专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060220500A1 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US20060220500A1
公开(公告)日：2006-10-05
申请号：US11445586
申请日：2006-06-01
申请人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
发明人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
IPC分类号： H03H9/25
CPC分类号： H03H9/1085 , G01H3/12 , H01L21/561 , H01L23/3135 , H01L23/315 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/73203 , H01L2224/81801 , H01L2924/09701 , H03H3/08 , H03H9/059 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , H01L2924/00012
摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.
摘要翻译：公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊料密封部件4接合到周围密封电极13的周围密封导体膜22。对于焊料凸块部件3和焊料密封部件4，使用含有90％以上Sn的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在范围为9-20μm/℃。由于热膨胀系数的差异，能够以高稳定性抵抗热应力实现接合，从而可以提供能够长时间保持稳定连接的表面声波装置。

2. 发明授权

US07154206B2 Surface acoustic wave device and method for manufacturing same 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US07154206B2
公开(公告)日：2006-12-26
申请号：US10628881
申请日：2003-07-28
申请人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
发明人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
IPC分类号： H01L41/08
CPC分类号： H03H9/1085 , G01H3/12 , H01L21/561 , H01L23/3135 , H01L23/315 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/73203 , H01L2224/81801 , H01L2924/09701 , H03H3/08 , H03H9/059 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , H01L2924/00012
摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9–20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.
摘要翻译：公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊接密封部件4接合到周围密封电极13的周围密封导体膜22.对于焊料凸块部件3和使用焊料密封部件4，含有Sn含量为90％以上的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在9〜20μm/ ℃。由于热膨胀系数的差异，接合实现了高稳定性，抗热应力，从而可以保持稳定的表面声波装置可以提供长时间的连接。

3. 发明授权

US07513022B2 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US07513022B2
公开(公告)日：2009-04-07
申请号：US11445586
申请日：2006-06-01
申请人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
发明人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
IPC分类号： H04R17/00
CPC分类号： H03H9/1085 , G01H3/12 , H01L21/561 , H01L23/3135 , H01L23/315 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/73203 , H01L2224/81801 , H01L2924/09701 , H03H3/08 , H03H9/059 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , H01L2924/00012
摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.
摘要翻译：公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊接密封部件4接合到周围密封电极13的周围密封导体膜22.对于焊料凸块部件3和使用焊料密封部件4，含有Sn含量为90％以上的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在9〜20μm/ ℃。由于热膨胀系数的差异，接合实现了高稳定性，抗热应力，从而可以保持稳定的表面声波装置可以提供长时间的连接。

4. 发明授权

US07323205B2 Production process of packaged green tea beverages 有权
标题翻译：包装绿茶饮料的生产工艺
公开(公告)号：US07323205B2
公开(公告)日：2008-01-29
申请号：US11366408
申请日：2006-03-03
申请人： Kazuhiro Otsuka , Wataru Mizuno , Koji Hanaoka , Yuji Matsui , Hideyuki Takatsu
发明人： Kazuhiro Otsuka , Wataru Mizuno , Koji Hanaoka , Yuji Matsui , Hideyuki Takatsu
IPC分类号： A23F3/00
CPC分类号： A23F3/163
摘要： A process is described for the production of a packaged green tea beverage containing non-polymer catechins at a concentration of 0.05 to 0.5 wt. %. According to the process, an aluminosilicate which has an iron release rate of not greater than 0.8 mg/kg to a catechin-containing solution is brought into contact with a green tea mixture of a green tea extract and a concentrate of green tea extract. The present invention can provide beverages, which contain catechins at high concentration and inhibit the formation of dregs during long-term storage.
摘要翻译：描述了一种制备包含浓度为0.05至0.5重量％的非聚合物儿茶素类的包装绿茶饮料的方法。％。根据该方法，将具有不大于0.8mg / kg的铁释放速率的含硅酸铝与含儿茶素的溶液与绿茶提取物和绿茶提取物的浓缩物的绿茶混合物接触。本发明可以提供含有高浓度儿茶素类并在长期保存期间抑制渣滓形成的饮料。

