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1. 发明授权

US08787030B2 Multilayer circuit board with resin bases and separators 有权
标题翻译：多层电路板，带树脂底座和隔板
公开(公告)号：US08787030B2
公开(公告)日：2014-07-22
申请号：US13124751
申请日：2009-10-28
申请人： Akira Oikawa
发明人： Akira Oikawa
IPC分类号： H05K7/00
CPC分类号： H05K3/4635 , H05K1/165 , H05K3/4617 , H05K2201/0129 , H05K2201/09672
摘要： A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N−1) in between, interconnect patterns (111 to 11N) respectively formed on one surface of each of the resin bases (101 to 10N), and electro-conductive bumps (201 to 20N−1) which electrically connect the interconnect patterns (111 to 11N). The resin bases (101 to 10N) and the separators (121 to 12N−1) are heat-bonded, the separators (121 to 12N−1) are composed of a first thermoplastic resin material having a first glass transition temperature, and the resin bases (101 to 10N) are composed of a second thermoplastic resin material having a second glass transition temperature higher than the first glass transition temperature.
摘要翻译：多层电路板（1）包括在分隔件（121至12N-1）之间堆叠的树脂基座（101至10N），分别形成在每个树脂基座（101至12N-1）的一个表面上的互连图案（111至11N） 10N）和电连接布线图案（111〜11N）的导电凸块（201〜20N-1）。树脂基（101〜10N）和隔板（121〜12N-1）进行热粘合，隔板（121〜12N-1）由具有第一玻璃化转变温度的第一热塑性树脂材料构成，树脂碱（101〜10N）由第二玻璃化转变温度高于第一玻璃化转变温度的第二热塑性树脂材料构成。

2. 发明申请

US20110211321A1 MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US20110211321A1
公开(公告)日：2011-09-01
申请号：US13124751
申请日：2009-10-28
申请人： Akira Oikawa
发明人： Akira Oikawa
IPC分类号： H05K1/16 , H05K1/03 , H05K1/09 , H05K3/36
CPC分类号： H05K3/4635 , H05K1/165 , H05K3/4617 , H05K2201/0129 , H05K2201/09672
摘要： A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N−1) in between, interconnect patterns (111 to 11N) respectively formed on one surface of each of the resin bases (101 to 10N), and electro-conductive bumps (201 to 20N−1) which electrically connect the interconnect patterns (111 to 11N). The resin bases (101 to 10N) and the separators (121 to 12N−1) are heat-bonded, the separators (121 to 12N−1) are composed of a first thermoplastic resin material having a first glass transition temperature, and the resin bases (101 to 10N) are composed of a second thermoplastic resin material having a second glass transition temperature higher than the first glass transition temperature.
摘要翻译：多层电路板（1）包括在分隔件（121至12N-1）之间堆叠的树脂基座（101至10N），分别形成在每个树脂基座（101至12N-1）的一个表面上的互连图案（111至11N） 10N）和电连接布线图案（111〜11N）的导电凸块（201〜20N-1）。树脂基（101〜10N）和隔板（121〜12N-1）进行热粘合，隔板（121〜12N-1）由具有第一玻璃化转变温度的第一热塑性树脂材料构成，树脂碱（101〜10N）由第二玻璃化转变温度高于第一玻璃化转变温度的第二热塑性树脂材料构成。

