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    • 2. 发明专利
    • Semiconductor device
    • 半导体器件
    • JP2014138080A
    • 2014-07-28
    • JP2013005945
    • 2013-01-17
    • Mitsubishi Electric Corp三菱電機株式会社
    • IMOTO YUJI
    • H01L23/40F16B5/02F16B39/24F16B43/00
    • PROBLEM TO BE SOLVED: To provide a semiconductor device in which a heat sink is capable of being pressed against and secured to a support substrate in a structure having a collar which is subject to an axial force generated by fastening of a bolt.SOLUTION: A semiconductor device comprises a collar 9. The collar includes a small diameter part 13, a large diameter part 14, and a diaphragm part 15. The large diameter part 14 is cylindrical in shape which is hollow and extends in a vertical direction and has a film thickness t and is formed to have a large diameter part external diameter φL and provided on a heat spreader 6 via an insulator 12. The small diameter part 13 is located above the large diameter part 14 and is cylindrical in shape which is hollow and extends in a vertical direction and is formed to have a small diameter part external diameter φS(φS
    • 要解决的问题:提供一种半导体器件,其中散热器能够被压靠并固定到具有轴承的结构中,所述轴环受到通过紧固螺栓产生的轴向力。结构:A 半导体器件包括一个套环9.该颈圈包括一个小直径部分13,一个大直径部分14和一个隔膜部分15.大直径部分14是圆柱形的,中空的并且在垂直方向上延伸, 厚度t形成为具有大直径部分外径&L并且经由绝缘体12设置在散热器6上。小直径部13位于大直径部14的上方,并且是圆筒形的中空的, 在垂直方向上延伸并且形成为具有小直径部分外径< S& S& L。 隔膜部分15连接大直径部分14的上限和小直径部分13的下限,并且具有膜厚度t并且在水平方向上延伸并且形成为平面视图中的环形形状并且作为 小径部13与大径部14之间的连接部。
    • 3. 发明专利
    • 半導体装置
    • 半导体器件
    • JP2015053318A
    • 2015-03-19
    • JP2013183924
    • 2013-09-05
    • 三菱電機株式会社Mitsubishi Electric Corp
    • NAGAI MIHOIMOTO YUJIUSUI OSAMU
    • H01L23/473H01L23/36
    • H01L23/46F28F3/02H01L23/473H01L2924/0002H01L2924/00
    • 【課題】半導体装置を小型化するとともに、ジャケットの加工性を向上させることが可能な技術を提供することを目的とする。【解決手段】半導体装置は、半導体素子1と、半導体素子1が上面に搭載されたベース板2と、ベース板2の下面に配置された冷却フィン3と、ベース板2の下面に冷却フィン3を囲繞して密閉配置されたジャケット4と、ジャケット4と別体に形成され、ジャケット4内の冷却フィン3の下側においてジャケット4に固定されて、冷却フィン3に冷媒を流すためのヘッダ5および流路6を形成するヘッダ隔壁7とを備えている。【選択図】図1
    • 要解决的问题:为了小型化半导体器件,并提供能够提高护套加工性能的技术。解决方案:半导体器件包括:半导体元件1; 具有安装半导体元件1的上表面的基板2; 设置在基板2的下表面上的冷却片3; 密封并设置在基板2的下表面上的冷却片3周围的护套4; 以及与护套4分开形成并固定在护套4内的冷却翅片3下方的护套4并且形成集管5和用于使制冷剂通过冷却片3的通道6的集管分隔壁7。
    • 5. 发明专利
    • Semiconductor device and manufacturing method of the same
    • 半导体器件及其制造方法
    • JP2013026368A
    • 2013-02-04
    • JP2011158683
    • 2011-07-20
    • Mitsubishi Electric Corp三菱電機株式会社
    • KIKUCHI MASAOIMOTO YUJIYOSHIMATSU NAOKIUSUI OSAMU
    • H01L23/473H05K7/20
    • PROBLEM TO BE SOLVED: To provide a semiconductor device including a cooler which is fixed to a semiconductor package without being deformed during manufacturing processes, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device of this invention includes: multiple cooling pipes 2 having coolant passages therein; semiconductor packages 1, each of which is fixed to one main surface of each cooling pipe 2; seal spacer parts (protruding parts 2a) for stacking the multiple cooling pipes 2 as a shelf like cooling structure, in which the multiple cooling pipes 2 are spaced away from each other, and maintaining the airtightness at end parts of the cooling structure; headers (an inlet side header 3, an outlet side header 4) respectively provided at one end and the other end of the cooling structure and each of which has one opening that is used for taking in/out a coolant to/from the respective cooling pipes 2 and is connected with the seal spacer parts in a hermetic manner.
