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    • 1. 发明专利
    • Resin sealed semiconductor device, and method of manufacturing the same
    • 树脂密封半导体器件及其制造方法
    • JP2009283478A
    • 2009-12-03
    • JP2008130776
    • 2008-05-19
    • Mitsubishi Electric Corp三菱電機株式会社
    • KAWATO HISASHINAKAGAWA SHINYA
    • H01L23/28
    • H01L2224/0603H01L2224/48137H01L2224/48139H01L2224/48247H01L2224/49111H01L2224/49113H01L2224/49175H01L2924/181H01L2924/1815H01L2924/00H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device whose package is made compact while insulation of a suspension lead is secured, and to provided a method of manufacturing the same. SOLUTION: Semiconductor chips 20 and 22 are mounted on die pads 10 and 12. A lead terminal 16 is disposed apart from the die pad 12. The semiconductor chip 22 and lead terminal 16 are connected by a wire 24. The suspension lead 18 is connected to the die pad 10. The die pads 10 and 12, the semiconductor chips 20 and 22, and a part of the lead terminal 16, the wire 24, and a part of the suspension lead 18 are sealed with mold resin 30. The lead terminal 16 projects outward from a side face of the mold resin 30. A cut 36 is formed on the side face of the mold resin 30. The cut 36 is narrower at an opening-side part 42 than at an inner part 44. The suspension lead 18 projects out of the mold resin 30 from the inner part of the cut 36. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种树脂密封半导体器件,其封装是紧凑的,同时保持悬挂引线的绝缘,并提供其制造方法。 解决方案:半导体芯片20和22安装在芯片焊盘10和12上。引线端子16与芯片焊盘12分开设置。半导体芯片22和引线端子16通过导线24连接。 管芯焊盘10和12,半导体芯片20和22以及引线端子16的一部分,导线24和悬挂引线18的一部分用模制树脂30密封 引线端子16从模制树脂30的侧面向外突出。在模制树脂30的侧面形成切口36.切口36在开口侧部分42处比内部部分44更窄 悬挂引线18从切割部36的内部突出到模制树脂30外。版权所有(C)2010,JPO&INPIT
    • 2. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2008277630A
    • 2008-11-13
    • JP2007121123
    • 2007-05-01
    • Mitsubishi Electric Corp三菱電機株式会社
    • NAKAGAWA SHINYAKAWATO HISASHISANO KOHAYASHI KENICHI
    • H01L23/28
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor device which can shorten a manufacturing time, prevent nozzle clogging upon formation of a coat member, improve the contactness of the coat member, and prevent outside leakage of the coat member. SOLUTION: Sealing resin members 1, 2 have a notch 1a therein obtained by cutting their angular parts, in which one end of a dummy part 3a of a lead 3 and semiconductor elements 5a, 5b are sealed. The other end of the dummy part 3a is exposed. A coat member 4 covers the dummy part 3a exposed from the sealing members 1, 2. The sealing members 1, 2 has a projection 1b which is located within the notch 1a and is positioned between the coat member 4 and a side surface 12a (or 12b, 12c). COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了提供一种可以缩短制造时间的半导体装置,防止在形成涂层部件时喷嘴堵塞,改善涂层部件的接触性,并且防止涂层部件的外部泄漏。 解决方案:密封树脂构件1,2在其中通过切割它们的角部而在其中具有切口1a,其中引线3的虚设部分3a的一端和半导体元件5a,5b被密封。 虚拟部3a的另一端露出。 涂层构件4覆盖从密封构件1,2暴露的虚拟部分3a。密封构件1,2具有位于凹口1a内的凸起1b,位于涂层构件4和侧表面12a之间(或 12b,12c)。 版权所有(C)2009,JPO&INPIT