the control valve 81 to hold the valve 81 fully open during the period form the start-up of the chiller until the load is stabilized and thereafter gradually decrease the opening degree of the valve 81. Alternatively, a control valve 118 is mounted on the pipe 7 for controlling the pressure of the refrigerant so that the concentration of the absorbent (intermediate solution) in the high temperature generator because equal to the average of the concentration of the absorbent (strong solution) in the low temperature generator 12 and the concentration of the absorbent (weak solution) in an absorber.
    • 在将由高温发生器制造的制冷剂的蒸气供给到低温发生器12进行冷凝的双效吸收式制冷机中,通过冷凝液液化的制冷剂供给到冷凝器11,供给制冷剂的配管7 在低温发生器12中液化到通过其的冷凝器11设置有作为压力调节装置的孔口71和控制阀81。 控制电路9连接到控制阀81,以在冷却器启动期间直到负载稳定之前将阀81完全打开,然后逐渐降低阀81的开度。或者,控制 阀118安装在管道7上,用于控制制冷剂的压力,使得高温发生器中的吸收剂(中间溶液)的浓度等于低温吸收剂(强溶液)的浓度平均值 发生器12和吸收剂中的吸收剂(弱溶液)的浓度。
    • 5. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08604536B2
    • 2013-12-10
    • US12406841
    • 2009-03-18
    • Katsuyuki SekineYoshio Ozawa
    • Katsuyuki SekineYoshio Ozawa
    • H01L29/792
    • H01L29/792H01L21/28282H01L29/513H01L29/66833
    • A semiconductor device includes a memory cell transistor including a first lower insulating film provided on a semiconductor substrate, a first intermediate insulating film provided on the first lower insulating film, a first upper insulating film provided on the first intermediate insulating film, and a first gate electrode provided on the first upper insulating film, and a select transistor including a second lower insulating film provided on the semiconductor substrate, a second intermediate insulating film provided on the second lower insulating film, a second upper insulating film provided on the second intermediate insulating film, and a second gate electrode provided on the second upper insulating film, wherein trap density of the second intermediate insulating film is lower than that of the first intermediate insulating film.
    • 半导体器件包括存储单元晶体管,其包括设置在半导体衬底上的第一下绝缘膜,设置在第一下绝缘膜上的第一中间绝缘膜,设置在第一中间绝缘膜上的第一上绝缘膜和第一栅极 设置在第一上绝缘膜上的电极和设置在半导体衬底上的第二下绝缘膜的选择晶体管,设置在第二下绝缘膜上的第二中间绝缘膜,设置在第二中间绝缘膜上的第二上绝缘膜 以及设置在第二上绝缘膜上的第二栅电极,其中第二中间绝缘膜的阱密度低于第一中间绝缘膜的陷阱密度。
    • 8. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US08304352B2
    • 2012-11-06
    • US13051031
    • 2011-03-18
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • Masayuki TanakaKazuhiro MatsuoYoshio Ozawa
    • H01L21/31H01L21/469
    • H01L21/28282H01L27/11568H01L27/11582
    • According to an embodiment, there is provided a method of manufacturing a semiconductor device, including forming a nitride film by nitriding a surface of an underlying region having a semiconductor region containing silicon as a main component and an insulating region containing silicon and oxygen as a main component and adjacent to the semiconductor region, carrying out oxidation with respect to the nitride film to convert a portion of the nitride film which is formed on the insulating region into an oxide film and to leave a portion of the nitride film which is formed on the semiconductor region as at least part of a charge storage insulating film, forming a block insulating film on the charge storage insulating film, and forming a gate electrode film on the block insulating film.
    • 根据一个实施例,提供一种制造半导体器件的方法,包括通过氮化作为主要成分的含有硅的半导体区域的下面的区域的表面和以硅和氧为主要的绝缘区域来形成氮化物膜 并且与半导体区域相邻,相对于氮化物膜进行氧化,将形成在绝缘区域上的氮化物膜的一部分转换为氧化膜,并且使形成在该半导体层上的氮化膜的一部分 半导体区域作为电荷存储绝缘膜的至少一部分,在电荷存储绝缘膜上形成块绝缘膜,并在块绝缘膜上形成栅极电极膜。
    • 10. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120094476A1
    • 2012-04-19
    • US13051031
    • 2011-03-18
    • Masayuki TANAKAKazuhiro MatsuoYoshio Ozawa
    • Masayuki TANAKAKazuhiro MatsuoYoshio Ozawa
    • H01L21/28
    • H01L21/28282H01L27/11568H01L27/11582
    • According to an embodiment, there is provided a method of manufacturing a semiconductor device, including forming a nitride film by nitriding a surface of an underlying region having a semiconductor region containing silicon as a main component and an insulating region containing silicon and oxygen as a main component and adjacent to the semiconductor region, carrying out oxidation with respect to the nitride film to convert a portion of the nitride film which is formed on the insulating region into an oxide film and to leave a portion of the nitride film which is formed on the semiconductor region as at least part of a charge storage insulating film, forming a block insulating film on the charge storage insulating film, and forming a gate electrode film on the block insulating film.
    • 根据一个实施例,提供一种制造半导体器件的方法,包括通过氮化作为主要成分的含有硅的半导体区域的下面的区域的表面和以硅和氧为主要的绝缘区域来形成氮化物膜 并且与半导体区域相邻,相对于氮化物膜进行氧化,将形成在绝缘区域上的氮化物膜的一部分转换为氧化膜,并且使形成在该半导体层上的氮化膜的一部分 半导体区域作为电荷存储绝缘膜的至少一部分,在电荷存储绝缘膜上形成块绝缘膜,并在块绝缘膜上形成栅极电极膜。