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1. 发明专利

JP2014146847A Soldering apparatus and soldering method 有权
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2014146847A
公开(公告)日：2014-08-14
申请号：JP2014106009
申请日：2014-05-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IWATA NORIYA , ABE HAJIME , IDETA GORO , ARAI HITOSHI , YAMASHITA HIROYOSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which effectively remove an air layer near a connection part between a printed circuit board and an electronic component and make solder oxide and the like less likely to adhere to a jetting port.SOLUTION: A soldering apparatus 1 places melting solder 2 jetted from a jetting port 3 in contact with a printed circuit board 15 to thereby soldering, and has a solder tank 4 and a spiral flow generation member 20. The solder tank 4 has the jetting port 3 and is used for accumulating the melting solder 2. The spiral flow generation member 20 is formed so as to generate spiral flow in the melting solder 2 jetted from the jetting port 3 of the solder tank 4.
摘要翻译：要解决的问题：提供一种有效地去除印刷电路板和电子部件之间的连接部分附近的空气层的焊接装置和焊接方法，并且使焊料氧化物等不太可能粘附到喷射口。：焊接装置1将从喷射口3喷射的熔融焊料2与印刷电路板15接触，从而进行焊接，并且具有焊料槽4和螺旋流产生部件20.焊料槽4具有喷射口3 并且用于积聚熔化焊料2.螺旋流产生件20形成为在从焊料槽4的喷射口3喷射的熔化焊料2中产生螺旋流。

2. 发明专利

JP2013110361A Soldering apparatus and soldering method 审中-公开
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2013110361A
公开(公告)日：2013-06-06
申请号：JP2011256409
申请日：2011-11-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IWATA NORIYA , ABE HAJIME , IDETA GORO , ARAI HITOSHI , YAMASHITA HIROYOSHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which effectively remove an air layer near a connection part between a printed circuit board and an electronic component and make solder oxide and the like less likely to adhere to a jetting port.SOLUTION: A soldering apparatus 1 places melting solder 2 jetted from a jetting port 3 in contact with a printed circuit board 15 to thereby soldering, and has a solder tank 4 and a spiral flow generation member 20. The solder tank 4 has the jetting port 3 and is used for accumulating the melting solder 2. The spiral flow generation member 20 is formed so as to generate spiral flow in the melting solder 2 jetted from the jetting port 3 of the solder tank 4.
摘要翻译：要解决的问题：提供一种焊接装置和焊接方法，其有效地去除印刷电路板和电子部件之间的连接部分附近的空气层，并且使焊料氧化物等不太可能粘附到喷射港口。焊接装置1将从喷射口3喷射的熔融焊料2与印刷电路板15接触，从而进行焊接，并具有焊料槽4和螺旋流产生部件20.焊料槽4具有喷射口3并用于积聚熔化焊料2.螺旋流产生件20形成为在从焊料槽4的喷射口3喷射的熔化焊料2中产生螺旋流。版权所有：（C）2013，JPO＆INPIT

3. 发明专利

JP2015005559A 半導体装置及びその製造方法有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2015005559A
公开(公告)日：2015-01-08
申请号：JP2013128516
申请日：2013-06-19
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： IWATA NORIYA , HAMAGUCHI TSUNEO , HAYASHI KENICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/73204 , H01L2224/83192 , H01L2924/13055 , H01L2924/00
摘要：【課題】半導体素子の裏面電極に関するはんだ付け工程においてはんだ付け用治具を要しない、半導体装置及びその製造方法を提供する。【解決手段】裏面電極3に超音波振動にて接合した第1はんだ4及び第2はんだ6を有する半導体素子2と、第1はんだを収容する凹部9を有する金属板8とを、第1はんだの一部を凹部に収容して配置する工程と、配置後、第2はんだを溶融させ半導体素子と金属板とをはんだ接合する工程とを有する。【選択図】図1
摘要翻译：要解决的问题：提供一种在关于半导体元件的背面电极的焊接步骤中不需要焊接夹具的半导体器件及其制造方法。解决方案：一种用于制造半导体器件的方法包括以下步骤将第一焊料4的一部分容纳在凹部9中，并且通过超声波振动将包括第一焊料4和第二焊料6的半导体元件2布置在背面电极3上，金属板8具有容纳第一焊料4的第一焊料焊接; 并且熔化第二焊料并在布置它们之后焊接半导体元件和金属板。