    • 解决的问题:提供一种包括在制造工艺中固定到半导体封装而不变形的冷却器的半导体器件,并且提供半导体器件的制造方法。 解决方案:本发明的半导体器件包括:多个冷却管2,其中具有冷却剂通道; 半导体封装1,每个固定在每个冷却管2的一个主表面上; 用于将多个冷却管2堆叠为多个冷却管2彼此间隔开的搁架状冷却结构的多个冷却管2的密封隔离部(突出部2a),并且保持冷却结构的端部的气密性; 分别设置在冷却结构的一端和另一端的集管(入口侧集管3,出口侧集管4),并且每个开口具有用于从/从相应的冷却 管道2并以密封方式与密封垫片部分连接。 版权所有(C)2013,JPO&INPIT
    • 6. 发明专利
    • 電力用半導体装置およびその製造方法
    • 功率半导体器件及其制造方法
    • JP2015046476A
    • 2015-03-12
    • JP2013176613
    • 2013-08-28
    • 三菱電機株式会社Mitsubishi Electric Corp
    • FUJINO JUNJIISHIHARA MIKIOIMOTO YUJI
    • H01L25/07H01L25/18
    • H01L2224/0603H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/45624H01L2224/48137H01L2224/48139H01L2224/49111H01L2924/13055H01L2924/181H01L2924/00H01L2924/00012H01L2924/00014
    • 【課題】樹脂パッケージとダイレクトポッティング樹脂の間の樹脂剥離を未然に防止して、高い絶縁耐圧を有する電力用半導体装置を提供する。【解決手段】パワーモジュール1は、ベース板10と、配線パターン層22、24を含み、ベース板10上に固着された絶縁基板20と、表面電極および裏面電極を含み、配線パターン層22上に実装された半導体チップ30、32と、表面電極または配線パターン層22に接続された主端子40と、開口部52を有し、開口部52内において主端子40、絶縁基板20、配線パターン層22、および半導体チップ30、32を包囲する樹脂パッケージ50と、樹脂パッケージ50の開口部52内に充填され、硬化されたダイレクトポッティング樹脂60とを備える。ダイレクトポッティング樹脂60は、少なくとも1つの主端子40が樹脂パッケージ50から突出する領域付近において最も深くなるように成形されている。【選択図】図1
    • 要解决的问题:提供一种防止树脂封装和直接灌封树脂之间的树脂剥离并具有高耐压的功率半导体器件。解决方案:功率模块1包括:基板10; 绝缘基板20,其包括布线图案层22和24,并且被紧固到基板10上; 包括表面电极和背面电极并且安装在布线图案层22上的半导体芯片30和32; 连接到表面电极或布线图案层22的主端子40; 具有开口52并在开口52中包围主端子40,绝缘基板20,布线图案层22和半导体芯片30和32的树脂封装50; 以及直接灌封树脂60,其被填充到树脂包装50的开口52中并固化。 直接灌封树脂60被模制成使得其深度在至少一个主端子40从树脂封装件50突出的区域附近最大。
    • 7. 发明专利
    • Plate laminated type cooling device
    • 板式层压式冷却装置
    • JP2014053442A
    • 2014-03-20
    • JP2012196774
    • 2012-09-07
    • Mitsubishi Electric Corp三菱電機株式会社
    • IKUTA HIROTAKAIMOTO YUJIUSUI OSAMU
    • H01L23/473H05K7/20
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To reduce pressure loss and to suppress corrosion in a plate laminated type cooling device.SOLUTION: A plate laminated type cooling device includes: a metallic bottom plate; a plurality of fin laminates which are fixed to the bottom plate while being separated from each other and each of which is formed by laminating a plurality of fins; and a housing in which the bottom plate and the plurality of fin laminates are housed and a flow inlet and a flow outlet for a coolant are formed. Each of the plurality of fins has a cut-off mark on one side surface on a short side. The plurality of fins are formed by processing both side surfaces on the longitudinal side into a corrugated shape.
