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1. 发明授权

US06361831B1 Paste application method for die bonding 有权
标题翻译：贴片应用方法
公开(公告)号：US06361831B1
公开(公告)日：2002-03-26
申请号：US09544385
申请日：2000-04-06
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05D118
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

2. 发明授权

US06348234B1 Paste applying method 有权
标题翻译：粘贴方法
公开(公告)号：US06348234B1
公开(公告)日：2002-02-19
申请号：US09536614
申请日：2000-03-28
申请人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
发明人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
IPC分类号： B05D510
CPC分类号： H01L21/67253 , B05C5/0216 , H01L21/67144 , H01L21/68
摘要： In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.
摘要翻译：另外，在涂布在被涂物的表面上的涂布区域中的糊剂涂布方法中，通过将糊状物以规定了凹凸形状的凹凸形状的波纹图案进行涂布，提高了涂布效果，提高了涂布质量没有糊状物的物体的表面的内部，其中内部区域基本上被糊的起伏图案包围。应用喷嘴的排出口通过多个通过点沿着移动路线以一条连续的线从应用开始点移动到应用端点。多个通过点被设置在应用区域的每个角上，并且包括多个第一通过点和多个第二通过点，其中第一通过点被设置在应用区域的每个角落处，而第二通过点是设置在应用领域的中央。

3. 发明授权

US06685777B2 Paste applicator and paste application method for die bonding 失效
标题翻译：贴片涂布机和贴剂应用方法
公开(公告)号：US06685777B2
公开(公告)日：2004-02-03
申请号：US09998526
申请日：2001-11-28
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05C1100
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

4. 发明授权

US06605315B1 Bonding paste applicator and method of using it 有权
标题翻译：粘合膏涂布器及其使用方法
公开(公告)号：US06605315B1
公开(公告)日：2003-08-12
申请号：US09704728
申请日：2000-11-03
申请人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji , Nobuyuki Iwashita
发明人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji , Nobuyuki Iwashita
IPC分类号： B05D510
CPC分类号： H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , Y10T29/4913
摘要： The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit 46 a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table 53 to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit 54 and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit 55. Accordingly, it is no longer required to set up a drawing pattern every time occasion demands and a paste can be applied properly with excellent paste applying quality and satisfactory operability without fail.
摘要翻译：本发明的目的是提供一种粘合膏施加器和施加粘合膏的方法，其能够实现令人满意的糊料施加质量和优异的可操作性。一种用于通过利用制成移动到芯片安装在基板上的位置的糊状施加喷嘴进行拉伸来施加粘合膏的粘合膏施加方法包括以下步骤：将预先存储在存储单元46中的拉丝图案为了控制X，Y和Z轴中的每一个，移动糊剂施加喷嘴和绘图图形设置表53，以显示与要粘合的芯片的尺寸对应的类别，选择与芯片的尺寸对应的绘制图案，已经通过绘图模式选择单元54被指定，并且通过速度模式计算单元55基于所选择的绘图模式来获得X，Y和Z轴中的每一个的速度图案。因此，它不是需要更长时间才能在每次需要时设置绘图图案，并且可以适当地应用糊状物，并且不会出现具有优异的糊剂施加质量和令人满意的操作性。

5. 发明授权

US06460756B2 Method of applying bonding paste 失效
标题翻译：粘贴膏的方法
公开(公告)号：US06460756B2
公开(公告)日：2002-10-08
申请号：US09904548
申请日：2001-07-16
申请人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji
发明人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji
IPC分类号： B23K3102
CPC分类号： H01L21/6715 , B23K3/0607 , H01L24/743 , H01L2224/743 , H01L2924/00
摘要： A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.
摘要翻译：提出了一种通过从施加喷嘴排出粘合膏而有效且均匀地施加粘合膏的方法。为了沿着包括由多条涂布线交叉的十字形图案的拉丝图案涂布浆料，喷嘴沿着一条涂布线从十字形的中心移动到终点，在端点处转向相反方向，移动到应用程序行对面的终点。然后，喷嘴从终点返回到十字形的中心。喷嘴对每个应用行重复本单元应用程序绘图操作。结果，喷嘴在中心附近停止的频率较低，循环时间缩短，均匀地涂抹。