4. 发明专利

JP2013149654A Jet nozzle, soldering apparatus, and soldering method 审中-公开
标题翻译：喷嘴，焊接设备和焊接方法
公开(公告)号：JP2013149654A
公开(公告)日：2013-08-01
申请号：JP2012006952
申请日：2012-01-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IWATA NORIYA , ARAI HITOSHI , ABE HAJIME , SATO KOHEI , TANABE TAKESHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a jet nozzle, a soldering apparatus, and a soldering method which control a separation angle of molten solder for each electronic component mounted on a printed board.SOLUTION: A jet nozzle 1 jets molten solder 4 and places the molten solder 4 in contact with a soldered part 3a of a printed board 3. The jet nozzle 1 includes a nozzle part 11 having an opening 12 for jetting the molten solder 4 and opening shape change means that changes a shape of the opening 12 of the nozzle part 11. The opening shape change means changes the shape of the opening 12 of the nozzle part 11 thereby partially changing a height of a liquid surface of the molten solder 4 jetted from the opening 12 in a region A above the nozzle part 11 and separating the molten solder 4, jetted in a state that the printed board 3 does not move, from the soldered part 3a of the printed board 3.
摘要翻译：要解决的问题：提供一种喷射喷嘴，焊接装置和焊接方法，其控制安装在印刷电路板上的每个电子部件的熔融焊料的分离角度。解决方案：喷嘴1喷射熔融焊料4，并将熔融焊料4与印刷电路板3的焊接部分3a接触。喷嘴1包括具有用于喷射熔融焊料4的开口12的喷嘴部分11和改变熔融焊料4的开口12的形状的开口形状改变装置开口形状改变装置改变喷嘴部分11的开口12的形状，从而部分地改变在喷嘴部分11上方的区域A中从开口12喷射的熔融焊料4的液面的高度，以及将印刷基板3不移动的状态喷出的熔融焊料4从印刷基板3的焊接部分3a分离。

5. 发明专利

JP2013153031A Soldering nozzle and soldering apparatus including the same 审中-公开
标题翻译：焊接喷嘴和焊接设备，包括它们
公开(公告)号：JP2013153031A
公开(公告)日：2013-08-08
申请号：JP2012012692
申请日：2012-01-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UCHIDA YOSHIHISA , IDETA GORO , TANABE TAKESHI , IWATA NORIYA
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering nozzle which prevents defects of non-soldered areas in jet soldering thereby obtaining a printed circuit board which is stable and achieves high reliability, and to provide a soldering apparatus.SOLUTION: In a soldering apparatus 1, a soldering nozzle 4 for jetting molten solder 3 accumulated in a solder tank 2 and a propeller 11 for transferring the molten solder 3 by pressure are provided. The soldering nozzle 4 is composed of a nozzle body 5 and a nozzle support body 8. The nozzle body 5 is formed by an outer wall part 6 and an inner wall part 7. The inner wall part 7 may be removed from the outer wall part 6 for replacement. A cylindrical inner wall part 7a, in which a jet port 77a having a small diameter is formed, is used as the inner wall part 7. The inner wall part 7, 7a are made of iron that is an example of a metal having high wettability to solder.
摘要翻译：要解决的问题：提供一种防止喷射焊接中的非焊接区域的缺陷的焊接喷嘴，从而获得稳定的并且实现高可靠性的印刷电路板，并提供焊接装置。解决方案：在焊接装置1中，提供了用于喷射积聚在焊料槽2中的熔融焊料3的焊接喷嘴4和用于通过压力传送熔融焊料3的螺旋桨11。焊嘴4由喷嘴体5和喷嘴支撑体8构成。喷嘴体5由外壁部6和内壁部7形成。内壁部7可以从外壁部 6代替。作为内壁部7，使用形成有直径较小的喷口77a的圆筒状内壁部7a。内壁部7,7a由作为具有高润湿性的金属的一例的铁制成焊接

