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    • 1. 发明授权
    • Curable thermosetting cyanate ester composition
    • 固化性热固性氰酸酯组合物
    • US4780507A
    • 1988-10-25
    • US939772
    • 1986-11-14
    • Morio GakuHidenori KimbaraHiroo MuramotoShiro HigashidaFumio Sato
    • Morio GakuHidenori KimbaraHiroo MuramotoShiro HigashidaFumio Sato
    • C08G59/12C08G59/40C08L19/00C08L63/00H05K1/03C08L25/10
    • H05K1/0353C08G59/12C08G59/4014C08L19/006C08L63/00C08L63/10C08L79/06Y10T428/31525Y10T428/31529Y10T428/31645Y10T428/31692
    • There is disclosed a thermosetting resin composition comprising a thermosetting cyanate ester resin composition (A) and a butadiene based copolymer (B)(i) or an epoxy resin-modified butadiene based copolymer (B)(ii), in which said component (B)(i) or (B)(ii) are used for modifying said component (A), component (A) and (B) being as follows;(A) a cyanate ester thermosetting resin composition comprising a cyanate ester compound selected from the group consisting of,(i) a polyfunctional cyanate ester having at least two cyanate group in its molecule,(ii) prepolymer of the cyanate ester of (i),(iii) coprepolymer of the cyanate ester of (i) and an amine, and(iv) mixtures thereof, and optionally adding another thermosetting resin,(B)(i) a butadiene based copolymer comprising a butadienaromatic vinytl monomer copolymer having 0.5 or more functional groups selected from a group consisting of carboxyl radical, hydroxyl radical, acid anhydride radical, mercapto radical, epoxy radical and amino radical, and a melting point of 10.degree. C. or more, in which 1,2-type content in butadiene structure of copolymer chain is 50% or more,(ii) an epoxy resin-modified butadiene based copolymer comprising said butadiene based copolymer (B)(i) having a carboxyl radical modified with polyfunctional epoxy resin, and having a melting point of 10.degree. C. or more and an epoxy equivalent of 300-8,000.
    • PCT No.PCT / JP86 / 00173 Sec。 一九八六年十一月十四日 102(e)1986年11月14日PCT PCT公布1986年4月9日PCT公布。 公开号WO86 / 06085 公开了包含热固性氰酸酯树脂组合物(A)和丁二烯基共聚物(B)(i)或环氧树脂改性丁二烯共聚物(B)(ii)的热固性树脂组合物, ,其中所述组分(B)(i)或(B)(ii)用于改性所述组分(A),组分(A)和(B)如下: (A)氰酸酯热固性树脂组合物,其包含氰酸酯化合物,所述氰酸酯化合物选自:(i)分子中具有至少两个氰酸酯基的多官能氰酸酯,(ii)(i)的氰酸酯的预聚物, ,(iii)(i)的氰酸酯与胺的共聚合物,和(iv)它们的混合物,以及任选地加入另外的热固性树脂,(B)(ⅰ)一种丁二烯基共聚物,其包含具有0.5或6的丁二烯芳族iny单体共聚物, 更多选自羧基,羟基,酸酐基,巯基,环氧基和氨基的官能团,熔点为10℃以上,其中丁二烯中的1,2-型含量 共聚物链的结构为50%以上,(ii)环氧树脂改性丁二烯系共聚物,其含有具有用多官能环氧树脂改性的羧基的丁二烯基共聚物(B)(i),熔点为1 0℃以上,环氧当量300〜8000。