6. 发明授权

US08614118B2 Component bonding method, component laminating method and bonded component structure 有权
标题翻译：组分粘合方法，组分层压方法和结合组分结构
公开(公告)号：US08614118B2
公开(公告)日：2013-12-24
申请号：US12280615
申请日：2007-02-09
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Masaru Nonomura
IPC分类号： H01L21/00
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/29007 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.
摘要翻译：提供了一种将在其下表面上形成有热固性粘合层的半导体部件与其表面上形成有树脂层的电路板接合的部件接合方法。在该方法中，通过对电路板的树脂表面进行等离子体处理的表面改性来提高润湿性，半导体部件由具有加热器的部件保持喷嘴保持，粘合层与表面改性树脂层接触，并且通过加热器加热并热固化粘合剂层。由此，可以提高粘合剂层与树脂表面之间的粘附性，从而能够使部件保持用喷嘴与半导体部件分离，而不用等待粘合剂层的完全硬化。因此，通过减少部件接合所需的时间，可以提高热压加工的生产率。

7. 发明申请

US20090000109A1 Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus 审中-公开
标题翻译：电子部件拾取方法，电子部件安装方法和电子部件安装装置
公开(公告)号：US20090000109A1
公开(公告)日：2009-01-01
申请号：US11576362
申请日：2005-10-04
申请人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
发明人： Mitsuru Ozono , Hiroshi Haji , Teruaki Kasai
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier.An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.
摘要翻译：为了提供电子部件拾取方法，电子部件安装方法和电子部件安装装置，能够以高生产率稳定地拾取附着并保持在载体上的电子部件。用于通过支撑工具20拾取用粘合剂层5a粘附并保持在片材5上的芯片6的电子部件拾取方法使用含有通过辐射产生气体的化合物的粘合剂。在拾取操作中，支撑工具20与芯片6的顶表面接触，并且光辐射部分8位于芯片6的下方。然后紫外线从片材5的底表面辐射到粘合剂位于芯片6的后表面上的层5a。当从粘合剂层5a产生的氮气在芯片6的后表面和粘合剂层5a之间的粘合界面处形成气体层G时，支撑工具20 被提起拿起芯片6。

8. 发明授权

US06617675B2 Semiconductor device and semiconductor device assembly 有权
标题翻译：半导体器件和半导体器件组件
公开(公告)号：US06617675B2
公开(公告)日：2003-09-09
申请号：US10012540
申请日：2001-12-12
申请人： Tadahiko Sakai , Mitsuru Ozono , Shoji Sakemi , Yoshiyuki Wada
发明人： Tadahiko Sakai , Mitsuru Ozono , Shoji Sakemi , Yoshiyuki Wada
IPC分类号： H01L2302
CPC分类号： H01L23/562 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/3511 , H01L2224/05599
摘要： A semiconductor device assembly and a semiconductor device are provided which both can ensure reliability after a mounting process. The semiconductor device includes a semiconductor element equipped with bumps on an electrode patterned surface thereof for external connection. In the semiconductor device mounted on a substrate in the semiconductor device assembly, a semiconductor element shaped to have a thickness ranging from 200 &mgr;m to 10 &mgr;m has reduced flexural rigidity so as to be easily deflected. In the status that the bumps are joined to corresponding circuitry electrodes on the substrate, the semiconductor element can deflect at other portions other than its surface between two adjacent bumps according to contraction and distortion of the substrate. This allows the bumps to be dislocated in a direction parallel to a surface of the semiconductor element, hence relieving stress developed by the contraction of the substrate at the joint positions between the bumps and the circuitry electrodes.
摘要翻译：提供半导体器件组件和半导体器件，其可以在安装过程之后确保可靠性。半导体器件包括在其电极图案化表面上配备有用于外部连接的凸块的半导体元件。在安装在半导体器件组件中的衬底上的半导体器件中，成形为具有200μm至10μm的厚度的半导体元件具有降低的弯曲刚度以便容易偏转。在凸起接合到衬底上的相应电路电极的状态下，根据衬底的收缩和变形，半导体元件可以在两个相邻凸点之间的除其表面之外的其它部分处偏转。这允许凸起在平行于半导体元件的表面的方向上脱位，从而减轻由凸起和电路电极之间的接合位置处的基板的收缩而产生的应力。