6. 发明专利

JP2013153001A Soldering apparatus and soldering method 审中-公开
标题翻译：焊接设备和焊接方法
公开(公告)号：JP2013153001A
公开(公告)日：2013-08-08
申请号：JP2012012006
申请日：2012-01-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIGETA KOJI , SATO KOHEI , IWATA NORIYA , TANABE TAKESHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K31/02
摘要： PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which stabilize the solder adhesion amount.SOLUTION: A soldering apparatus is used for transferring a printed circuit board 1 to jetted molten solder 2 and immersing the printed circuit board 1 in the molten solder 2 and includes: a jet nozzle 11 having an upper end part defined by a plate member 15 vertically extending and jetting the molten solder 2 so that the molten solder 2 contacts with one surface 15a of the plate member 15; a duct 12 disposed in a transfer direction TD of the printed circuit board 1 relative to the jet nozzle 11, the duct 12 in which the molten solder 2 flows down while contacting with the other surface 15b of the plate member 15; and an inactive gas supply nozzle 13 that is disposed in the transfer direction TD of the printed circuit board 1 relative to the duct 12 and may supply an inactive gas G to the printed circuit board 1.
摘要翻译：要解决的问题：提供稳定焊料附着量的焊接装置和焊接方法。解决方案：使用焊接装置将印刷电路板1转印到喷射熔融焊料2并将印刷电路板1浸入熔融焊料2，包括：喷嘴11，其具有由板构件15限定的上端部，其垂直延伸并喷射熔融焊料2，使得熔融焊料2与板构件15的一个表面15a接触; 布置在印刷电路板1相对于喷嘴11的传送方向TD上的管道12，熔融焊料2在与板件15的另一个表面15b接触的同时流下的管道12; 以及相对于导管12配置在印刷电路板1的传送方向TD上的非活性气体供给喷嘴13，并且可以向印刷电路板1供给惰性气体G.

7. 发明专利

JP2013149653A Soldering method, soldering device, and printed wiring board 审中-公开
标题翻译：焊接方法，焊接装置和印刷电路板
公开(公告)号：JP2013149653A
公开(公告)日：2013-08-01
申请号：JP2012006948
申请日：2012-01-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANABE TAKESHI , IWATA NORIYA , IDETA GORO , ARAI HITOSHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K1/20 , B23K3/00 , B23K3/06 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering method capable of suppressing a non-soldering defect in an easy method, a soldering device, and a printed wiring board soldered by the soldering method.SOLUTION: In a soldering method, a printed wiring board 1 having a soldering object part 1a is dipped in molten solder 2, the soldering method including a process of sticking flux 8 and metal powder 9 on the soldering object part 1a of the printed wiring board 1 and its peripheral part, and a process of melting the metal powder 9 by dipping the soldering object part 1a of the printed wiring board 1 having the flux 8 and metal powder 9 stuck and its periphery in the molten solder 2.
摘要翻译：要解决的问题：提供一种能够通过焊接方法焊接的容易的方法，焊接装置和印刷线路板来抑制非焊接缺陷的焊接方法。解决方案：在焊接方法中，印刷线路板1 将焊接对象部分1a浸渍在熔融焊料2中，焊接方法包括将焊剂8和金属粉末9粘附在印刷线路板1的焊接对象部分1a及其周边部分上的工艺，通过将具有助焊剂8和金属粉末9的印刷电路板1的焊接对象部分1a浸渍在熔融焊料2中而将其周边浸渍在金属粉末9中。

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