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1. 发明专利

JP2015005559A 半導体装置及びその製造方法有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2015005559A
公开(公告)日：2015-01-08
申请号：JP2013128516
申请日：2013-06-19
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： IWATA NORIYA , HAMAGUCHI TSUNEO , HAYASHI KENICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/73204 , H01L2224/83192 , H01L2924/13055 , H01L2924/00
摘要：【課題】半導体素子の裏面電極に関するはんだ付け工程においてはんだ付け用治具を要しない、半導体装置及びその製造方法を提供する。【解決手段】裏面電極3に超音波振動にて接合した第1はんだ4及び第2はんだ6を有する半導体素子2と、第1はんだを収容する凹部9を有する金属板8とを、第1はんだの一部を凹部に収容して配置する工程と、配置後、第2はんだを溶融させ半導体素子と金属板とをはんだ接合する工程とを有する。【選択図】図1
摘要翻译：要解决的问题：提供一种在关于半导体元件的背面电极的焊接步骤中不需要焊接夹具的半导体器件及其制造方法。解决方案：一种用于制造半导体器件的方法包括以下步骤将第一焊料4的一部分容纳在凹部9中，并且通过超声波振动将包括第一焊料4和第二焊料6的半导体元件2布置在背面电极3上，金属板8具有容纳第一焊料4的第一焊料焊接; 并且熔化第二焊料并在布置它们之后焊接半导体元件和金属板。

2. 发明专利

JP2014175520A Solar battery module and manufacturing method for the same 审中-公开
标题翻译：太阳能电池模块及其制造方法
公开(公告)号：JP2014175520A
公开(公告)日：2014-09-22
申请号：JP2013047889
申请日：2013-03-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANAKA YOSHIMI , HAMAGUCHI TSUNEO
IPC分类号： H01L31/05
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To obtain a structure of a solar battery module for preventing short-cut and breaking of wire caused by wiring material contacting with an end face of a solar battery cell.SOLUTION: A solar battery module comprises: a plurality of solar battery cells 1, each of which has a front face electrode 2a on the light-receiving face side and a back face electrode 2b on the back face side; and wiring material 4 for reciprocally connecting the front face electrode 2a and a back face electrode 2b of an adjacent solar battery cell 1. Thermosetting resin 3 is arranged in a region sandwiched between an end part of the light-receiving face 1a side of the solar battery cell 1 and the wiring material 4, and a region sandwiched between an end part of the back face 1b side and the wiring material 4. Thereby, a manufacturing yield of the solar battery module can be improved.
摘要翻译：要解决的问题：获得用于防止由与太阳能电池单元的端面接触的布线材料引起的线的短路和断线的太阳能电池模块的结构。解决方案：太阳能电池模块包括：多个太阳能电池单元1，其在受光面侧具有正面电极2a和背面侧的背面电极2b; 以及用于使相邻的太阳能电池单元1的正面电极2a和背面电极2b往复连接的配线材料4.热固性树脂3配置在夹在太阳能的受光面1a侧的端部之间的区域电池单元1和布线材料4以及夹在背面1b侧的端部与布线材料4之间的区域。由此，可以提高太阳能电池模块的制造成品率。

3. 发明专利

JP2013247219A Method of manufacturing solar battery cell 审中-公开
标题翻译：制造太阳能电池的方法
公开(公告)号：JP2013247219A
公开(公告)日：2013-12-09
申请号：JP2012119638
申请日：2012-05-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KUSAKABE YOSHIHIKO , HAMAGUCHI TSUNEO , KANO SHINTARO , YABUGAKI YOSHIMI
IPC分类号： H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a solar battery cell capable of manufacturing a solar battery which improves connection resistance between a collector and a transparent conductive film and is excellent in output characteristics.SOLUTION: There is provided a method of manufacturing a solar battery cell comprising a step of forming a collector on a part of a transparent conductive film after forming the transparent conductive film on a semiconductor layer. The method comprises a heat-treatment step of performing heat treatment on the solar battery cell by making a temperature of the semiconductor layer and the transparent conductive film lower than a temperature of the collector after forming the collector on the transparent conductive film or during formation of the collector.
摘要翻译：要解决的问题：提供一种制造太阳能电池的方法，所述太阳能电池单元能够制造太阳能电池，其提高集电体和透明导电膜之间的连接电阻，并且输出特性优异。解决方案：提供一种制造太阳能电池单元包括在半导体层上形成透明导电膜之后在透明导电膜的一部分上形成集电体的步骤。该方法包括：通过使半导体层和透明导电膜的温度比形成集电体的温度低于透明导电膜上的集电体的温度，或者在形成之前，对太阳能电池单元进行热处理的热处理步骤收藏者。

