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    • 1. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120094476A1
    • 2012-04-19
    • US13051031
    • 2011-03-18
    • Masayuki TANAKAKazuhiro MatsuoYoshio Ozawa
    • Masayuki TANAKAKazuhiro MatsuoYoshio Ozawa
    • H01L21/28
    • H01L21/28282H01L27/11568H01L27/11582
    • According to an embodiment, there is provided a method of manufacturing a semiconductor device, including forming a nitride film by nitriding a surface of an underlying region having a semiconductor region containing silicon as a main component and an insulating region containing silicon and oxygen as a main component and adjacent to the semiconductor region, carrying out oxidation with respect to the nitride film to convert a portion of the nitride film which is formed on the insulating region into an oxide film and to leave a portion of the nitride film which is formed on the semiconductor region as at least part of a charge storage insulating film, forming a block insulating film on the charge storage insulating film, and forming a gate electrode film on the block insulating film.
    • 根据一个实施例,提供一种制造半导体器件的方法,包括通过氮化作为主要成分的含有硅的半导体区域的下面的区域的表面和以硅和氧为主要的绝缘区域来形成氮化物膜 并且与半导体区域相邻,相对于氮化物膜进行氧化,将形成在绝缘区域上的氮化物膜的一部分转换为氧化膜,并且使形成在该半导体层上的氮化膜的一部分 半导体区域作为电荷存储绝缘膜的至少一部分,在电荷存储绝缘膜上形成块绝缘膜,并在块绝缘膜上形成栅极电极膜。
    • 5. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20090189213A1
    • 2009-07-30
    • US12354200
    • 2009-01-15
    • Kazuhiro MATSUOMasayuki TANAKAAtsuhiro SUZUKI
    • Kazuhiro MATSUOMasayuki TANAKAAtsuhiro SUZUKI
    • H01L29/792H01L21/283H01L21/764
    • H01L29/42336H01L27/115H01L27/11521H01L29/94
    • A nonvolatile semiconductor memory device includes a semiconductor substrate having a plurality of active regions separately formed by a plurality of trenches formed in a surface of the substrate at predetermined intervals, a first gate insulating film formed on an upper surface of the substrate corresponding to each active region, a gate electrode of a memory cell transistor formed by depositing an electrical charge storage layer formed on an upper surface of the gate insulating film, a second gate insulating film and a control gate insulating film sequentially, an element isolation insulating film buried in each trench and formed from a coating type oxide film, and an insulating film formed inside each trench on a boundary between the semiconductor substrate and the element isolation insulating film, the insulating film containing nontransition metal atoms and having a film thickness not more than 5 Å.
    • 非易失性半导体存储器件包括:半导体衬底,具有由以形成在衬底的表面中的预定间隔分开形成的多个沟槽分开形成的多个有源区;形成在衬底的上表面上的第一栅极绝缘膜, 区域,通过依次沉积形成在栅极绝缘膜的上表面上的电荷存储层,第二栅极绝缘膜和控制栅极绝缘膜而形成的存储单元晶体管的栅电极,每个区域中埋设的元件隔离绝缘膜 沟槽,并且由涂覆型氧化物膜形成,并且在半导体衬底和元件隔离绝缘膜之间的边界上形成在每个沟槽内的绝缘膜,所述绝缘膜包含非转移金属原子并且具有不大于5的膜厚度。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20130069142A1
    • 2013-03-21
    • US13423633
    • 2012-03-19
    • Kazuhiro MATSUOMasayuki TANAKAHirofumi IIKAWA
    • Kazuhiro MATSUOMasayuki TANAKAHirofumi IIKAWA
    • H01L29/792H01L21/762
    • H01L29/42324H01L21/28273H01L21/76232H01L27/11521H01L29/66825H01L29/7881
    • A semiconductor device includes an element isolation region having an element isolation insulating film therein; an active region delineated by the element isolation region; agate insulating film formed in the active region; a charge storage layer above the gate insulating film; and an interelectrode insulating film. The interelectrode insulating film is formed in a first region above an upper surface of the element isolation insulating film, a second region along a sidewall of the charge storage layer, and a third region above an upper surface of the charge storage layer. The interelectrode insulating film includes a stack of a first silicon oxide film, a first silicon nitride film, a second silicon oxide film, and a second silicon nitride film. A control electrode layer is formed above the interelectrode insulating film. The second silicon oxide film is thinner in the first region than in the third region.
