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1. 发明申请

US20110049104A1 ETCHANT FOR COPPER OR COPPER ALLOY, LIQUID FOR ETCHING PRETREATMENT, AND ETCHING METHOD 审中-公开
标题翻译：用于铜或铜合金的蚀刻剂，用于蚀刻预处理的液体和蚀刻方法
公开(公告)号：US20110049104A1
公开(公告)日：2011-03-03
申请号：US12812815
申请日：2009-01-08
申请人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida , Yasuo Kaneda
发明人： Makoto Kato , Yuji Toyoda , Kunihiro Nakagawa , Mariko Ishida , Yasuo Kaneda
IPC分类号： C23F1/18 , C09K13/00 , C23F1/00
CPC分类号： C23F1/18 , H05K3/067 , H05K2203/0392 , H05K2203/1476
摘要： An etchant for copper or copper alloy, which contains water as a main component and comprises (1) 1 to 20 mass % of iron (III) chloride and (2) 5 to 100 mass %, based on the iron chloride, of oxalic acid, and an etching method using the above etchant are provided, and the etching method includes pretreatment to be carried out with an aqueous solution containing at least one component selected from a component that dissolves copper or copper alloy and an acid, whereby well yields can be materialized.
摘要翻译：一种含有水作为主要成分的铜或铜合金的蚀刻剂，其含有（1）1〜20质量％的氯化铁（III）和（2）5〜100质量％的氯化铁，草酸并且提供了使用上述蚀刻剂的蚀刻方法，并且蚀刻方法包括使用含有选自溶解铜或铜合金的组分和酸的至少一种成分的水溶液进行预处理，由此可以得到良好的产率实现。

2. 发明申请

US20090173245A1 Method for Manufacturing Screen Printing Mask With Resin and Screen Printing Mask With Resin 审中-公开
标题翻译：用树脂制造丝网印刷面膜的方法和带树脂的丝网印刷面膜
公开(公告)号：US20090173245A1
公开(公告)日：2009-07-09
申请号：US12226000
申请日：2007-04-06
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： B05C17/06 , B05D1/32 , C25D5/02
CPC分类号： B41C1/14 , B41N1/24 , H05K3/1225
摘要： The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.
摘要翻译：由本发明提供的丝网印刷掩模的制造方法是在具有开口的丝网印刷掩模的一个主表面上制造具有树脂层的树脂成形丝网印刷掩模的方法，具有几乎相同的开口的树脂层位置与丝网印刷掩模的所述开口的位置相同，并且包括通过层压将所述丝网印刷掩模的一个主表面涂覆到树脂层的步骤，以及去除位于几乎位于所述树脂层中的那些部分的步骤与通过自对准的所述丝网印刷掩模的开口相同的位置，以形成穿过树脂层的开口。

3. 发明授权

US08546066B2 Method for electroconductive pattern formation 有权
标题翻译：导电图案形成方法
公开(公告)号：US08546066B2
公开(公告)日：2013-10-01
申请号：US12865259
申请日：2009-01-22
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： G03F7/20
CPC分类号： H05K3/064 , G03F7/093 , G03F7/168 , G03F7/2022 , H05K3/0094 , H05K3/427 , H05K2203/0505 , H05K2203/0769 , H05K2203/0793 , H05K2203/1394 , H05K2203/1476
摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.
摘要翻译：一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层，更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光，（d ）显影和（e）蚀刻，这些步骤按顺序包含，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