9. 发明授权

US08192578B2 Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method 有权
标题翻译：芯片拾取装置，芯片拾取方法，芯片释放装置和芯片释放方法
公开(公告)号：US08192578B2
公开(公告)日：2012-06-05
申请号：US12089865
申请日：2006-10-13
申请人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
发明人： Hiroshi Haji , Mitsuru Ozono , Teruaki Kasai , Kazuhiro Noda
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S156/932 , Y10S156/943 , Y10S438/976 , Y10T156/1132 , Y10T156/1179 , Y10T156/1195 , Y10T156/1944 , Y10T156/1983 , Y10T156/1994
摘要： In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.
摘要翻译：在拾取装置中，附着在片材上的芯片由拾取喷嘴吸引并保持，然后由喷嘴拾起，将通过形成球形的诸如橡胶的柔性弹性材料构成的片状上推构件安装在工具上表面的基台支撑表面，则片材上推构件的上推表面沿着片材的下表面处于平坦表面状态，并且在拾取喷嘴的向下移动状态下与其邻接然后在拾取喷嘴与芯片一起向上移动的上移操作中，上推表面向上推动纸张的下表面，同时以向上突出的曲面形状变形。因此，芯片可以从芯片的外周侧从片材释放。

10. 发明授权

US08148253B2 Electronic component soldering structure and electronic component soldering method 有权
标题翻译：电子元件焊接结构和电子元件焊接方法
公开(公告)号：US08148253B2
公开(公告)日：2012-04-03
申请号：US11816558
申请日：2006-11-22
申请人： Mitsuru Ozono , Tadahiko Sakai , Hideki Eifuku
发明人： Mitsuru Ozono , Tadahiko Sakai , Hideki Eifuku
IPC分类号： H01L21/44
CPC分类号： H05K3/363 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/3011 , H01L2924/351 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/0465 , Y02P70/613 , Y10T428/24182 , H01L2924/00 , H01L2924/0103 , H01L2924/01047 , H01L2924/01083 , H01L2224/29311 , H01L2224/29313 , H01L2924/00012 , H01L2224/81805 , H01L2224/05599
摘要： In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are mixed in thermosetting resin has been applied onto the rigid substrate so as to cover the electrode, the flexible substrate is put on the rigid substrate and heat-pressed, whereby there are formed a resin part that bonds the both substrates by thermosetting of the thermosetting resin, and a solder part which is surrounded by the resin part and has narrowed parts in which the peripheral surface is narrowed inward in the vicinity of the terminal surface and in the vicinity of the electrode surface. Hereby, the solder parts are soldered to the electrodes and the terminal at acute contact angles so that the production of shape-discontinuities which lowers fatigue strength can be eliminated.
摘要翻译：在将柔性基板上设置的端子与刚性基板的电极连接的电子部件焊接方法中，在刚性基板上涂布有焊料粒子混合在热固性树脂中的焊料混合树脂之后，覆盖电极，将柔性基板放置在刚性基板上并进行热压，由此形成通过热固性树脂的热固性将两个基板接合的树脂部分和由树脂部分包围并且具有变窄部分的焊接部分外周表面在端子表面附近和电极表面附近向内变窄。因此，焊接部件以急剧接触角度焊接到电极和端子，使得可以消除降低疲劳强度的形状不连续性的产生。

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