3. 发明申请

US20060220500A1 Method for manufacturing surface acoustic wave device 有权
标题翻译：声表面波装置的制造方法
公开(公告)号：US20060220500A1
公开(公告)日：2006-10-05
申请号：US11445586
申请日：2006-06-01
申请人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
发明人： Mitsutaka Shimada , Yoshifumi Yamagata , Kazuhiro Otsuka , Masafumi Hisataka , Akira Oikawa , Michihiko Kuwahata , Masaru Yamano
IPC分类号： H03H9/25
CPC分类号： H03H9/1085 , G01H3/12 , H01L21/561 , H01L23/3135 , H01L23/315 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/73203 , H01L2224/81801 , H01L2924/09701 , H03H3/08 , H03H9/059 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , H01L2924/00012
摘要： A surface acoustic wave device is disclosed, which comprises a surface acoustic wave element including a lithium tantalate piezoelectric substrate 10 with one principal surface thereof formed with an IDT electrode 11, a connector electrode 12 and a periphery sealing electrode 13, and a base substrate 2 formed with an electrode 21 for connection to the element connected to the connector electrode 12 through a solder bump component 3 and a periphery sealing conductor film 22 joined to the periphery sealing electrode 13 thorough a solder sealing component 4. For the solder bump component 3 and the solder sealing component 4, a Sn—Sb based or Sn—Ag based lead-free solder containing 90% or more Sn is used, and the thermal expansion coefficient of the base substrate 2 is set in the range of 9-20 pm/° C. The joining is accomplished with high stability resisting thermal stress due to a difference in thermal expansion coefficient, so that a surface acoustic wave device that can maintain stable connection for a long duration of time can be provided.
摘要翻译：公开了一种弹性表面波器件，它包括一个表面声波元件，它包括其一个主表面形成有IDT电极11的钽酸锂压电基片10，一个连接器电极12和一个周边密封电极13，以及一个基底基片2 形成有用于通过焊料凸块部件3连接到连接到连接器电极12的元件的电极21和通过焊料密封部件4接合到周围密封电极13的周围密封导体膜22。对于焊料凸块部件3和焊料密封部件4，使用含有90％以上Sn的Sn-Sb系或Sn-Ag系无铅焊料，将基底基板2的热膨胀系数设定在范围为9-20μm/℃。由于热膨胀系数的差异，能够以高稳定性抵抗热应力实现接合，从而可以提供能够长时间保持稳定连接的表面声波装置。

4. 发明申请

US20110000702A1 CIRCUIT BOARD 审中-公开
标题翻译：电路板
公开(公告)号：US20110000702A1
公开(公告)日：2011-01-06
申请号：US12920110
申请日：2009-03-10
申请人： Akira Oikawa
发明人： Akira Oikawa
IPC分类号： H05K1/03
CPC分类号： H05K1/0224 , H05K1/0253 , H05K1/0393 , H05K1/095 , H05K3/4664 , H05K2201/0715 , H05K2201/09681 , H05K2201/09909
摘要： A signal line (2) is formed on one surface of a base substrate (1), and a cover lay film (3) is laminated further. A plurality of projections (4) made of an insulating material are formed at substantially regular intervals vertically and laterally on an upper surface of the above-mentioned cover lay film and a ground layer (5), for example, made of a silver paste is formed on the above-mentioned cover lay film except for the arranged position of each of the above-mentioned projections.In this case, a film thickness of the ground layer made of said conductive paste is formed to be less than a height of a top of said projection arranged at an insulating layer, so that an openings (gaps) substantially in the shape of a mesh can be formed at the ground layer made of the conductive paste because of the existence of the projection.Thus, it is possible to provide a circuit board achieving the similar effect to that of a ground plane having gaps substantially in the shape of a mesh.
摘要翻译：信号线（2）形成在基底（1）的一个表面上，并且覆盖膜（3）被进一步层压。由绝缘材料制成的多个突起（4）在上述覆盖膜的上表面上以垂直和横向大致规则的间隔形成，并且例如由银膏制成的接地层（5）形成在上述盖板上，除了每个上述突起的布置位置。在这种情况下，由所述导电膏制成的接地层的膜厚度形成为小于布置在绝缘层上的所述突起的顶部的高度，从而形成基本上为网状的开口（间隙）可以由于存在投影而在由导电浆料制成的接地层处形成。因此，可以提供一种电路板，其实现与具有基本上为网状形状的间隙的接地平面类似的效果。