5. 发明申请

US20050001696A1 Surface acoustic wave device and communication apparatus using the same 有权
标题翻译：声表面波装置及使用其的通信装置
公开(公告)号：US20050001696A1
公开(公告)日：2005-01-06
申请号：US10884827
申请日：2004-07-02
申请人： Kazuhiro Otsuka , Motoki Ito , Kiyohiro Iioka , Tsuyoshi Nakai
发明人： Kazuhiro Otsuka , Motoki Ito , Kiyohiro Iioka , Tsuyoshi Nakai
IPC分类号： H03H9/00 , H03H9/02 , H03H9/25 , H03H9/64 , H03H9/72
CPC分类号： H03H9/6469 , H03H9/0038 , H03H9/0042 , H03H9/0057 , H03H9/0061 , H03H9/02763 , H03H9/14582 , H03H9/14588 , H03H9/25 , H03H9/6436
摘要： IDT electrodes are arranged on a piezoelectric substrate along a propagation direction of a surface acoustic wave whereas reflectors are each interposed between a respective pair of IDT electrodes, the reflectors each including four or more electrode fingers extended perpendicularly to the propagation direction. An electrode-finger pitch ‘a’ of the reflector is progressively decreased from the opposite ends of the reflector toward the center thereof. Frequencies allowed to pass through a pass band may be controlled by varying the electrode-finger pitch. Thus is provided a surface acoustic wave device featuring a wide-band transmission performance.
摘要翻译： IDT电极沿着声表面波的传播方向布置在压电基板上，而反射器分别插在相应的一对IDT电极之间，每个反射器包括垂直于传播方向延伸的四个或更多个电极指。反射器的电极指间距“a”从反射器的相对端逐渐减小到其中心。允许通过通带的频率可以通过改变电极指间距来控制。因此，提供了具有宽带传输性能的表面声波装置。

6. 发明授权

US6143266A Method for producing crystalline inorganic builders 有权
标题翻译：生产结晶无机助洗剂的方法
公开(公告)号：US6143266A
公开(公告)日：2000-11-07
申请号：US125815
申请日：1998-08-26
申请人： Mikio Sakaguchi , Ichiro Sakamoto , Kazuhiro Otsuka , Masaharu Jyono
发明人： Mikio Sakaguchi , Ichiro Sakamoto , Kazuhiro Otsuka , Masaharu Jyono
IPC分类号： C01B33/36 , C01B33/38 , C11D3/12 , C01B33/24 , C01B33/20 , C01B33/32
CPC分类号： C01B33/38 , C01B33/36 , C11D3/1273
摘要： A method for producing a crystalline inorganic builder having the following composition in its anhydrous form: xM.sub.2 O.ySiO.sub.2.zMeO, wherein x, y and z are numerical values satisfying the following relationships: y/x is 1.0 to 4.0, z/y is not more than 1.0, M stands for Na and K, K/Na is 0.01 to 2.0, and Me stands for Ca and/or Mg, the method comprising the steps of (a) adding water, a Na-containing compound, a K-containing compound, and at least one member of Ca-containing compounds and Mg-containing compounds to silica sand, to give a mixture; (b) subjecting the resulting mixture to a hydrothermal treatment; and (c) baking the resulting treated mixture. Also, a method for producing a crystalline inorganic builder having the following composition in its anhydrous form: xM.sub.2 O.ySiO.sub.2, wherein x and y are numerical values satisfying the following relationships: y/x is 1.0 to 4.0, M stands for Na and K, K/Na is 0.01 to 2.0, the method comprising the steps of (a) adding water, a Na-containing compound, a K-containing compound to silica sand, to give a mixture; (b) subjecting the resulting mixture to a hydrothermal treatment; and (c) baking the resulting treated mixture.
摘要翻译： PCT No.PCT / JP98 / 00147 Sec。 371日期：1998年8月26日 102（e）1998年8月26日PCT 1998年1月14日PCT PCT。公开号WO98 / 31631 日期1998年7月23日制备无水形式的具有以下组成的结晶无机助洗剂的方法：xM2O.ySiO2.zMeO，其中x，y和z是满足以下关系的数值：y / x为1.0〜4.0， z / y不大于1.0，M代表Na和K，K / Na为0.01至2.0，Me代表Ca和/或Mg，该方法包括以下步骤：（a）加入水，含Na 化合物，含钾化合物，以及至少一种含Ca化合物和含Mg化合物的硅砂，得到混合物; （b）对所得混合物进行水热处理; 和（c）烘烤得到的处理过的混合物。另外，制备具有以下无机形式的结晶无机助洗剂的方法：xM2O.ySiO2，其中x和y为满足以下关系的数值：y / x为1.0〜4.0，M为Na和K， K / Na为0.01〜2.0，该方法包括以下步骤：（a）将水，含Na化合物，含K化合物加入硅砂中，得到混合物; （b）对所得混合物进行水热处理; 和（c）烘烤得到的处理过的混合物。

