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1. 发明授权

US08546066B2 Method for electroconductive pattern formation 有权
标题翻译：导电图案形成方法
公开(公告)号：US08546066B2
公开(公告)日：2013-10-01
申请号：US12865259
申请日：2009-01-22
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： G03F7/20
CPC分类号： H05K3/064 , G03F7/093 , G03F7/168 , G03F7/2022 , H05K3/0094 , H05K3/427 , H05K2203/0505 , H05K2203/0769 , H05K2203/0793 , H05K2203/1394 , H05K2203/1476
摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.
摘要翻译：一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层，更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光，（d ）显影和（e）蚀刻，这些步骤按顺序包含，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

2. 发明申请

US20100330504A1 METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION 有权
标题翻译：电磁图形成的方法
公开(公告)号：US20100330504A1
公开(公告)日：2010-12-30
申请号：US12865259
申请日：2009-01-22
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： G03F7/20
CPC分类号： H05K3/064 , G03F7/093 , G03F7/168 , G03F7/2022 , H05K3/0094 , H05K3/427 , H05K2203/0505 , H05K2203/0769 , H05K2203/0793 , H05K2203/1394 , H05K2203/1476
摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.
摘要翻译：一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层，更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻这些步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

3. 发明申请

US20090173245A1 Method for Manufacturing Screen Printing Mask With Resin and Screen Printing Mask With Resin 审中-公开
标题翻译：用树脂制造丝网印刷面膜的方法和带树脂的丝网印刷面膜
公开(公告)号：US20090173245A1
公开(公告)日：2009-07-09
申请号：US12226000
申请日：2007-04-06
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： B05C17/06 , B05D1/32 , C25D5/02
CPC分类号： B41C1/14 , B41N1/24 , H05K3/1225
摘要： The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.
摘要翻译：由本发明提供的丝网印刷掩模的制造方法是在具有开口的丝网印刷掩模的一个主表面上制造具有树脂层的树脂成形丝网印刷掩模的方法，具有几乎相同的开口的树脂层位置与丝网印刷掩模的所述开口的位置相同，并且包括通过层压将所述丝网印刷掩模的一个主表面涂覆到树脂层的步骤，以及去除位于几乎位于所述树脂层中的那些部分的步骤与通过自对准的所述丝网印刷掩模的开口相同的位置，以形成穿过树脂层的开口。

4. 发明申请

US20090236137A1 Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board 失效
标题翻译：形成抗蚀剂图案的方法，生产电路板和电路板的方法
公开(公告)号：US20090236137A1
公开(公告)日：2009-09-24
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/11 , G03F7/20
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

5. 发明授权

US08143533B2 Method for forming resist pattern, method for producing circuit board, and circuit board 失效
标题翻译：抗蚀剂图案形成方法，电路基板的制造方法以及电路基板
公开(公告)号：US08143533B2
公开(公告)日：2012-03-27
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/03
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

6. 发明申请

US20110049104A1 ETCHANT FOR COPPER OR COPPER ALLOY, LIQUID FOR ETCHING PRETREATMENT, AND ETCHING METHOD 审中-公开
标题翻译：用于铜或铜合金的蚀刻剂，用于蚀刻预处理的液体和蚀刻方法
公开(公告)号：US20110049104A1
公开(公告)日：2011-03-03
申请号：US12812815
申请日：2009-01-08
申请人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida , Yasuo Kaneda
发明人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida , Yasuo Kaneda
IPC分类号： C23F1/18 , C09K13/00 , C23F1/00
CPC分类号： C23F1/18 , H05K3/067 , H05K2203/0392 , H05K2203/1476
摘要： An etchant for copper or copper alloy, which contains water as a main component and comprises (1) 1 to 20 mass % of iron (III) chloride and (2) 5 to 100 mass %, based on the iron chloride, of oxalic acid, and an etching method using the above etchant are provided, and the etching method includes pretreatment to be carried out with an aqueous solution containing at least one component selected from a component that dissolves copper or copper alloy and an acid, whereby well yields can be materialized.
摘要翻译：一种含有水作为主要成分的铜或铜合金的蚀刻剂，其含有（1）1〜20质量％的氯化铁（III）和（2）5〜100质量％的氯化铁，草酸并且提供了使用上述蚀刻剂的蚀刻方法，并且蚀刻方法包括使用含有选自溶解铜或铜合金的组分和酸的至少一种成分的水溶液进行预处理，由此可以得到良好的产率实现。

7. 发明申请

US20110056910A1 ETCHING METHOD 审中-公开
标题翻译：蚀刻方法
公开(公告)号：US20110056910A1
公开(公告)日：2011-03-10
申请号：US12867109
申请日：2009-02-04
申请人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida
发明人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida
IPC分类号： C23F1/04 , C23F1/18
CPC分类号： C23F1/18 , H05K3/067 , H05K2203/075 , H05K2203/1476 , H05K2203/1563 , H05K2203/1572
摘要： Etching is carried out with an etchant that reacts with a metal to be etched to form an insoluble compound. After the etching using the above etchant, etching is carried out using an etchant that does not form an insoluble compound through a reaction with the metal to be etched, whereby the form of an etched portion comes close to a rectangular form, and the side surface of a conductor pattern becomes smooth. Further, after the etching of one surface of a material to be etched is carried out using an etchant that reacts with a metal to be etched to form an insoluble compound nearly from below, the upper and lower sides of the material to be etched is reversed, and the etching of the opposite surface is carried out nearly from below, whereby fine conductor patterns can be formed on both of the surfaces.
摘要翻译：用蚀刻剂与待蚀刻的金属反应形成不溶性化合物进行蚀刻。在使用上述蚀刻剂进行蚀刻之后，通过与被蚀刻金属的反应不形成不溶性化合物的蚀刻剂进行蚀刻，由此蚀刻部分的形状接近矩形，并且侧面的导体图形变得平滑。此外，在使用与要蚀刻的金属反应的蚀刻剂蚀刻待蚀刻材料的一个表面以形成几乎从下方形成不溶性化合物之后，待蚀刻材料的上侧和下侧反转，并且相对表面的蚀刻几乎从下方进行，由此可以在两个表面上形成精细的导体图案。