4. 发明专利

JP2010260093A Laser soldering apparatus and laser soldering method 有权
标题翻译：激光焊接设备和激光焊接方法
公开(公告)号：JP2010260093A
公开(公告)日：2010-11-18
申请号：JP2009114232
申请日：2009-05-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRASE TAKASHI , SUGIURA SEI , IWATA MASAKI , HAMAGUCHI TSUNEO
IPC分类号： B23K1/005 , B23K1/00 , B23K26/00 , B23K26/32 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To accurately measure the electrode temperature of a printed circuit board without being affected by a laser beam. SOLUTION: The laser soldering apparatus is characterized in that it includes: an infrared sensor for measuring temperature; a laser oscillator for heating; a laser emission head by which a laser beam outputted from the laser oscillator is converged on a workpiece to be soldered; and a controller which controls an output of the laser oscillator based on the measurement of the infrared sensor, wherein the wavelength of the infrared sensor is 1.5-2.5 μm and the wavelength of the laser beam is COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：精确地测量印刷电路板的电极温度而不受激光束的影响。
解决方案：激光焊接装置的特征在于它包括：用于测量温度的红外传感器; 用于加热的激光振荡器; 从激光振荡器输出的激光束会聚在待焊接的工件上的激光发射头; 以及控制器，其基于所述红外线传感器的测量来控制所述激光振荡器的输出，其中所述红外传感器的波长为1.5-2.5μm，并且所述激光束的波长为<1μm。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2009224500A Sliding portable electronic apparatus 审中-公开
标题翻译：滑动便携式电子设备
公开(公告)号：JP2009224500A
公开(公告)日：2009-10-01
申请号：JP2008066351
申请日：2008-03-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANIGUCHI TOMOYUKI , HAMAGUCHI TSUNEO , YOSHIOKA KENGO
IPC分类号： H05K7/14 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To provide a sliding portable electric apparatus having a highly reliable flexible wiring board, by preventing the flexible wiring board from rubbing during a sliding movement.
SOLUTION: The first case body 2 and the second case body 3 slidably move in a mutual and relative manner. The flexible wiring board 1 has one end 1a, attached to the first case body 2 and the other end 1b attached to the second case body 3, and is arranged so as to be partially bent between the first and second case bodies 2, 3. A cut 13, extending from one end 1a to the other end 1b, is formed at least in non-bending parts 11, other than a part where the flexible wiring board 1 is bent, when the first and second case bodies 2, 3 are made to move mutually by sliding.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：通过防止柔性布线板在滑动运动期间摩擦，提供具有高度可靠的柔性布线板的滑动式便携式电气设备。解决方案：第一壳体2和第二壳体3以相互和相对的方式可滑动地移动。柔性布线板1具有安装在第一壳体2上的一端1a和安装在第二壳体3上的另一端1b，并且被布置成在第一和第二壳体2,3之间部分弯曲。至少在柔性布线板1弯曲的部分以外的非弯曲部11中形成有从一端1a延伸到另一端1b的切口13，当第一和第二壳体2,3为通过滑动相互移动。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2006253569A Flexible wiring board and semiconductor device using the same 审中-公开
标题翻译：柔性布线板及使用其的半导体器件
公开(公告)号：JP2006253569A
公开(公告)日：2006-09-21
申请号：JP2005070959
申请日：2005-03-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , ARIGA HIROSHI , KONDO TERUHIRO , SUGIDACHI ATSUSHI
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board wherein soldering connection can be applied to its wires in a way of preventing their adjacent wires from being short-circuited even when pitches of a wiring pattern are minute, thereby downsizing a semiconductor device.