7. 发明申请

US20070120626A1 SURFACE ACOUSTIC WAVE ELEMENT, SURFACE ACOUSTIC WAVE DEVICE AND COMMUNICATION DEVICE INCLUDING THE SAME 有权
标题翻译：表面声波元件，表面声波装置和包括其的通信装置
公开(公告)号：US20070120626A1
公开(公告)日：2007-05-31
申请号：US11565505
申请日：2006-11-30
申请人： Daisuke MAKIBUCHI , Kazuhiro Otsuka , Kiyohiro Iioka
发明人： Daisuke MAKIBUCHI , Kazuhiro Otsuka , Kiyohiro Iioka
IPC分类号： H03H9/64
CPC分类号： H03H9/0038 , H03H9/0057 , H03H9/008 , H03H9/14588
摘要： A surface acoustic wave element 1 comprises a piezoelectric substrate 19, IDT electrodes 3, 4, 5 of an odd number not less than three formed along a propagation direction of surface acoustic waves that propagates on the piezoelectric substrate, wherein IDT electrodes 3, 5 of the odd number of IDT electrodes 3, 4, 5 disposed on both sides of an IDT electrode 4 that is located at the center are connected to first and second reference potential terminals 14, 15, respectively, and the first and second reference potential terminals 14 and 15 are formed asymmetrically with respect to a virtual central axis A that passes through the center of the IDT electrode 4 located at the center and provided in a direction perpendicular to the propagation direction.
摘要翻译：表面声波元件1包括压电基板19，沿着在压电基板上传播的表面声波的传播方向形成的奇数不小于3的IDT电极3,4,5，其中IDT电极3,5，设置在位于中心的IDT电极4的两侧的奇数IDT电极3,4,5分别连接到第一和第二参考电位端子14,15，并且第一和第二参考电位端子14 并且相对于穿过位于中心并沿与传播方向垂直的方向设置的IDT电极4的中心的虚拟中心轴A不对称地形成。

8. 发明申请

US20060099418A1 Extremely fine shape memory alloy wire, composite material thereof and process for producing the same 审中-公开
标题翻译：非常细的形状记忆合金丝，其复合材料及其制造方法
公开(公告)号：US20060099418A1
公开(公告)日：2006-05-11
申请号：US10516617
申请日：2003-06-04
申请人： Ya Xu , Kazuhiro Otsuka , Nobuyuki Toyama , Yoshio Akimune , Teruo Kishi
发明人： Ya Xu , Kazuhiro Otsuka , Nobuyuki Toyama , Yoshio Akimune , Teruo Kishi
IPC分类号： D02G3/00
CPC分类号： G01C3/08 , Y10T428/2933
摘要： Disclosed is a shape memory alloy wire subjected to a cold drawing work, which comprises a shape memory alloy in a martensitic phase which assumes an austenitic phase or a martensitic phase through phase transformation temperatures, has a diameter of 60 μm or less, and has a reverse transformation termination temperature of at least 250° C. By using the alloy wire, a composite material having the alloy wire embedded in a resin having a molding temperature as high as 180° C., such as a glass fiber reinforced resin or a carbon fire reinforced resin, without fixing of both wire ends.
摘要翻译：公开了一种经受冷拉伸加工的形状记忆合金丝，其包括通过相变温度呈奥氏体相或马氏体相的马氏体相的形状记忆合金，其直径为60μm以下，具有反相转变终止温度为至少250℃。通过使用合金丝，将具有嵌入到成型温度高达180℃的树脂中的合金丝的复合材料，例如玻璃纤维增强树脂或碳防火增强树脂，不固定两个电线端。