4. 发明申请

US20100330504A1 METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION 有权
标题翻译：电磁图形成的方法
公开(公告)号：US20100330504A1
公开(公告)日：2010-12-30
申请号：US12865259
申请日：2009-01-22
申请人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
发明人： Munetoshi Irisawa , Yuji Toyoda , Yasuo Kaneda , Kunihiro Nakagawa
IPC分类号： G03F7/20
CPC分类号： H05K3/064 , G03F7/093 , G03F7/168 , G03F7/2022 , H05K3/0094 , H05K3/427 , H05K2203/0505 , H05K2203/0769 , H05K2203/0793 , H05K2203/1394 , H05K2203/1476
摘要： A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a′) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b′) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, these steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound.
摘要翻译：一种形成导体图案的方法，包括以下步骤：（a）在其表面上具有导电层的基底上形成光可交联树脂层，（b）用碱水溶液处理光交联树脂层，更薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻，依次包括的步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物或形成导体图案的方法包括以下步骤：（a）在基材上形成光交联性树脂层，在其表面和内部形成导电层，（i）使光交联性树脂层固化在孔单独或孔上及其周围区域，（b'）用碱性水溶液处理未固化部分中的光交联性树脂层使其变薄，（c）进行电路图案的曝光，（d）显影和（e）蚀刻这些步骤，所述碱性水溶液是含有5〜20质量％的无机碱性化合物的水溶液。

5. 发明授权

US08143533B2 Method for forming resist pattern, method for producing circuit board, and circuit board 失效
标题翻译：抗蚀剂图案形成方法，电路基板的制造方法以及电路基板
公开(公告)号：US08143533B2
公开(公告)日：2012-03-27
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/03
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

6. 发明申请

US20090236137A1 Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board 失效
标题翻译：形成抗蚀剂图案的方法，生产电路板和电路板的方法
公开(公告)号：US20090236137A1
公开(公告)日：2009-09-24
申请号：US12227377
申请日：2006-05-17
申请人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
发明人： Yasuo Kaneda , Munetoshi Irisawa , Yuji Toyoda , Toyokazu Komuro , Katsuya Fukase , Toyoaki Sakai
IPC分类号： H05K1/11 , G03F7/20
CPC分类号： H05K3/426 , H05K1/116 , H05K3/002 , H05K3/108 , H05K2201/09545 , H05K2203/0191 , H05K2203/0574 , H05K2203/1184 , H05K2203/1394
摘要： There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
摘要翻译：提供了一种形成抗蚀剂图案的方法，该抗蚀剂图案用于制备具有无轨或小地平面宽度的通孔的电路板，以实现高密度电路板，生产电路板的方法和电路板。一种形成抗蚀剂图案的方法，包括以下步骤：在具有通孔的基板的第一表面上形成树脂层和掩模层，并且除去通孔上的树脂层和通过从与基板的第一表面相对的第二表面提供树脂层去除溶液，在第一表面的通孔的周边上，以及使用该抗蚀剂形成方法制造电路板的方法图案和电路板。

7. 发明授权

US07679004B2 Circuit board manufacturing method and circuit board 有权
标题翻译：电路板制造方法和电路板
公开(公告)号：US07679004B2
公开(公告)日：2010-03-16
申请号：US10598524
申请日：2005-03-02
申请人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
发明人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
IPC分类号： H01R12/04 , H05K1/00
CPC分类号： H05K3/064 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/065 , H05K3/108 , H05K3/421 , H05K3/427 , H05K2201/09381 , H05K2201/09563 , H05K2201/09581 , H05K2201/098 , H05K2203/0517 , H05K2203/0577 , H05K2203/0582 , H05K2203/1184 , H05K2203/1394
摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.
摘要翻译：作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法，制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层，制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤，在形成第二树脂层之前，在表面导电层上设置阴极层。此外，提供一种电路板，其具有位置偏移小且精度高的孔。