SOLUTION: The flexible wiring board 1 soldered to electric components or a wiring board is provided, wherein soldering connection terminals 21 of the flexible wiring board 1 are formed on one side of its insulation film 3; and conductor members 22 are provided on a side (a second side of the insulation film) opposite to the side of the insulation film 3 (a first side of the insulation film), on which the connection terminals 21 are provided along the connection terminals 21 in a way opposite to the connection terminals 21 such that the insulation film 3 is sandwiched between the conductor members 3 and the connection terminals 21.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供柔性布线板，其中即使在布线图案的间距很小的情况下，也可以以防止其相邻布线短路的方式将焊接连接施加于其布线，从而使半导体设备。解决方案：提供焊接到电气部件或布线板的柔性布线板1，其中柔性布线板1的焊接连接端子21形成在其绝缘膜3的一侧上; 并且导体构件22设置在与绝缘膜3的一侧（绝缘膜的第一侧）相对的一侧（绝缘膜的第二侧）上，连接端子21沿着连接端子21设置以连接端子21相对的方式使得绝缘膜3夹在导体构件3和连接端子21之间。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006203110A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006203110A
公开(公告)日：2006-08-03
申请号：JP2005015305
申请日：2005-01-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , ISHIZAKI MITSUNORI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/1627 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which has a laminated structure, prevents degradation in propagation speed of an electric signal, and can have substrates peeled off each other even after being laminated. SOLUTION: The semiconductor device 1 is constituted by laminating element semiconductor devices 1a to 1c having wiring boards mounted with semiconductor chips. The laminated element semiconductor devices are electrically connected to another through-conductors 11. Resin layer 12 are formed at least at peripheries of conductors 11 between the laminated element semiconductor devices. The resin layers 12 are formed of total aromatic polyester resin. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了提供具有层叠结构的半导体器件，防止电信号的传播速度的劣化，并且即使在层压之后也可以使基板彼此剥离。解决方案：半导体器件1由层叠具有安装有半导体芯片的布线板的元件半导体器件1a至1c构成。层压元件半导体器件电连接到另一个贯通导体11.树脂层12至少形成在层叠元件半导体器件之间的导体11的周边。树脂层12由全芳族聚酯树脂形成。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005260436A Imaging module and imaging apparatus employing it 审中-公开
标题翻译：成像模块和成像设备使用它
公开(公告)号：JP2005260436A
公开(公告)日：2005-09-22
申请号：JP2004067165
申请日：2004-03-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TOYOSHIMA TOSHIYUKI , HAMAGUCHI TSUNEO , TAKEDA MUNEHISA , YOKOYAMA YOSHINORI , SAKAMOTO HIROO
IPC分类号： H01L27/14 , H04N5/335 , H04N5/369
摘要： PROBLEM TO BE SOLVED: To obtain an imaging module in which performance is enhanced while reducing the size and thickness.
SOLUTION: A concave curved part 41 is provided in a base substrate 4 and the curved part 41 is curved in correspondence with curvature of an image plane caused by aberration of the lens module in an imaging apparatus. The base substrate 4 is provided with a shock absorbing material film 2 which is curved along the shape at the curved part of the base substrate 4, and an imaging element 1 is provided on the shock absorbing material film 2 while bending its imaging plane according to the shape at the curved part. The shock absorbing material film 2 relaxes effect of difference in thermal expansion coefficient between the base substrate 4 and the imaging element 1 due to temperature rise on the imaging element 1. Upper and lower surfaces of the shock absorbing material film 2 also bend along the shape at the curved part, and both the imaging element 1 and the shock absorbing material film 2 are layered while keeping the curved shape similar to that at the curved part of the base substrate 4.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：获得在减小尺寸和厚度的同时增强性能的成像模块。解决方案：凹形弯曲部分41设置在基底基板4中，并且弯曲部分41对应于由成像装置中的透镜模块的像差引起的图像平面的曲率而弯曲。基底基板4设置有沿着基底基板4的弯曲部分的形状弯曲的吸震材料膜2，并且在冲击吸收材料膜2上弯曲其成像平面的成像元件1根据弯曲部位的形状。冲击吸收材料膜2由于成像元件1的温度升高而放松了基底基板4与成像元件1之间的热膨胀系数的差异的影响。冲击吸收材料膜2的上表面和下表面也沿着形状弯曲在弯曲部分，并且成像元件1和减震材料膜2都被层叠，同时保持与基底基板4的弯曲部分处的弯曲形状类似的弯曲形状。（C）2005年，JPO和NCIPI