9. 发明申请

US20050095342A1 Packaged, tea-based beverages 有权
标题翻译：包装茶饮料
公开(公告)号：US20050095342A1
公开(公告)日：2005-05-05
申请号：US10964630
申请日：2004-10-15
申请人： Yoshikazu Ogura , Kazuhiro Otsuka , Susumu Ohishi , Takeshi Yasumasu , Yasushi Yamada
发明人： Yoshikazu Ogura , Kazuhiro Otsuka , Susumu Ohishi , Takeshi Yasumasu , Yasushi Yamada
IPC分类号： A23L2/52 , A23F3/16 , A23F3/00
CPC分类号： A23F3/163
摘要： Provided are packaged, tea-based beverages, which contain non-polymer catechins at high concentration, are reduced in bitterness, acridness and the like, and are improved in flavor and taste. They contain the following ingredients (A), (B) and (C): (A) from 320 mg/500 mL to 1,300 mg/500 mL of non-polymer catechins, (B) caffeine, and (C) water, wherein: (D) the content of non-epicatechins in the non-polymer catechins is from 40 to 80 wt. %, (E) the weight ratio of the non-polymer catechins to the caffeine is from 5 to 8, (F) the weight ratio of the non-polymer catechins to total polyphenols is from 0.88 to 1.0, (G) the turbidity is 0.7 or lower, and (H) the pH is from 5 to 7.
摘要翻译：提供含有浓度高的非聚合型儿茶素类的包装茶基饮料的苦味，刺激性等降低，味道和味道得到改善。它们含有以下成分（A），（B）和（C）：（A）320mg / 500mL至1,300mg / 500mL的非聚合型儿茶素类，（B）咖啡因和（C）水，其中（D）非聚合型儿茶素类中的非表儿茶素的含量为40〜80重量％。％，（E）非聚合型儿茶素类与咖啡因的重量比为5〜8（F）非聚合型儿茶素与总多酚的重量比为0.88〜1.0，（G）浊度为 0.7以下，（H）pH为5〜7。

10. 发明授权

US06537962B1 Composite powder 失效
标题翻译：复合粉
公开(公告)号：US06537962B1
公开(公告)日：2003-03-25
申请号：US09508816
申请日：2000-03-17
申请人： Kazuo Oki , Takashi Miyaji , Kazuhiro Otsuka , Mikio Sakaguchi
发明人： Kazuo Oki , Takashi Miyaji , Kazuhiro Otsuka , Mikio Sakaguchi
IPC分类号： C01B3332
CPC分类号： C11D3/046 , C11D3/08 , C11D3/10
摘要： The present invention pertains to a composite powder comprising (A) an alkali metal silicate particle having an average particle size of from 1 to 500 &mgr;m; and (B) a water-soluble salt particle having an average particle size of from 0.01 to 50 &mgr;m, of which solubility to water at 20° C. is 1 g/100 g or more, wherein the alkali metal silicate particle has a composition formula in an anhydride form represented by: xM2O.ySiO2.zMeO (I) wherein M stands for Na and/or K; Me stands for Ca and/or Mg; y/x is from 0.5 to 4.0; z/x is from 0 to 1.0; and Mg/Ca in MeO is from 0 to 10, and wherein the composite powder has a (A)/(B) weight ratio of from 1/9 to 99/1; and a detergent composition comprising the composite powder. The composite powder is a composite powder having a remarkably enhanced storage stability of the alkali metal silicate without impairing the ion exchange capacity owned by the alkali metal silicate.
摘要翻译：本发明涉及复合粉末，其包含（A）平均粒径为1〜500μm的碱金属硅酸盐颗粒; 和（B）平均粒径为0.01〜50μm的水溶性盐粒子，其在20℃下对水的溶解度为1g / 100g以上，其中，碱金属硅酸盐粒子的组成由下式表示的酸酐形式：xM2O.ySiO2.zMeO（I）其中M代表Na和/或K; 我代表Ca和/或Mg; y / x为0.5〜4.0; z / x为0〜1.0; 和MeO中的Mg / Ca为0至10，并且其中复合粉末的（A）/（B）重量比为1/9至99/1; 以及包含所述复合粉末的洗涤剂组合物。该复合粉末是具有显着增强的碱金属硅酸盐的储存稳定性而不损害碱金属硅酸盐所具有的离子交换能力的复合粉末。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式