8. 发明授权

US5162058A Coating powder composition 失效
标题翻译：涂料粉末组合物
公开(公告)号：US5162058A
公开(公告)日：1992-11-10
申请号：US479530
申请日：1990-02-13
申请人： Akimitsu Uenaka , Yuji Toyoda , Tasaburo Ueno , Koichi Tsutsui
发明人： Akimitsu Uenaka , Yuji Toyoda , Tasaburo Ueno , Koichi Tsutsui
IPC分类号： C08K5/10 , C09D5/03 , C09D5/46 , C09D163/00 , C09D167/00 , C09D167/02
CPC分类号： C09D167/00 , C09D163/00 , Y10T428/31511
摘要： The invention concerns a coating powder composition comprising (A) a carboxyl group containing polyester resin having a number average molecular weight of 1,000.about.20,000, an acid value of 10.about.100, a glass transition temperature of 35.degree.-120.degree. C. and an SP value of 9.8.about.11.5, and (B) glycidyl trimellitate, wherein the equivalent weight ratio of carboxyl the groups of said (A) to the glycidyl groups of said (B) is 1:2 to 2:1. The coating powder composition is specifically suitable for a high-temperature-short time baking and capable of resulting in a coating having excellent film properties including bending and processability and which coating is highly-crosslinked.

9. 发明授权

US5468813A Powder coating 失效
标题翻译：粉末涂料
公开(公告)号：US5468813A
公开(公告)日：1995-11-21
申请号：US332744
申请日：1994-11-01
申请人： Akimitsu Uenaka , Yuji Toyoda , Koichi Tsutsui , John Kenny
发明人： Akimitsu Uenaka , Yuji Toyoda , Koichi Tsutsui , John Kenny
IPC分类号： C09D5/03 , C09D133/06 , C09D133/14 , C09D163/00 , C08F8/00
CPC分类号： C09D5/031
摘要： The object of the present invention is to provide a powder coating excellent in storage stability and in coat surface smoothness.The present invention relates to a powder coating comprising a binder resin and a curing agent, characterized in that said curing agent has particle size characteristics such that the average particle size is 0.3 to 7 .mu.m and particles having a particle size not smaller than 20 .mu.m account for not less than 10% by weight of all curing agent particles.
摘要翻译：本发明的目的是提供一种保存稳定性和涂层表面平滑性优异的粉末涂料。本发明涉及包含粘合剂树脂和固化剂的粉末涂料，其特征在于，所述固化剂具有使得平均粒径为0.3〜7μm的粒径特性，粒径不小于20μm的粒子 m不低于所有固化剂颗粒的10重量％。

10. 发明授权

US5034432A Powder coatings 失效
标题翻译：粉末涂料
公开(公告)号：US5034432A
公开(公告)日：1991-07-23
申请号：US458542
申请日：1989-12-29
申请人： Tasaburo Ueno , Akimitsu Uenaka , Yuji Toyoda , Katsuaki Kida , Masayuki Maruta , Koichi Tsutsui
发明人： Tasaburo Ueno , Akimitsu Uenaka , Yuji Toyoda , Katsuaki Kida , Masayuki Maruta , Koichi Tsutsui
IPC分类号： C09D5/03 , C09D5/46 , C08L27/06
CPC分类号： C09D5/031 , Y10S525/934 , Y10T428/2998
摘要： The invention concerns powder coatings comprising thermoplastic or thermosetting type resin powder particles, each particle carrying at least on the surface thereof, a number of microparticles having an average diameter of 0.001 to 10.mu. of such resin as having a glass transition temperature of 50.degree. to 150.degree. C. and a SP value of 9 to 15, said microparticle optionally containing UV absorber or antioxidant or hardening catalyst, the weight ratio of said microparticles to the total weight of the powder coatings being 0.05 to 30% by weight. The present powder coatings are excellent in blocking resistance and capable of forming a coating with excellent stain resistance, coating appearance and other desired properties.
摘要翻译：本发明涉及包含热塑性或热固型树脂粉末颗粒的粉末涂料，每个颗粒至少在其表面上承载多个平均直径为0.001至10微米的微粒，其玻璃化转变温度为50℃至 150℃，SP值为9〜15，所述微粒任选地含有UV吸收剂或抗氧化剂或硬化催化剂，所述微粒与粉末涂料的总重量的重量比为0.05〜30重量％。本发明的粉末涂料具有优异的抗粘连性，并且能够形成具有优异的耐污性，涂层外观和其它所需性能的涂层。

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