5. 发明申请

US20100172058A1 FLEXIBLE WIRING UNIT AND ELECTRONIC DEVICE 审中-公开
标题翻译：柔性布线单元和电子设备
公开(公告)号：US20100172058A1
公开(公告)日：2010-07-08
申请号：US12602098
申请日：2008-06-20
申请人： Akira Oikawa
发明人： Akira Oikawa
IPC分类号： G11B21/16 , H05K1/00
CPC分类号： G11B7/12 , G11B33/122 , H05K1/028 , H05K3/0061 , H05K3/0064 , H05K2201/2009 , H05K2201/2036
摘要： A reciprocating motion of a head unit produces a change in front-to-back length of the lower face of a flexible substrate opposing a metal base. However, between the lower face of the flexible substrate and the upper face of the metal base opposing each other, a non-conductive substrate spacer of a predetermined plate thickness is constantly interposed. Such structure suppresses fluctuation in impedance of the flexible substrate arising from fluctuation in capacitance between the flexible substrate and the metal base, within a predetermined range. Consequently, with the structure that the moving heat unit is connected to the flexible substrate, a communication error of the flexible substrate, can be prevented.
摘要翻译：头单元的往复运动产生与金属基座相对的柔性基板的下表面的前后长度的变化。然而，在柔性基板的下表面和金属基板的彼此相对的上表面之间，始终插入具有预定板厚度的非导电基板间隔件。这种结构抑制了由柔性基板和金属基底之间的电容的波动引起的柔性基板的阻抗波动在预定范围内。因此，通过移动加热单元连接到柔性基板的结构，可以防止柔性基板的通信误差。

6. 发明授权

US07353710B2 Pressure sensor device with surface acoustic wave elements 失效
标题翻译：带声表面波元件的压力传感器
公开(公告)号：US07353710B2
公开(公告)日：2008-04-08
申请号：US10580899
申请日：2004-11-26
申请人： Akira Oikawa , Kaoru Matsuo , Hiroshi Tachioka
发明人： Akira Oikawa , Kaoru Matsuo , Hiroshi Tachioka
IPC分类号： G01L11/00
CPC分类号： G01L9/0025
摘要： Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.
摘要翻译：压力检测用压电基板（2）的厚度比支撑压电基板（3）薄，并且在其下表面具有用于压力检测的表面声波元件（7a）的厚度安装在支撑压电基板（3）在其上表面具有用于参考的表面声波元件（4a）。密封构件（5）设置在支撑压电基板（3）和压力检测用压电基板（1）之间。用于压力检测的表面声波元件（7a）和用于参考的表面声波元件（4a）可以设置在由压力检测压电基板（1）和密封构件（5）包围的空间（S）中）。可以提供能够进行温度补偿且具有高可靠性的小型压力传感器装置（1）。

7. 发明申请

US20070107522A1 Pressure sensor device 失效
标题翻译：压力传感器装置
公开(公告)号：US20070107522A1
公开(公告)日：2007-05-17
申请号：US10580899
申请日：2004-11-26
申请人： Akira Oikawa , Kaoru Matsuo , Hiroshi Tachioka
发明人： Akira Oikawa , Kaoru Matsuo , Hiroshi Tachioka
IPC分类号： G01L9/00
CPC分类号： G01L9/0025
摘要： Thickness of a pressure-detecting piezoelectric substrate (2) that is thinner than that of a supporting piezoelectric substrate (3) and that has a surface acoustic wave element for pressure detection (7a) on its lower surface is mounted on the supporting piezoelectric substrate (3) having a surface acoustic wave element for reference (4a) on its upper surface. A sealing member (5) is provided between the supporting piezoelectric substrate (3) and the pressure-detecting piezoelectric substrate (1). The surface acoustic wave element for pressure detection (7a) and the surface acoustic wave element for reference (4a) can be disposed in a space (S) enclosed with the pressure-detecting piezoelectric substrate (1) and the sealing member (5). It is possible to provide a small-sized pressure sensor device (1) that can perform temperature compensation and that has high reliability.
摘要翻译：压力检测用压电基板（2）的厚度比支撑压电基板（3）薄，并且在其下表面具有用于压力检测的表面声波元件（7a）的厚度安装在支撑压电基板（3）在其上表面具有用于参考的表面声波元件（4a）。密封构件（5）设置在支撑压电基板（3）和压力检测用压电基板（1）之间。用于压力检测的表面声波元件（7a）和用于参考的表面声波元件（4a）可以设置在由压力检测压电基板（1）和密封构件（5）包围的空间（S）中）。可以提供能够进行温度补偿且具有高可靠性的小型压力传感器装置（1）。

