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    • 2. 发明专利
    • Method of manufacturing photoelectric conversion device
    • 制造光电转换器件的方法
    • JP2012084559A
    • 2012-04-26
    • JP2010226840
    • 2010-10-06
    • Mitsubishi Heavy Ind LtdNational Institute Of Advanced Industrial & Technology三菱重工業株式会社独立行政法人産業技術総合研究所
    • NAKANO SHINYATAKEUCHI YOSHIAKIKONDO MICHIOMATSUI TAKUYA
    • H01L31/04H01L31/042
    • H01L31/202H01L31/03762H01L31/0747H01L31/1804Y02E10/547Y02P70/521
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a photoelectric conversion device capable of improving electric power generation characteristics of a solar cell having a hetero junction cell composed of a p-type crystal Ge (substrate), an i-type amorphous silicon semiconductor layer, and an n-type amorphous silicon semiconductor layer.SOLUTION: A method of manufacturing a photoelectric conversion device 100 having a hetero junction cell 1 including a stack of an i-type amorphous silicon semiconductor layer 12 and an n-type amorphous silicon semiconductor layer 13 on a substrate (p-type crystal Ge) 11 in this order comprises: a PHexposure processing step of heating the substrate 11 from which an oxide film formed on a surface is removed to a predetermined temperature, and then disposing the substrate in a vacuum chamber to expose the substrate to a PHgas; an i-layer deposition step of depositing the i-type amorphous silicon semiconductor layer 12 on the PH-exposed substrate; an n-layer deposition step of depositing the n-type amorphous silicon semiconductor layer 13 on the i-type amorphous silicon semiconductor layer 12; and an electrode formation step of forming electrodes (2, 3, and 4) on the n-type amorphous silicon semiconductor layer and on the rear surface of the substrate 11.
    • 解决的问题:提供一种能够提高具有由p型晶体Ge(基板)构成的异质结电池的太阳能电池的发电特性的i型光电转换装置的制造方法 非晶硅半导体层和n型非晶硅半导体层。 解决方案:一种制造具有异质结单元1的光电转换装置100的方法,该异质结单元1包括在基板上的i型非晶硅半导体层12和n型非晶硅半导体层13的堆叠(p型 晶体Ge)11依次包括:将表面上形成的氧化膜除去到预定温度的基板11进行加热的PH 3 曝光处理步骤,然后 将基板设置在真空室中以使基板暴露于气体; 将i型非晶硅半导体层12沉积在基底上的i层沉积步骤; 在i型非晶硅半导体层12上沉积n型非晶硅半导体层13的n层沉积步骤; 以及在n型非晶硅半导体层和衬底11的后表面上形成电极(2,3和4)的电极形成步骤。(C)2012,JPO&INPIT
    • 9. 发明专利
    • Photoelectric conversion device, and its manufacturing method
    • 光电转换器件及其制造方法
    • JP2009038064A
    • 2009-02-19
    • JP2007198490
    • 2007-07-31
    • Mitsubishi Heavy Ind LtdNational Institute Of Advanced Industrial & Technology三菱重工業株式会社独立行政法人産業技術総合研究所
    • KUREYA MASAYUKIKONDO MICHIOMATSUI TAKUYA
    • H01L31/04
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To provide a photoelectric conversion device having a pin type photoelectric conversion layer using microcrystal silicon germanium for an (i) layer, and a manufacturing method thereof, wherein the deterioration of a power generation characteristic accompanied by an increase in the germanium density of the (i) layer is suppressed. SOLUTION: Disclosed is the manufacturing method of the photoelectric conversion device which has the photoelectric conversion layer formed by forming a pin junction through a stage of forming a layer of a p-type silicon-based semiconductor, a stage of forming a layer of an i-type silicon-based semiconductor, and a stage of forming a layer of an n-type silicon-based semiconductor, wherein the stage of forming the layer of the i-type silicon-based semiconductor is a stage of forming a layer of microcrystal silicon germanium containing ≥50% by atom of germanium by a plasma CVD method at a filming temperature of 100 to 250°C. COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题:提供一种具有针对(i)层使用微晶硅锗的针式光电转换层的光电转换装置及其制造方法,其中伴随着增加的发电特性的劣化 在(i)层的锗密度被抑制。 解决方案:公开了具有通过在形成p型硅基半导体层的阶段形成pin结而形成的光电转换层的光电转换装置的制造方法,形成层 的i型硅系半导体层和形成n型硅系半导体层的阶段,其中形成i型硅系半导体层的阶段是形成层的阶段 通过等离子体CVD法在100〜250℃的成膜温度下含有≥50%的锗原子的微晶硅锗。 版权所有(C)2009,JPO&INPIT