8. 发明申请

US20070181994A1 Circuit board manufacturing method and circuit board 有权
标题翻译：电路板制造方法和电路板
公开(公告)号：US20070181994A1
公开(公告)日：2007-08-09
申请号：US10598524
申请日：2005-03-02
申请人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
发明人： Katsuya Fukase , Toyoaki Sakai , Munetoshi Irisawa , Toyokazu Komuro , Yasuo Kaneda , Masanori Natsuka , Wakana Aizawa
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H05K3/064 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/065 , H05K3/108 , H05K3/421 , H05K3/427 , H05K2201/09381 , H05K2201/09563 , H05K2201/09581 , H05K2201/098 , H05K2203/0517 , H05K2203/0577 , H05K2203/0582 , H05K2203/1184 , H05K2203/1394
摘要： As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on the surface conductive layer before forming the second resin layer. Moreover, there is provided a circuit board having a hole with a small positional shift and high precision.
摘要翻译：作为在电路基板的制造方法中解决在形成抗蚀剂层和电镀抗蚀剂层时的取向引起的焊盘和孔的位置偏移的问题的方法，提供了一种方法，制造电路板，包括以下步骤：在表面上具有导电层的绝缘基板的表面上形成第一树脂层和通孔或/或非通孔的内壁，形成第二树脂层，所述第二树脂层在设置在表面导电层上的第一树脂层上的第一树脂层的显影液中不溶或微溶，用第一树脂层的显影液除去设在孔上的第一树脂层，制造电路板，包括对第一树脂层的表面均匀充电以对设置在孔上的第一树脂层引起电位差的步骤，在形成第二树脂层之前，在表面导电层上设置阴极层。此外，提供一种电路板，其具有位置偏移小且精度高的孔。

9. 发明授权

US06551753B1 Liquid developing method of printed wiring board 失效
标题翻译：印刷电路板液体显影方法
公开(公告)号：US06551753B1
公开(公告)日：2003-04-22
申请号：US09550310
申请日：2000-04-14
申请人： Masanori Natsuka , Yasuo Kaneda , Munetoshi Irisawa , Toyokazu Komuro , Noritaka Inoue , Kenji Hyodo
发明人： Masanori Natsuka , Yasuo Kaneda , Munetoshi Irisawa , Toyokazu Komuro , Noritaka Inoue , Kenji Hyodo
IPC分类号： G03G1310
CPC分类号： G03G13/22 , H05K3/065
摘要： There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.
摘要翻译：公开了一种使用单面逐步显影系统的印刷电路板的液体显影方法，所述单面逐步显影系统根据电子照相反显影方法在通过在其上形成光导层获得的待显影材料的每个表面上逐步形成抗蚀剂图案两面覆铜层压板的两面，其特征在于，所述方法包括以下步骤：在不与静电潜像形成表面相对的表面上形成没有静电潜像的表面进行静电充电处理即在曝光处理完成之前和在液体调色剂显影处理之前的待曝光表面或非显影表面，以及进行液体调色剂显影处理以在静电上形成对应于抗蚀剂图案的调色剂图像潜像形成表面。

10. 发明授权

US06444379B1 Method and apparatus for manufacturing printed wiring board 失效
标题翻译：制造印刷电路板的方法和装置
公开(公告)号：US06444379B1
公开(公告)日：2002-09-03
申请号：US09445147
申请日：1999-12-03
申请人： Yasuo Kaneda , Masanori Takase , Kenji Hyodo
发明人： Yasuo Kaneda , Masanori Takase , Kenji Hyodo
IPC分类号： G03G1304
CPC分类号： H05K3/065 , G03G15/04072 , G03G15/221 , G03G15/6597 , G03G2215/00518
摘要： There are provided a method for preparing a printed wiring board which can form electrostatic latent images at the desired positions of a substrate with good precision, and a uniform and good image can be formed for preparing a printed wiring board having circuits on the both surfaces of the substrate from a material to be developed having at least a metal conductive layer and a photoconductive layer on both surfaces of an insulating substrate in this order, and a preparation device.
摘要翻译：提供了一种制备能够以高精度在基板的期望位置形成静电潜像的印刷线路板的方法，并且可以形成均匀且良好的图像，以制备在两面上具有电路的印刷线路板从具有至少金属导电层和绝缘基板的两面上的光电导层的待显影材料的基板和制备装置。

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