    • 半导体器件包括其中具有元件隔离绝缘膜的元件隔离区域; 由元件隔离区域划定的活动区域; 形成在活性区域中的玛瑙绝缘膜; 栅极绝缘膜上方的电荷存储层; 和电极间绝缘膜。 电极间绝缘膜形成在元件隔离绝缘膜的上表面上方的第一区域,沿着电荷存储层的侧壁的第二区域和电荷存储层的上表面上方的第三区域。 电极间绝缘膜包括第一氧化硅膜,第一氮化硅膜,第二氧化硅膜和第二氮化硅膜的堆叠。 在电极间绝缘膜的上方形成控制电极层。 第二氧化硅膜在第一区域比在第三区域薄。
    • 7. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20130240978A1
    • 2013-09-19
    • US13601372
    • 2012-08-31
    • Masayuki TANAKAKazuhiro Matsuo
    • Masayuki TANAKAKazuhiro Matsuo
    • H01L29/792
    • H01L29/792H01L21/28273H01L27/11521
    • According to one embodiment, a nonvolatile semiconductor memory device has a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage film formed on the first insulating film, a second insulating film formed on the charge storage film, and a control electrode formed on the second insulating film. In the nonvolatile semiconductor memory device, the second insulating film has a laminated structure that has a first silicon oxide film, a first silicon nitride film, and a second silicon oxide film, a first atom is provided at an interface between the first silicon oxide film and the first silicon nitride film, and/or at an interface between the second silicon oxide film and the first silicon nitride film, and the first atom is selected from the group consisting of aluminum, boron, and alkaline earth metals.
    • 根据一个实施例,非易失性半导体存储器件具有半导体衬底,形成在半导体衬底上的第一绝缘膜,形成在第一绝缘膜上的电荷存储膜,形成在电荷存储膜上的第二绝缘膜,以及控制 电极形成在第二绝缘膜上。 在非易失性半导体存储器件中,第二绝缘膜具有层叠结构,该叠层结构具有第一氧化硅膜,第一氮化硅膜和第二氧化硅膜,第一原子设置在第一氧化硅膜 和/或在第二氧化硅膜和第一氮化硅膜之间的界面处,并且第一原子选自铝,硼和碱土金属。
    • 8. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND PRODUCTION METHOD FOR THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20120193699A1
    • 2012-08-02
    • US13353512
    • 2012-01-19
    • Masayuki TANAKA
    • Masayuki TANAKA
    • H01L29/792H01L21/762
    • H01L29/788H01L27/11517H01L29/42336H01L29/511H01L29/513H01L29/517H01L29/7881
    • According to one embodiment, a nonvolatile semiconductor memory device includes a semiconductor substrate; an element isolation insulating film buried in the semiconductor substrate so as to isolate adjacent element; a memory cell having a first insulating film and a charge accumulation film; a second insulating film formed on the charge accumulation films of the memory cells and the element isolation insulating film; and a control electrode film formed on the second insulating film. An upper surface of the element isolation insulating film is lower than an upper surface of the charge accumulation film, the second insulating film is provided with a cell upper portion on the charge accumulation film and an inter-cell portion on the element isolation insulating film, and a dielectric constant of the cell upper portion is lower than a dielectric constant of the inter-cell portion.