9. 发明专利

JP2013225623A Photovoltaic power generation module 审中-公开
标题翻译：光伏发电模块
公开(公告)号：JP2013225623A
公开(公告)日：2013-10-31
申请号：JP2012097918
申请日：2012-04-23
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YABUGAKI YOSHIMI , HAMAGUCHI TSUNEO , MIYAMOTO SHINSUKE
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a photovoltaic power generation module capable of improving connection reliability between a wiring material and a bus electrode in a structure in which the wiring material and the bus electrode are electrically connected, using resin adhesive.SOLUTION: The photovoltaic power generation module includes a solar cell element having a substrate and a bus electrode disposed on the substrate, and a wiring material electrically connected with the bus electrode through resin adhesive. The bus electrode extends while zigzagging along a surface of the substrate with a narrower width than that of the wiring material within a region in which the wiring material should be connected.
摘要翻译：要解决的问题：提供一种能够在布线材料和总线电极电连接的结构中使布线材料和总线电极之间的连接可靠性提高的光伏发电模块，使用树脂粘合剂。解决方案：光伏功率发电模块包括具有衬底和布置在衬底上的总线电极的太阳能电池元件和通过树脂粘合剂与总线电极电连接的布线材料。总线电极沿着衬底的表面以相对于配线材料应连接的区域内的布线材料的宽度窄的方式延伸。

10. 发明专利

JP2013152979A Solar cell module and manufacturing method therefor 有权
标题翻译：太阳能电池模块及其制造方法
公开(公告)号：JP2013152979A
公开(公告)日：2013-08-08
申请号：JP2012011837
申请日：2012-01-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , YABUGAKI YOSHIMI , NONOGAKI MITSUHIRO , MIYAMOTO SHINSUKE
IPC分类号： H01L31/042 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a low cost solar cell module having a high conversion efficiency in which a wiring material and a thin line electrode can attain a sufficient mechanical bonding strength, and warpage of a solar cell element is reduced, and to provide a manufacturing method therefor.SOLUTION: A solar cell module 100 includes a solar cell element 1, a plurality of thin line electrodes 2a formed on the light-receiving surface 1a of the solar cell element 1, a back electrode formed on the rear surface 1b of the solar cell element 1, and a wiring material 5 for taking out power from the thin line electrodes 2a and the back electrode. A reinforcement electrode 6 wider than the thin line electrodes 2a is provided at an end of the light-receiving surface 1a. The reinforcement electrode 6 and the thin line electrodes 2a are joined to the wiring material 5 using a solder 3. Both sides of the solder joint are covered with a thermosetting resin 4, and a part of the light-receiving surface 1a, not provided with the reinforcement electrode 6 and the thin line electrodes 2a, and the wiring material 5 are bonded by the thermosetting resin 4.
摘要翻译：要解决的问题：为了提供具有高转换效率的低成本太阳能电池模块，其中布线材料和细线电极可以获得足够的机械结合强度，并且太阳能电池元件的翘曲减小，并且提供太阳能电池模块100包括太阳能电池元件1，形成在太阳能电池元件1的受光面1a上的多条细线电极2a，形成在太阳能电池元件1的背面1b上的背面电极太阳能电池元件1和用于从细线电极2a和背面电极取出电力的布线材料5。在光接收表面1a的一端设有比细线电极2a宽的加强电极6。加强电极6和细线电极2a使用焊料3接合到布线材料5.焊接接头的两侧被热固性树脂4覆盖，并且光接收表面1a的一部分没有加强电极6和细线电极2a以及布线材料5通过热固性树脂4接合。

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