8. 发明授权

US6127098A Method of making resist patterns 失效
标题翻译：制作抗菌图案的方法
公开(公告)号：US6127098A
公开(公告)日：2000-10-03
申请号：US955371
申请日：1997-10-21
申请人： Kenji Nakagawa , Ei Yano , Akira Oikawa , Masao Kanazawa , Hiroshi Kudo
发明人： Kenji Nakagawa , Ei Yano , Akira Oikawa , Masao Kanazawa , Hiroshi Kudo
IPC分类号： G03F7/004 , G03F7/40
CPC分类号： G03F7/40 , G03F7/405 , G03F7/0045
摘要： A method of forming a resist pattern including the steps of: forming a resist film by coating resist on the surface of a member to be processed, the resist containing a composition A capable of increasing the volume by chemical reaction; exposing and developing the coated resist film to form a pattern having an opening; and chemically reacting fluid containing a composition B with the composition A by contacting the fluid with the composition A to change the size of the opening of the resist film, the composition B being capable of increasing the volume of the composition A by chemical reaction with the composition A. It is possible to form a fine resist pattern by a simple method.
摘要翻译：一种形成抗蚀剂图案的方法，包括以下步骤：通过在待加工构件的表面上涂覆抗蚀剂形成抗蚀剂膜，该抗蚀剂含有能够通过化学反应增加体积的组合物A; 曝光和显影涂覆的抗蚀剂膜以形成具有开口的图案; 以及通过使流体与组合物A接触来使含有组合物B的流体与组合物A化学反应以改变抗蚀剂膜的开口尺寸，组合物B能够通过与组合物A的化学反应来增加组合物A的体积组合物A.可以通过简单的方法形成精细的抗蚀剂图案。

9. 发明授权

US5484687A Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof 失效
标题翻译：聚硅氧烷基硅氧烷，其制造方法以及由其形成的抗蚀剂材料和半导体器件
公开(公告)号：US5484687A
公开(公告)日：1996-01-16
申请号：US98877
申请日：1993-07-29
申请人： Keiji Watanabe , Akira Oikawa , Shun-ichi Fukuyama , Masaaki Yamagami , Takahisa Namiki
发明人： Keiji Watanabe , Akira Oikawa , Shun-ichi Fukuyama , Masaaki Yamagami , Takahisa Namiki
IPC分类号： C08G77/52 , G03F7/075 , G03F7/26 , G03C5/16
CPC分类号： G03F7/0757 , C08G77/52 , Y10S430/143 , Y10S430/168 , Y10S438/948
摘要： Novel polysilphenylenesiloxanes having a three-dimensional mesh structure of silphenylenesiloxane core surrounded by triorganosilyl groups, which have a good sensitivity to ionizing radiations such as deep ultraviolet rays, electron beams and X-rays, a high softening point of 400.degree. C. or more, and a good resistance to O.sub.2 -plasma etching, and exhibit a high contrast and low swelling. These polysiphenylenesiloxanes are useful as a resist material, especially a top layer resist of the bi-level resist system and an interlevel dielectric or heat-resisting protective layer. The resist material has a high resolution because of a high contrast, low swelling and high thermal resistance thereof.
摘要翻译：具有由三有机甲硅烷基包围的硅烷基硅氧烷核心的三维网状结构的新型聚硅氧烷硅氧烷，其具有对电离辐射如深紫外线，电子束和X射线的高灵敏度，高软化点在400℃以上，并且具有良好的耐等离子体蚀刻性，并且具有高对比度和低溶胀度。这些多苯基硅氧烷可用作抗蚀剂材料，特别是双层抗蚀剂体系的顶层抗蚀剂和层间电介质或耐热保护层。抗蚀剂材料由于对比度高，溶胀低，耐热性高而具有高分辨率。

10. 发明授权

US09386703B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09386703B2
公开(公告)日：2016-07-05
申请号：US14345143
申请日：2012-09-13
申请人： Akira Oikawa
发明人： Akira Oikawa
IPC分类号： H05K7/00 , H05K1/18 , H03H9/05 , H03H9/10 , H05K3/28 , H01L23/31 , H05K1/02
CPC分类号： H05K1/185 , H01L23/3121 , H01L23/315 , H01L2224/16225 , H03H9/059 , H03H9/1085 , H05K1/0271 , H05K3/284 , H05K2201/10068
摘要： The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.
摘要翻译：该电子装置设置有布线板，安装在布线板的上表面（前表面）上以使其功能表面（主表面）面向上表面的压电元件（电子部件），以及树脂部分粘附到压电元件的侧表面和布线板，并且密封布线板的上表面和压电元件的功能表面之间的相对的空间。此外，树脂部分相对于相对的空间凹陷成形。

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