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1. 发明授权

US06685777B2 Paste applicator and paste application method for die bonding 失效
标题翻译：贴片涂布机和贴剂应用方法
公开(公告)号：US06685777B2
公开(公告)日：2004-02-03
申请号：US09998526
申请日：2001-11-28
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05C1100
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

2. 发明授权

US06361831B1 Paste application method for die bonding 有权
标题翻译：贴片应用方法
公开(公告)号：US06361831B1
公开(公告)日：2002-03-26
申请号：US09544385
申请日：2000-04-06
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05D118
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

3. 发明授权

US06348234B1 Paste applying method 有权
标题翻译：粘贴方法
公开(公告)号：US06348234B1
公开(公告)日：2002-02-19
申请号：US09536614
申请日：2000-03-28
申请人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
发明人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
IPC分类号： B05D510
CPC分类号： H01L21/67253 , B05C5/0216 , H01L21/67144 , H01L21/68
摘要： In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.
摘要翻译：另外，在涂布在被涂物的表面上的涂布区域中的糊剂涂布方法中，通过将糊状物以规定了凹凸形状的凹凸形状的波纹图案进行涂布，提高了涂布效果，提高了涂布质量没有糊状物的物体的表面的内部，其中内部区域基本上被糊的起伏图案包围。应用喷嘴的排出口通过多个通过点沿着移动路线以一条连续的线从应用开始点移动到应用端点。多个通过点被设置在应用区域的每个角上，并且包括多个第一通过点和多个第二通过点，其中第一通过点被设置在应用区域的每个角落处，而第二通过点是设置在应用领域的中央。

4. 发明授权

US06605315B1 Bonding paste applicator and method of using it 有权
标题翻译：粘合膏涂布器及其使用方法
公开(公告)号：US06605315B1
公开(公告)日：2003-08-12
申请号：US09704728
申请日：2000-11-03
申请人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji , Nobuyuki Iwashita
发明人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji , Nobuyuki Iwashita
IPC分类号： B05D510
CPC分类号： H01L24/27 , H01L24/29 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , Y10T29/4913
摘要： The object of the present invention is to provide a bonding paste applicator and a method of applying a bonding paste which allow satisfactory paste applying quality and excellent operability to be realized. A bonding paste application method for applying a bonding paste by making a drawing with a paste applying nozzle made to move to a position, where a chip is mounted on a substrate, comprises the steps of storing in advance in a storing unit 46 a drawing pattern for controlling each of X, Y and Z axes to move a paste applying nozzle and a drawing pattern setting table 53 to show a category corresponding to the size of a chip to be bonded, selecting a drawing pattern corresponding to the size of the chip, which has been designated, by means of a drawing pattern selecting unit 54 and obtaining a speed pattern for each of the X, Y and Z axes based on the selected drawing pattern by means of a speed pattern computing unit 55. Accordingly, it is no longer required to set up a drawing pattern every time occasion demands and a paste can be applied properly with excellent paste applying quality and satisfactory operability without fail.
摘要翻译：本发明的目的是提供一种粘合膏施加器和施加粘合膏的方法，其能够实现令人满意的糊料施加质量和优异的可操作性。一种用于通过利用制成移动到芯片安装在基板上的位置的糊状施加喷嘴进行拉伸来施加粘合膏的粘合膏施加方法包括以下步骤：将预先存储在存储单元46中的拉丝图案为了控制X，Y和Z轴中的每一个，移动糊剂施加喷嘴和绘图图形设置表53，以显示与要粘合的芯片的尺寸对应的类别，选择与芯片的尺寸对应的绘制图案，已经通过绘图模式选择单元54被指定，并且通过速度模式计算单元55基于所选择的绘图模式来获得X，Y和Z轴中的每一个的速度图案。因此，它不是需要更长时间才能在每次需要时设置绘图图案，并且可以适当地应用糊状物，并且不会出现具有优异的糊剂施加质量和令人满意的操作性。

5. 发明授权

US06460756B2 Method of applying bonding paste 失效
标题翻译：粘贴膏的方法
公开(公告)号：US06460756B2
公开(公告)日：2002-10-08
申请号：US09904548
申请日：2001-07-16
申请人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji
发明人： Mitsuru Ozono , Seiichi Sato , Nobuyuki Suefuji
IPC分类号： B23K3102
CPC分类号： H01L21/6715 , B23K3/0607 , H01L24/743 , H01L2224/743 , H01L2924/00
摘要： A method of applying a bonding paste efficiently and uniformly by discharging the bonding paste from an application nozzle is presented. For applying the paste along a drawing pattern including a cross shape pattern composed of crossing plural application lines, the nozzle moves from the center of the cross shape to an end point along one application line, turns to a reverse direction at the end point, and moves to an end point at opposite side of the application line. Then, the nozzle returns from the end point to the center of the cross shape. The nozzle repeats this unit application line drawing operation for each application line. As a result, the nozzle stops less frequently near the center, has a shortened cycle time, and applies the paste uniformly.
摘要翻译：提出了一种通过从施加喷嘴排出粘合膏而有效且均匀地施加粘合膏的方法。为了沿着包括由多条涂布线交叉的十字形图案的拉丝图案涂布浆料，喷嘴沿着一条涂布线从十字形的中心移动到终点，在端点处转向相反方向，移动到应用程序行对面的终点。然后，喷嘴从终点返回到十字形的中心。喷嘴对每个应用行重复本单元应用程序绘图操作。结果，喷嘴在中心附近停止的频率较低，循环时间缩短，均匀地涂抹。

6. 发明申请

US20120078415A1 PARALLEL LINK ROBOT, AND METHOD OF TEACHING PARALLEL LINK ROBOT 审中-公开
标题翻译：并行链接机器人，以及并行连接机器人的教学方法
公开(公告)号：US20120078415A1
公开(公告)日：2012-03-29
申请号：US13375265
申请日：2011-03-16
申请人： Hiroyasu Kubo , Satoshi Katsuki , Nobuyuki Suefuji
发明人： Hiroyasu Kubo , Satoshi Katsuki , Nobuyuki Suefuji
IPC分类号： B25J9/16 , B25J11/00
CPC分类号： B25J17/0266 , B25J9/1623 , B25J19/0008 , Y10T74/20305
摘要： A parallel link robot (10) allows holding a movable body (13) in midair by connecting a center portion or a peripheral portion of the movable body (13) and a center portion or a peripheral portion of a base (12), using a suspension unit (17) having elasticity such as a constant load spring.
摘要翻译：平行连杆机器人（10）通过将可移动体（13）的中心部分或周边部分与基部（12）的中心部分或周边部分连接起来，允许在空中保持可移动体（13），使用具有诸如恒定负载弹簧的弹性的悬架单元（17）。

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