    • 根据一个实施例,非易失性半导体存储器件包括半导体衬底; 埋置在半导体衬底中以隔离相邻元件的元件隔离绝缘膜; 具有第一绝缘膜和电荷累积膜的存储单元; 形成在存储单元的电荷累积膜和元件隔离绝缘膜上的第二绝缘膜; 以及形成在所述第二绝缘膜上的控制电极膜。 元件隔离绝缘膜的上表面低于电荷累积膜的上表面,第二绝缘膜在电荷累积膜上设置有单元上部,在元件隔离绝缘膜上设置单元间部分, 并且单元上部的介电常数低于单元间部分的介电常数。
    • 9. 发明申请
    • CYCLIC REDUNDANCY CHECK CODE GENERATING CIRCUIT AND CYCLIC REDUNDANCY CHECK CODE GENERATING METHOD
    • 循环冗余检查代码生成电路和循环冗余检查代码生成方法
    • US20110154159A1
    • 2011-06-23
    • US12970651
    • 2010-12-16
    • Masayuki TANAKA
    • Masayuki TANAKA
    • G06F11/08H03M13/09
    • H03M13/091
    • A cyclic redundancy check code generating circuit successively receives one or more parallel data as input, and repetitively performs a prescribed operation for calculating a cyclic redundancy check code for each parallel data, based on the parallel data and on an initial value or an earlier calculated cyclic redundancy check code. The cyclic redundancy check code generating circuit includes: a plurality of sub-operation units which, based on the initial value and the parallel data, perform sub-operations in different pipeline stages, respectively, by dividing the prescribed operation in a bit length direction of the parallel data; and a correction unit which, based on the initial value and the earlier calculated cyclic redundancy check code, corrects the cyclic redundancy check code calculated by the sub-operation units.
    • 循环冗余校验码产生电路连续地接收一个或多个并行数据作为输入,并且重复执行用于针对每个并行数据计算循环冗余校验码的规定操作,基于并行数据和初始值或较早计算的循环 冗余校验码。 循环冗余校验码产生电路包括:多个子操作单元,其基于初始值和并行数据,分别通过将规定的操作除以位长度方向 并行数据; 以及校正单元,其基于初始值和较早计算的循环冗余校验码来校正由子操作单元计算的循环冗余校验码。
    • 10. 发明申请
    • FLOW SIMULATION METHOD, FLOW SIMULATION SYSTEM, AND COMPUTER PROGRAM PRODUCT
    • 流动模拟方法,流动模拟系统和计算机程序产品
    • US20100049489A1
    • 2010-02-25
    • US12544595
    • 2009-08-20
    • Masayuki TANAKA
    • Masayuki TANAKA
    • G06G7/57
    • G06F17/5018G06F2217/16
    • A system for a flow simulation using Moving Particle Semi-implicit method, includes a processor representing a target incompressible fluid by a plurality of particles grouped according to different particle sizes depending on a spatial resolution required at positions in a simulation domain; temporarily updating a velocity and a position coordinate of each particle to a first velocity and a first position coordinate by implicitly calculating a variation of the velocity of each particle due to a viscosity of the incompressible fluid in each of a plurality of time steps having a predetermined time interval; and updating the first velocity and the first position coordinate to a second velocity and a second position coordinate of each particle at a next time step of each time step by calculating a velocity correction of the first velocity due to a pressure gradient of the incompressible fluid using the first velocity.
    • 一种使用运动粒子半隐式方法进行流动模拟的系统,包括根据模拟域中的位置所需的空间分辨率,根据不同的粒度分组的多个粒子代表目标不可压缩流体的处理器; 通过在具有预定的多个时间步长的每个时间步骤中隐含地计算由于不可压缩流体的粘度引起的每个粒子的速度的变化,将每个粒子的速度和位置坐标临时更新为第一速度和第一位置坐标 时间间隔; 以及通过计算由于所述不可压缩流体的压力梯度而导致的第一速度的速度校正,使用在每个时间步长的下一个时间步长,将所述第一速度和所述第一位置坐标更新为每个粒子的第二速度和第二位置坐标 第一速度。