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    • 4. 发明申请
    • METHOD OF FORMING FINE PATTERN
    • 形成精细图案的方法
    • US20090039563A1
    • 2009-02-12
    • US12065246
    • 2006-08-25
    • Motoki OkinakaKazuhito TsukagoshiYoshinobu Aoyagi
    • Motoki OkinakaKazuhito TsukagoshiYoshinobu Aoyagi
    • B29C59/16
    • G03F7/0002B81C1/00031B81C1/00111B81C2201/0152B81C2201/0153B82Y10/00B82Y40/00H01L21/31H01L21/3121H01L21/316H01L21/76817
    • A method of fine-pattern formation in which in forming a pattern, a fine pattern formed in a mold can be transferred to a pattering material in a short time at a low temperature and low pressure and, after the transfer of the fine pattern to the patterning material, the fine pattern formed in the patterning material does not readily deform. The method for fine-pattern formation comprises: a first step in which a mold having a fine structure with recesses/protrusions is pressed against a pattering material comprising a polysilane; a second step in which the patterning material is irradiated with ultraviolet to photooxidize the patterning material; a third in which the pressing of the mold against the patterning material is relieved and the mold is drawn from the pattering material; and a fourth step in which that surface of the patterning material to which the fine pattern has been transferred is irradiated with an oxygen plasma to oxidize the surface.
    • 精细图案形成方法在形成图案时,在模具中形成的精细图案可以在低温低压下在短时间内转印到图案材料,并且在精细图案转印到 图案形成材料中形成的微细图案不容易变形。 精细图案形成方法包括:第一步骤,其中具有凹陷/突起的精细结构的模具被压在包含聚硅烷的图案材料上; 第二步骤,其中图案形成材料被紫外线照射以对图案材料进行光氧化; 第三,其中将模具压靠在图案形成材料上被释放并且模具从图案材料中拉出; 以及第四步骤,其中已经转印有精细图案的图案形成材料的表面用氧等离子体照射以氧化该表面。
    • 9. 发明申请
    • THIN FILM SEMICONDUCTOR DEVICE FABRICATION METHOD AND THIN FILM SEMICONDUCTOR DEVICE
    • 薄膜半导体器件制造方法和薄膜半导体器件
    • US20100078639A1
    • 2010-04-01
    • US12523943
    • 2008-01-28
    • Kazumasa NomotoNobukazu HiraiRyoichi YasudaTakeo MinariKazuhito TsukagoshiYoshinobu Aoyagi
    • Kazumasa NomotoNobukazu HiraiRyoichi YasudaTakeo MinariKazuhito TsukagoshiYoshinobu Aoyagi
    • H01L29/786H01L21/336
    • H01L51/001H01L51/0516H01L51/0529H01L51/0545
    • The present invention provides a method for making a thin film semiconductor device having a bottom-gate, bottom-contact-type thin film transistor structure finer in size with satisfactory characteristics, in which the interface between a gate insulating film and a thin film semiconductor layer can be maintained at satisfactory conditions without being affected by formation of source/drain electrodes. A first gate insulating film (7-1) covering a gate electrode (5) on a substrate (3) is formed, and a pair of source/drain electrodes (9) is formed on the first gate insulating film (7-1). Subsequently, a second gate insulating film (7-2) is selectively formed only on the first gate insulating film (7-2) exposed from the source/drain electrodes (9). Next, a thin film semiconductor layer (11) continuously covering from the source/drain electrodes (9) to the first gate insulating film (7-1) through the second gate insulating film (7-2) is formed while making contact with the source/drain electrodes (9). A method for making a thin film semiconductor device (1) is characterized as such.
    • 本发明提供一种制造薄膜半导体器件的方法,该薄膜半导体器件具有尺寸较小且具有令人满意的特性的底栅,底接触型薄膜晶体管结构,其中栅极绝缘膜和薄膜半导体层 可以在令人满意的条件下保持不受源/漏电极形成的影响。 形成覆盖基板(3)上的栅极(5)的第一栅极绝缘膜(7-1),在第一栅极绝缘膜(7-1)上形成有一对源极/漏极电极(9) 。 随后,仅在从源极/漏极(9)露出的第一栅极绝缘膜(7-2)上选择性地形成第二栅极绝缘膜(7-2)。 接下来,形成通过第二栅极绝缘膜(7-2)从源极/漏极(9)连续地覆盖到第一栅极绝缘膜(7-1)的薄膜半导体层(11),同时与 源极/漏极(9)。 制造薄膜半导体器件(1)的方法的特征如下。