    • 要解决的问题:为了减少压片损失并抑制板层压式冷却装置的腐蚀。解决方案:一种板层压式冷却装置,包括:金属底板; 多个翼片叠层体,它们彼此分离地固定在底板上,并且各层叠层叠多个翅片; 以及容纳底板和多个翅片叠片的壳体,并且形成有用于冷却剂的流入口和流出口。 多个翅片中的每一个在短边的一个侧表面上具有切断标记。 多个翅片通过将纵向侧的两个侧表面加工成波纹状而形成。
    • 8. 发明专利
    • Plate laminate type cooling apparatus
    • 板式层压式冷却装置
    • JP2012084731A
    • 2012-04-26
    • JP2010230646
    • 2010-10-13
    • Mitsubishi Electric Corp三菱電機株式会社
    • IKUTA HIRONARINAKADEGUCHI SHINJIKIKUCHI YOSUKEHASHIMO SEIJIIMOTO YUJI
    • H05K7/20H01L23/473
    • PROBLEM TO BE SOLVED: To provide a plate laminate type cooling apparatus with high reliability by reducing the number of components to reduce a brazing failure.SOLUTION: The cooling apparatus comprises: a laminate in which a first heat dissipation plate and a second heat dissipation plate are alternately laminated, and are sandwiched by a pair of end plates; a first joint pipe whose square opening is joined to a first square insertion opening arranged on one side face of the laminate after being inserted into the first square insertion opening; and a second joint pipe whose square opening is joined to a second square insertion opening arranged on the other side face of the laminate after being inserted into the second square insertion opening. In the first heat dissipation plate of the laminate, a first rectangular opening arranged on one end side, a second rectangular opening having a symmetrical shape to the first rectangular opening arranged on the other end side, and a center opening communicating with the first rectangular opening but separated from the second rectangular opening, are opened. The second heat dissipation plate of the laminate has a shape that the first heat dissipation plate is reversed in the longitudinal direction.
    • 要解决的问题:通过减少部件数量以减少钎焊故障来提供具有高可靠性的板层压型冷却装置。 解决方案:冷却装置包括:层叠体,其中第一散热板和第二散热板交替层叠,并被一对端板夹持; 第一连接管,其正方形开口连接到布置在层叠体的一个侧面上的第一方形插入孔之后,插入到第一方形插入口中; 以及第二连接管,其正方形开口连接到布置在所述层叠体的另一侧面上的第二方形插入孔之后,插入到所述第二方形插入口中。 在层叠体的第一散热板中,设置在一端侧的第一矩形开口,与设置在另一端侧的第一矩形开口对称的第二矩形开口,以及与第一矩形开口连通的中心开口 但与第二个矩形开口分开,打开。 层叠体的第二散热板具有第一散热板在长度方向上反转的形状。 版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Plate laminate type cooler
    • 板层压型冷却器
    • JP2013024483A
    • 2013-02-04
    • JP2011159958
    • 2011-07-21
    • Mitsubishi Electric Corp三菱電機株式会社
    • IMOTO YUJIKIKUCHI MASAOFUNAHASHI KAZUO
    • F28F3/12H01L23/473H05K7/20
    • H01L2924/0002H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a plate laminate type cooler for improving manufacturing efficiency and quality stability.SOLUTION: A laminate fin 2 is mounted in a header frame body 1. The laminate fin 2 is composed of laminated plates. A top plate 3 is joined to an upper surface of the laminate fin 2. A step 6 is formed at a peripheral edge of the header frame body 1. The step 6 has an inner wall 7 and a flat surface 8. The top plate 3 is arranged inside an inner wall 7 of the step 6. Brazing material 9 is buried in a gap between the flat surface 8 of the step 6 and a lower surface of the top plate 3 to join the flat surface 8 and the top plate 3. The upper surface of the laminate fin 2 mounted in the header frame body 1 is separated further from a bottom surface of the header frame body 1 than the flat surface 8 of the step 6 of the header frame body 1.
    • 要解决的问题:提供一种用于提高制造效率和质量稳定性的板层压型冷却器。 解决方案:层叠翅片2安装在集管框体1中。层压板2由层叠板构成。 顶板3与层叠翅片2的上表面接合。台阶6形成在集管框体1的周缘部。台阶6具有内壁7和平面8。顶板3 布置在步骤6的内壁7的内部。钎焊材料9被埋在台阶6的平坦表面8和顶板3的下表面之间的间隙中,以将平坦表面8和顶板3接合。 安装在集管框架体1上的层叠散热片2的上表面与集管框体1的底面相比分离框架主体1的台阶6的平坦面8分离。 C)2013,JPO&INPIT